btechcorp

1
btechcorp

• Highly Electrically and Thermally Conductive
  Z-axis Film Adhesives
• www.btechcorp.com
• Longmont, CO
• Brentwood, TN

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Product Concept

• High conductivity fibers run through thickness of
  a film adhesive with precision orientation
• continuous path avoids particle-to-particle
  contact problem of filled adhesives
• wide range of fibers and thermoplastic matrices
• carbon fibers, metallic coated and pure metal
  fibers (5 to 25 µ diameter). Up to 20 million
  fibers/in2
• Hot melt thermoplastics polyamide,
  polypropylene, etc.
• Fibers tilt slightly to allow consolidation of
  bond line during cure

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Combined Electrically and Thermally Conductive
ACF Adhesives

• 8µ diameter pure nickel fibers
• - Bekaert (Belgium)
• - 4µ diameter process capability
• Instant cure hot melt thermoplastic
• 125C to 200C bonding temperature options
• 90C to 160C continuous operating capability

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Combined Electrically and Thermally Conductive
ACF Adhesives (contd)

• Medium pitch density.NTP series
• - uncoated pure nickel fibers
• - continuous process, lt30 cost of high pitch
  version
• High pitch density.TP series
• heat treat Ni fibers in oxygen/argon to grow
• ¼ µ thick green nickel oxide coating (NiO)
• gt20 mega-ohm resistance on 30µ comb pattern
• 11µ pitch capability

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NTP Series Product Requirements

• Z-axis electrical resistivity
• 0 µ-ohm (1.0 cm2)
• lt 200 micron pitch with high X-Y resistance
• Thermal conductivity 5 W/mK (bonded joint)
• better than highly filled silver epoxies
• Mechanical properties
• Very flexible lt 0.06 GPa modulus, 77K
  capability
• easy rework with solvent (IPA) or heat
• high lap shear and peel strength

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NTP Series Product Options

• NTP-1 bond 125C, operating limit 90C
• NTP-2 bond 150C, operating limit 130C
• NTP-3 bond 200C, operating limit 160C

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Huge NTP Series Market Volume

• Solar panel Z-axis interconnect
• Large area (gt 2 cm2) lead free solder
• Low cost microwave PCB packaging
• Low cost silver filled epoxy replacement
• New long life batteries
• Low cost PET substrate circuit lamination

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TP Series40 Nickel Fiber Volume with Oxide
Coating (gt20 mega-ohm, 30µ pitch)
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TP Series Product Requirements

• Z-axis electrical resistivity
• 0 µ-ohm (1.0 cm2)
• X-Y electrical resistivity
• gt20 megaohm, 30 µ pitch
• Thermal conductivity 5 W/mK (bonded joint)
• better than highly filled silver epoxies
• Mechanical properties
• Very flexible 0.06 GPa modulus, 77K capability
• easy rework with solvent (IPA) or heat
• high lap shear and peel strength

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TP Series Product Options

• TP-1 bond 125C, operating limit 90C
• TP-2 bond 150C, operating limit 130C
• TP-3 bond 200C, operating limit 160C

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TP Series Applications

• Fine pitch BGA and flip chip packages
• Flex circuit Z-axis interconnect
• Advanced fine pitch displays (11µ pitch)
• LCD assemblies
• replace current Z-axis adhesives
• RFID tags

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Significant Cost Savings for Flip Chips

• Eliminates need for wafer bumping and underfill
• gt65 cost savings for comml applications
• Can be laminated to wafer before dicing or
  applied to component prior to assembly
• disk drive pre-applied to flex circuit
• RFID tag laminated to wafer
• Low pressure bonding
• 50 psi vs. gt400 psi for current Z-axis adhesives

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Numerous Devices Tested

• MEMS cell phone microphone
• Flex circuits
• RF amp large area solder bond replacement
• LED wire bond replacement (1mm2)
• 80 cheaper than flip chip
• High density, hybridized CMOS imaging
• 14,400 pixels, 100 µ2 each
• Imperium (MD) ultrasound imaging

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Prototype LED with Flip Chip Packaging500 mA, 6V
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Large TP Series Market Potential

• LCD assembly
• current ACF adhesive sales 500 mil /yr
• our ACF gt50 cheaper, 50 psi vs. gt400 psi
  bonding, 11µ vs. gt75µ pitch
• Flip chip packaging
• fastest growing, 7 billion devices/yr 450k m2
  adhesive opportunity
• 3-4x larger than LCD market

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Ready for High Volume Applications

• TP Series production facilities in place
• Much cheaper, more conductive than older
  technology ACF
• NTP Series high volume (gt1 million ft2)
  facilities in place
• Continuous prepreg supplier.Patz Materials
  Technology, Benicia, CA
• lt30 of TP Series cost
• Cost effective for large area solder preforms

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Patz Continuous Thermoplastic Prepreg Facility
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HM-2 Thermoplastic Thermally Conductive Adhesive
40 volume vapor grown carbon fibers
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HM-2 Thermoplastic Thermally Conductive Adhesive

• 0.07 C-sq. cm/W Z-axis thermal resistance
• -50C to 160C operating range
• Special high temperature thermoplastic for
  automotive electronics
• 3000 thermal cycles
• 1000 hours total at 150C