ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation

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ITRS Factory IntegrationTechnology Working Group
(FITWG)Industry Presentation

• 18 July 2001
• Michio Honma, NEC
• Jeff Pettinato, Intel

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Agenda

• Scope and Factory Drivers
• Difficult Challenges
• Key Technology Requirements
• Integrated Potential Solutions
• Process Control
• Agile Manufacturing
• Material Handling
• Summary

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Factory Integration GroupRegional Representatives

• Europe
• Klaus Eberhardt
• Richard Oechsner
• Claus Schneider
• Taiwan
• Hugo Chang
• JJ Hsu

• Japan
• Michio Honma
• Shoichi Kodama
• Toshi Uchino
• Hiromi Yajima
• US
• Court Skinner
• Jeff Pettinato

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Factory Integration Contributing Members
Many International members have contributed to FI
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2001 Factory Integration Scope IncludesWafer,
Chip and Product Manufacturing
The Factory
Wafer Mfg.
Chip Mfg.
Product Mfg.
Si Substrate Mfg.
Distribution

• FEOL
• BEOL

• Probe/Test
• Singulation

• Packaging
• Test

• The Factory is driven by Cost and Productivity
• Reduce factory capital and operating costs per
  function
• Enable efficient high-volume production with
  operational models for varying product mixes
  (high to low) and other business strategies
• Increase factory and equipment reuse,
  reliability, and overall efficiency
• Quickly enable process technology shrinks and
  wafer size changes

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2001 Difficult Challenges
lt 65nm after 2007
gt 65nm through 2007

• Managing Complexity
• Quickly and effectively integrating rapid changes
  in semiconductor technologies and market
  conditions
• Factory Optimization
• Productivity increases are not keeping pace with
  needs
• Flexibility, Extendibility, Scalability
• Ability to quickly convert to new semiconductor
  technologies while reusing equipment, facilities,
  and skills

• Post CMOS Manufacturing Uncertainty
• Inability to predict factory requirements
  associated with post CMOS novel devices
• 450mm Wafer Size Conversion
• Timing and manufacturing paradigm for this wafer
  size conversion

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All factory areas must be integrated to solve
these Difficult Challenges
Factory Areas or Thrusts
Includes Wafer, Chip, and Product Manufacturing
Technology Requirements and Potential Solutions
are expressed through these factory areas
Factory Operations
Facilities
Material Handling
Production Equipment
Factory Information and Control Systems
Examples Building, cleanroom, utility systems,
process fluid delivery
Examples AMHS Transport, storage, ID Systems,
interface standards
Example Equipment unit, real-time process
control, interface standards, Embedded Control
Example Manufacturing rules, production size, mix
Example MES, Computers, Networks, Process Control
Rapid changes to business needs demands
Increasing process product complexity Larger
wafers and carriers, Increased reliance on
factory information control systems
Complexity Management
Increased customer expectation to meet on time
delivery Increased urgency for improved factory
effectiveness, High factory yield at startup
Reduce wafer and product cost Satisfy all local
regulations
Factory Optimization
Difficult Challenges gt65nm thu 2007
Extendibility, Flexibility, Scalability
Reuse of building, production equipment, and
factory information and control systems Factory
designs that support rapid process and technology
changes/retrofits Comprehend tighter ESH/Code
requirements
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Key Technology Requirements and Issues

• 1. Production equipment is not keeping up with
  Overall Equipment Efficiency (OEE) and
  Availability targets
• Ex. 2001 OEE target of 83 vs. actual of 65 for
  bottleneck equipment
• 2. Process technology advances are occurring at
  ever faster rates factories are expected to ramp
  and meet yield targets more quickly
• New equipment for 157nm litho, High K gate stack,
  Low k dielectrics, SOI, copper will be
  implemented in factories over the next 2-5 years
• 3. A 45 reduction in manufacturing cycle times
  by 2007 is expected for high volume high mix
  factories
• 4. Direct transport systems capability must be
  ready for beta tests during 2002 and HVM
  implementation by 2004
• 5. Time required to a) build/ramp new factories,
  or b) convert/ramp existing factories to new
  technologies must improve 30 by 2007
• 6. 300mm software standards compliance is not
  meeting single wafer processing and intrabay AMHS
  needs

