Summary of Activities for a LifeCycle Environmental Impact Evaluation of TinLead and Lead Free Solde

1
Summary of Activities for a Life-Cycle
Environmental Impact Evaluationof Tin-Lead and
Lead Free Solder

• Jack Geibig and Maria Socolof
• SPVC Meeting
• April 1, 2003

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Lead-Free Solder Partnership Goals

• Evaluate the relative environmental impacts of
  Sn/Pb solder and selected Pb-free alternative
  solders (LCA)
• Other Non-LCA specific goals
• Evaluate the effects of lead-free solders on
  recycling and reclamation at EOL
• Effects of bismuth
• Tertiary and quartenary compound effects
• Assess the leachability of Pb-free solders and
  their potential environmental effects
• Identify issues that require additional research

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Solders Selected for Evaluation

• Wave Application Solders
• Sn/Pb (63 Sn/ 37 Pb)
• Sn/Cu (99.2 Sn/ 0.8 Cu)
• Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu)
• Reflow Application Solders
• Sn/Pb (63 Sn/ 37 Pb)
• Sn/Ag/Cu (95.5 Sn/3.9 Ag/0.6 Cu)
• Sn/Ag/Bi (42 Sn/1.0 Ag/57 Bi)
• SnAg/Cu/Bi (96 Sn/2.5 Ag/0.5 Cu/1.0 Bi)

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Project Funding Contributors

• Rockwell Collins
• International SEMATECH
• Thompson Multimedia
• U.S. EPA Design for the Environment Program

• Agilent Technologies
• Cookson Electronics
• Delphi Delco
• Hewlett-Packard
• IBM
• Intel
• Pitney Bowes

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Other Project Participants

• Siemens
• Kestor
• Omega Solder
• Senju
• AIM Solder
• Noranda/ Micrometallics
• Celestica
• NxtCycle

• Flextronics
• Vitronics-Soltec
• NEMI
• Teradyne
• Philips
• U.S. Navy-Crane
• U of Florida
• Boliden

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Life-Cycle Stages

Inputs Life-Cycle Stages Outputs
WaterEffluents
Raw Materials Extraction/Processing
AirborneEmissions
Energy
Solder Manufacturing
Solid Wastes
Solder Application
Raw Materials
Use/Reuse/Maintenance
Products
EOL Disposition
Co- Products
Boundary
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LCA Conceptual Framework
Inventory Analysis
Goal Definition and Scoping
Impact Assessment
Improvement Assessment
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Life-Cycle Impact Categories

• Resource consumption (renewable non-renewable)
• Energy use
• Water use
• Landfill space use
• Global warming
• Ozone depletion
• Photochemical smog
• Acidification

• Local air quality (PM10)
• Water eutrophication
• Local water quality (BOD, TSS, pH)
• Chronic human health toxicity (occupational
  public)
• Aesthetics (odor)
• Ecotoxicity (aquatic terrestrial)

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Product system boundaries

Solder
Recycling

recycling

Primary and
Solder
Solder
Market (N/A)

Incineration

secondary
raw
manufacturing

application

materials


Lan
dfilling

• LC Data Collected
• Inputs
• Energy
• Raw materials

• Outputs
• Water emissions
• Air releases
• Solid waste
• Products co-products

Overseas
Recycling/
Disposal
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Materials Extraction and Solder Manufacturing
Stages

• Secondary (pre-existing) data sources for metals
• limited time frame and budget
• data available for most metals (excepting
  bismuth)
• Existing data is being assessed for quality and
  accuracy
• Data collected from 5 solder manufacturers
• lead and lead-free solders
• paste and bar

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Solder Manufacturing Data

• Data averaged from 5 companies
• Bar and paste data collected separately
• Major inputs
• Metals primary vs. secondary
• Energy mix of power/fuels
• flux (for paste) assumed same for each
  (differences appear in functional unit
  normalization)
• Outputs not yet aggregated, likely not
  significant

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Solder Manufacturing Data - Metals

• Percent virgin content of metals

• Compared to US average rates (for all uses)
• Cu 86 virgin (USGS 2000)
• Ag 35 virgin (Errecart Graedel 2001)

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Solder Manufacturing Data - Energy

