SNAP NIR Detector Packaging Development: Universal SiC Package

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SNAP NIR Detector Packaging DevelopmentUniversa
l SiC Package

• Bruce C. Bigelow
• Department of Physics, University of Michigan
• 30 June 2005

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SiC NIR Package Design Issues

• Neither vendor is producing a package we want to
  use for SNAP
• SiC is currently favored for focal plane
  components
• Need a package design that can accommodate either
  RSC or RVS designs
• Main details are package size, connectors, and
  interface to FP

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Current Rockwell Package Design
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Current Rockwell Package Design
H2RG package and mounting details
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Current RVS Package Dimensions
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Current RVS Package
Raytheon Proprietary / Competition Sensitive
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UM SNAP NIR Package Design
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UM SNAP NIR Package Design
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UM SNAP NIR Package Design
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UM SNAP NIR Package Design