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Integrated Solutions are Essential to Meet Needs

• Integrated Solutions
• Agile Manufacturing
• - Equipment Engineering Systems - EES
• - Single wafer control
• - e-Diagnostics
• Process Control
• - Fault Detection Capabilities
• - Feedback Feed forward Process Control
• - Machine to machine matching
• Material Handling
• - Direct Transport AMHS
• - AMHS for Send-Ahead wafers
• - Integrated Sorters, Stockers, Metrology

• Technology Requirements
• New disruptive process technologies
• 157nm litho
• High K gate stack
• Low k dielectrics
• Copper processing
• Improved Productivity
• Decreased Factory Cycle Time (QTAT)
• Improved Equipment Efficiency
• Reduction in non-product (I.e. test) wafer
  usage
• More efficient direct labor
• Faster factory conversion at technology nodes

Integrated Factory
Goal Meet Factory Challenges and Technology
Requirements
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Process Control Potential SolutionsType 1 Fault
Detection and Classification

• Inside the Tool
• FDC Models defined / configured
• FDC host signals configured
• FDC actions may be configured

• Outside of Tool
• Host determines actions based on type of fault
• Host issues control command

Fast FDC Module
GEM Interface
Host System
FDC Signal / Data
External FDC Module
FDC Control

• Potential Solutions Needs Include
• Real-time process sensors on process equipment
• Reporting of real-time data to host system
• Ability to stop processing at various intervals
  via host command
• Factory Software systems capabilities to manage
  areas and groups of equipment
• Software I/F Standards

• Technology Requirement Drivers
• Overall Equipment Efficiency
• Equipment Availability
• Yield Particle Densities

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Process Control Potential SolutionsType 2 Run
to Run Control
MES (Equipment Control)
Run to Run Control S/W Models
Feed Forward and Feedback Control - Use
preprocess or post metrology data to adjust
processing for that lot
Recipe Recommendations
Factory Network
EE Network
Detailed wafer and chamber data required
Recipe Adjustment Control
GEM
GEM
EE
EE
EE
GEM
Step N
Step N1
Metrology data pipeline
Step N-1
Parameterized recipes required
UI
Process Equipment

• Technology Requirement Drivers
• Overall Equipment Efficiency
• Optimize Process Performance (for example)
• Litho Gate CD control (nm)
• Litho Overlay Control (nm)
• Diffusion Oxide thickness

• Potential Solutions Needs Include
• Reporting of metro data to host system
• Ability to adjust key recipe parameters at
  various intervals via host command
• Relationship between end process results and
  adjustable process parameters
• Open software interfaces and standards

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Process Control Potential SolutionsType 3
Integrated Metrology
Factory Network
EE Network
GEM
Metrology data and detailed wafer and chamber data
Host System
Recipe and Model Selection via remote interface
EE
Equip Controller
EES
Parameterized recipes required
UI
Integrated Metrology Module (not Bolt on)
Integrated Process and Metro Equip.

• Potential Solutions Needs Include
• Hardware integration of process and metrology
  equipment
• Software integration of metrology and process
  equipment
• Single SECS/GEM interface for integrated
  metrology and process equipment
• No increase in process equipment footprint
• No degradation in equipment run rate or
  availability

• Technology Requirement Drivers
• Factory Cycle Time per Mask Layer
• Interbay AMHS throughput
• Intrabay AMHS throughput

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Agile Manufacturing Means

• Quick turn around faster cycle time for
  production
• Quick turn around time without productivity
  deterioration
• No productivity reduction even if many lots
  production formed with few wafers
• Quick capability to product, scale and technology
  change
• Quick ramp-up of equipment installation and
  product
• Assure high productivity even if low production
  volume

to Satisfy these Requirements

• Speed
• Product short ramp-up time
• Equipment short ramp-up time
• Product Quick Turn Around Time (QTAT)

