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An Introduction to VLSI Very Large Scale Integrated Circuit Design: circuit functionality perspectiv

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Power delivery and dissipation will be prohibitive. Courtesy, Intel. EE141 ... Three major challenges: power dissipation, current leakage and process variation ... – PowerPoint PPT presentation

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Title: An Introduction to VLSI Very Large Scale Integrated Circuit Design: circuit functionality perspectiv


1
An Introduction to VLSI (Very Large Scale
Integrated) Circuit Designcircuit
functionality perspective
Presented at ECE1001Nov 9th, 2006
2
Basic IC circuit component transistor
First transistor Bell Labs, 1948
3
Intel 4004 Micro-Processor
1971 1000 transistors 1 MHz operation
4
Intel Pentium (IV) microprocessor
2002 35 Million transistors 1 GHz
operation 0.18µm technology
5
Intel Core2 Duo Processor
2006 gt100 Million transistors 2 GHz
operation 65nm technology
6
Moores Law
  • In 1965, Gordon Moore noted that the number of
    transistors on a chip doubled every 18 to 24
    months.
  • He made a prediction that semiconductor
    technology will double its effectiveness every 18
    months

7
Moores law in Microprocessors
Transistors on Lead Microprocessors double every
2 years
1000
2X growth in 1.96 years!
100
10
P6
Pentium proc
Transistors (MT)
486
1
386
286
0.1
8086
8085
0.01
8080
8008
4004
0.001
1970
1980
1990
2000
2010
Year
Courtesy, Intel
8
Frequency
10000
Doubles every2 years
1000
P6
100
Pentium proc
Frequency (Mhz)
486
386
10
8085
286
8086
8080
1
8008
4004
0.1
1970
1980
1990
2000
2010
Year
Lead Microprocessors frequency doubles every 2
years
Courtesy, Intel
9
Power Dissipation
100
P6
Pentium proc
10
486
286
8086
Power (Watts)
386
8085
1
8080
8008
4004
0.1
1971
1974
1978
1985
1992
2000
Year
Lead Microprocessors power continues to increase
Courtesy, Intel
10
Power will be a major problem
100000
18KW
5KW
10000
1.5KW
500W
1000
Pentium proc
Power (Watts)
100
286
486
8086
10
386
8085
8080
8008
1
4004
0.1
1971
1974
1978
1985
1992
2000
2004
2008
Year
Power delivery and dissipation will be prohibitive
Courtesy, Intel
11
Power density
10000
1000
Power Density (W/cm2)
100
8086
10
4004
P6
8008
Pentium proc
8085
386
286
486
8080
1
1970
1980
1990
2000
2010
Year
Power density too high to keep junctions at low
temp
Courtesy, Intel
12
Not Only Microprocessors
CellPhone
Digital Cellular Market (Phones Shipped)
(data from Texas Instruments)
13
Design Abstraction Levels
SYSTEM
MODULE

GATE
CIRCUIT
DEVICE
G
D
S
n
n
14
The MOS Transistor
Polysilicon
Aluminum
15
What is a Transistor?
16
MOS Transistors -Types and Symbols
D
D
G
G
S
S
Depletion
NMOS
Enhancement
NMOS
D
D
G
G
B
S
S
NMOS with
PMOS
Enhancement
Bulk Contact
17
Threshold Voltage Concept
18
Transistor Model for Manual Analysis
19
The CMOS Inverter A First Glance
20
CMOS Inverter
N Well
PMOS
2l
Contacts
Out
In
Metal 1
Polysilicon
NMOS
GND
21
Two Inverters
Share power and ground Abut cells
Connect in Metal
22
CMOS InverterFirst-Order DC Analysis
DD
23
DC OperationVoltage Transfer Characteristic
VOH f(VOL) VOL f(VOH) VM f(VM)
24
Mapping between analog and digital signals
V

1

OH
V
IH
Undefined
Region
V
IL

0

V
OL
25
Definition of Noise Margins
"1"
V
OH
Noise margin high
NM
H
V
IH
UndefinedRegion
V
NM
Noise margin low
L
IL
V
OL
"0"
Gate Input
Gate Output
26
Transient Response
?
The delay is essentially what determines
the clock speed of the processor
tpHL
tpLH
27
Combinational vs. Sequential Logic
Combinational
Sequential
Output
(
)
f
In, Previous In
Output
(
)
f
In
28
Static Complementary CMOS
VDD
In1
PMOS only
In2
PUN

InN
F(In1,In2,InN)
In1
In2
PDN

NMOS only
InN
PUN and PDN are dual logic networks
29
NMOS Transistors in Series/Parallel Connection
Transistors can be thought as a switch controlled
by its gate signal NMOS switch closes when switch
control input is high
30
PMOS Transistors in Series/Parallel Connection
31
Example Gate NAND
32
Example Gate NOR
33
Typical sequential logic circuits
NOR-based set-reset
34
Cross-Coupled NAND
Added clock
Cross-coupled NANDs
This is not used in datapaths any more,but is a
basic building memory cell
35
Pipelining
Pipelined
Reference
36
Full-Adder
37
The Binary Adder
38
The Ripple-Carry Adder
Worst case delay linear with the number of bits
td O(N)
tadder (N-1)tcarry tsum
Goal Make the fastest possible carry path circuit
39
Complimentary Static CMOS Full Adder
28 Transistors
40
Implementation Choices
41
The Custom Approach
Intel 4004
Courtesy Intel
42
Transition to Automation and Regular Structures
Courtesy Intel
43
Design Metrics
  • How to evaluate performance of a digital circuit
    (gate, block, )?
  • Cost
  • Reliability
  • Scalability
  • Speed (delay, operating frequency)
  • Power dissipation
  • Energy to perform a function

44
Digital, Analog VLSI and CAD/EDA
  • The introduction is mainly on digital VLSI
    circuits
  • Three major challenges power dissipation,
    current leakage and process variation
  • While having some similarity, analog VLSI design
    is very different from digital counterpart (up to
    10,000 transistors)
  • CAD (computer aided-design) / EDA (electronic
    design automation) is the key to large scale
    complex design

45
Technology Evolution (2000 data)
International Technology Roadmap for
Semiconductors
Node years 2007/65nm, 2010/45nm, 2013/33nm,
2016/23nm
46
VLSI Design FFT Butterfly
  • Widely used in signal processing
  • Design Butterfly Unit for 2-point FFT
  • Components include multiplier, adder, subtractor,
    and data management

8-point FFT composed of 12 butterflies Image from
www.cmlab.csie.ntu.edu.tw/cml/dsp/training/coding/
transform/fft.html
Spencer Strunic and Matt Webb
47
VLSI DesignFFTButterflyLayout
Spencer Strunic and Matt Webb
48
VLSI Design 8-bit CPU
  • Registers
  • Store data
  • Manipulate data
  • ALU
  • Select between many different operations to
    output
  • Adder
  • Adds two 8-bit numbers
  • Multiplier
  • Multiplies two 8-bit numbers

Brian Linder and Matt Leines
49
VLSI Design8-bit CPULayout
Brian Linder and Matt Leines
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