Pixel Sensor Submission

1
Pixel Sensor Submission

• ATLAS
• Prototype 1 CiS, SII (p-stopp-spray)
• Prototype 2 CiS, IRST (moderated p-spray)
• PreProduction CiS, TESLA
• CMS
• 1st prototype CSEM (p-stop)
• USCMS SINTEF (p-stop)
• 2nd prototype SINTEF (p-stop)
• PSI ? (moderated p-spray? p-stop)
• ALICE
• 1st prototype Canberra (p on n)

2
BTeV Submission

• 1st prototype
• Joint submission with US-CMS (p-stop)
• Bids received SINTEF, CSEM,CiS, Eurysis
• No bid Hamamatsu
• SINTEF and CSEM chosen
• CSEM submission held up by CMS
• SINTEF 22 wafers in total (5 oxygenated, 3 high
  resistivity)

3
SINTEF wafers summary

• Single-chip yield excellent
• Leakage current low, BD voltage meet or exceed
  spec (gt 300V)
• 5-chip module yield (see figure)
• After irradiation Vd lt Vbd up to 4x1014 p/cm2
  (low resistivity wafers)
• Normal wafers about the same characteristics as
  oxygenated wafers

4
SINTEF five chip modules
5
Next steps

• Two more prototype submissions planned
• Moderated p-spray (NDA with ATLAS, Licence
  Agreement with Garching Innovation GmbH)
• P-stop (meet design rule of vendor, new chip
  size, new module size)

6
Moderated p-spray

• Received prototype 2 wafers and preprod. Wafers
  from ATLAS
• Probing results (Ritas presentation)
• Irradiation test end of January
• Detectors mated to preFPIX2tb (bench test,
  irradiation test, beam test)
• Try out the submission process ourselves
• New chip size, new module size
• RFP sent to CiS, Eurysis, SINTEF, TESLA
• Bids received from CiS, SINTEF, and TESLA (see
  next slide)
• Big difference in quote and details of the
  responses
• After checking with Purchasing Dept, proposed to
  drop TESLA (quote unrealistic and not enough
  detail)
• Still waiting to get more details from CiS
  (testing procedure, material spec)
• SINTEF details on testing of modules

7
Preconceptual RD Draft Timeline
8
Discussion

• ATLAS wafers (probing results)
• More questions to the vendors?
• Status of the mask design
• Remaining issues
• Simulation
• Submission schedule