• Cost
• Equipment high OEE
• Product yield high at ramp-up

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Key Potential Solutions

• Full Automation
• Equipment Engineering System
• Fundamental technology
• Single Wafer Control
• Multiple lots/single wafer control in equipment
  module (group)
• Process Control
• Fault Detection and Classification
• Run to Run
• Integrated Metrology
• Direct Transportation
• Real Time Scheduling (RTS)
• Supply Chain Management (SCM)

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What will Equipment EngineeringSystems (EES)
replace?
New!
Manufacturing Execution System
Equipment Engineering System
MES
MCS
MES
FAX and telephone be replaced by Internet
No more operator this side
Suppliers
e-Diag Capability
Operators still watch the tool to confirm its
health status and do miscellaneous things
AMHS
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e-Manufacturing Hierarchy
Company to Company (E-Commerce)
Suppliers
Company A
Company B
Factory to Factory (E-Factory)
e-diagnostics capability
firewall
Factory A
Factory B
Within a Factory (E-Factory)
Manufacturing Execution System - MES
EES
Equipment Engineering System
Equipment/AMHS
Ethernet
Station Controller
Material Control System - MCS
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The e-Business structure for manufacturing
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Carrier Level integrated Flow and Control Type
1 Sorter and Metrology with Stockers

• When Solutions Are Needed
• Research Required by 2001
• Development Underway by 2002
• Qualification/Production by 2003

• Potential Solutions Require
• Standardized Intrabay Operation
• Integrated Software

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Wafer Level Integrated Flow and ControlType 2
Connected EFEM
Equipment Supplier A
Equipment Supplier C
Equipment Supplier B
Wafer Staging
Carrier Staging

• Potential Solutions Require
• I/F Standard (H/W, S/W)
• Standardized EFEM
• Software
• Integrated
• Wafer level APC
• Standardized Intrabay Operation

• When Solutions Are Needed
• Research Required by 2002
• Development Underway by 2004
• Qualification/Production by 2005

Conceptual Only
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Wafer Level Integrated Flow and ControlType 3
Expanded EFEM
Standard Tool Widths

• Potential Solutions Require
• System controller of Equipment Group
• Wafer Dispatcher
• Module structure of equipment
• Standardized I/F
• Standardized Width
• Modular Process Steps
• High Speed Wafer Transfer
• Standardized Intrabay Operation

• When Solutions Are Needed
• Research Required by 2003
• Development Underway by 2005
• Qualification/Production by 2006

Conceptual Only
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Wafer Level Integrated Flow and ControlType 4
Continuous EFEM (Revolving Sushi Bar)
Single Wafer
Conceptual Only
Wafer Transport

• Potential Solutions Require
• Ultra High Speed Wafer Transfer
• Target M/C to M/C 7sec.
• Wafer Level Dispatching

Carrier Level Transport
Single Chamber Process Tool
Stocker
Metrology Tool
Multi-Wafer Carrier

• When Solutions Are Needed
• Research Required by 2007
• Development Underway by 2010
• Qualification/Production by 2013

Target 450mm
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The Next Generation Factory Concept
Users SCM - Supply Chain Management
..
Planning System
..
Direct Transport
..
..
Mfg. System
Agile -Mfg.
EES
Wafer Level Control
..
..
E- Diagnostic
Supporting System
..
Suppliers SCM
E-Mfg.
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Summary

• 1. Advances in process technology are occurring
  at ever faster rates
• 2. Equipment suppliers must deliver stable
  equipment running new process technologies with
  very high Overall Equipment Efficiency (OEE)
• 3. Agile manufacturing systems are needed to
  quickly ramp new process technologies into high
  volume production and to achieve cycle time goals
• 4. Process control and machine to machine
  matching are needed to get high yields at startup
  and reduce cycle time
• 5. Open standards are a Key Part of Potential
  Solutions
• 6. We invite and encourage you to participate in
  FITWG activities to convert these plans to reality