• Manufacturing energy inputs per unit of solder
  manufactured, by fuel type (MJ/kg solder)

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Recycling of Waste Solder

• Impacts dependent on smelting process and
  materials processed
• Solder manufacturing process waste
• Dross
• Lead limit of 0.1 Pb will present difficulties
  for lead solder recycling
• Process limitations likely to prevent recycling
• Duration of changeover
• Impacts from solder recycling become surrogates
  for impacts from secondary material processing

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Application of Solder LC Stage

• Primary causes of environmental impacts
• Energy consumption during assembly
• Dross formation
• Flux
• Conducted testing to determine reflow energy
  consumption (kW-h/g solder)
• Steady-state operation
• Throughput kept constant
• Energy normalized by mass of solder (avg. 2.5
  g/board)
• Wave solder testing to be conducted by
  Vitronics-Soltec
• Protocol currently under development

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Test Vehicle Specs for Reflow Testing
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Reflow Test Profile Characteristics
 
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Solder Application Data
  Energy Consumption during Reflow Testing
Compared to 14.8 KW in NEMI Testing for Sn/Pb
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PRELIMINARY RESULTS
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End-of-Life LC Stage

• Potential environmental impacts of electronics at
  end-of-life depend on disposition and location
• Landfill
• Incineration
• Recycle or reclaim
• Overseas recycling/disposal
• Impacts for each method will be determined,
  weighted for actual disposition based on research
• Sensitivity analysis will be used to show
  spectrum of possible impacts

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EOL Disposition of WEEE

• Surveyed federal and state sources, select
  municipalities, recyclers
• Most states uncertain some federal and state
  data available
• Assumed MSW distribution for incineration and
  landfilling
• 14 incinerated
• 77 landfilled
• 9 of WEEE recycled (EPA 2002)
• 50-80 of which is shipped overseas

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Impacts from Landfilling of WEEE

• Impacts will depend on several variables
• Location of landfilling (U.S. vs. other)
• Leachability of solders
• Fate and transport of metals through the
  environment and resulting human exposure
• Leachability testing is being conducted
• Results of previous testing inconclusive
• PWBs will be tested using TCLP and SPLP
  procedures, as well as with landfill leachate
• Testing conducted by U. of Florida

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Recycling - Dismantling
Collection
Dismantling
Metal Recovery
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Recycling - Metal Recovery
Collection
Dismantling
Metal Recovery

• Initial metal recovery results based on 4 copper
  smelters

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Recycling - Copper Smelting

• Tin, lead and bismuth contained in PCBs are
  boiled away in the process
• Most of the tin, lead and bismuth will be trapped
  as filter dust destined for
• -gt deposition
• -gt further refinery
• Copper and silver are refined as end products
• Silver will increase the economic incentives for
  recycling PCBs
• Bismuth is considered a contaminant to the process

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Findings - smelting
Tin-silver-copper (95.5 Sn/4.0 Ag/0.5 Cu)
Tin-lead (63 Sn/37 Pb)
Based on Bolidens smelting process and the
current economic situation
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Findings - smelting
Tin-lead (63 Sn/37 Pb)
Tin-copper (99.3 Sn/0.7 Cu)
Based on Bolidens smelting process and the
current economic situation
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Findings - smelting
Tin-lead (63 Sn/37 Pb)
Tin-silver-copper-bismuth (92.3 Sn/3.4 Ag/1.0
Cu/3.3 Bi)
Based on Bolidens smelting process and the
current economic situation
Source Kindesjo, 2002
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Findings - smelting
Tin-lead (63 Sn/37 Pb)
Tin-silver-bismuth (42 Sn/1.0 Ag/57 Bi)
Based on Bolidens smelting process and the
current economic situation
Source Kindesjo, 2002
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Factors in Making an Informed Solder Selection
Environmental LCA results
INFORMED DECISION
Economics
Refined Environmental Analyses (e.g., RA)
POLICY IMPLICATIONS
Transition to Full Scale
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Project Schedule

• Completed Goal Definition and Scoping Draft
  Report May 2002
• Draft LCA Reflow July 2003
• Draft LCA Wave Aug 2003
• Draft Final LCA Oct 2003