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Metal Injection Molded Photonic Device Packaging

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Metal injection molding defined. Manufacturing process. Materials for photonics packaging ... Injection molding of metal powder compounded with binder (plastic/wax) ... – PowerPoint PPT presentation

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Title: Metal Injection Molded Photonic Device Packaging


1
Metal Injection Molded Photonic Device Packaging
  • Rob Linke
  • MIMforms LLC

2
Outline
  1. Metal injection molding defined
  2. Manufacturing process
  3. Materials for photonics packaging
  4. Benefits of metal injection molding
  5. Future directions
  6. Conclusions and resources

3
What is MIM?
4
Metal Injection Molding
  • Utilizes wealth of technology developed for
    plastic injection molding
  • Injection molding of metal powder compounded with
    binder (plastic/wax)
  • Debinding of component (solvent or thermal)
  • Sintering of part to final density

5
Manufacturing Process
  • Design of Component
  • Tooling of Mold
  • Injection Molding
  • Debinding
  • Sintering
  • Optional CNC Machining
  • Finishing/Plating

6
Compounding
  • Components
  • Metal powder
  • Wax
  • Polymers
  • Goals
  • Sufficient binder to fill all voids
  • Uniform mixture

Metal powder at 100x D50 2-10 µm
7
Injection Molding
  • Virtually identical to plastic injection molding
  • Feedstock is molded at low temperatures (150oC)
    with consistency of toothpaste
  • Consists of metal powder in binder matrix ( 40
    binder by volume)
  • Yields green part

8
Debinding
  • Binder removal from matrix (disposable component)
  • Solvent water or other solvent
  • Thermal decomposition
  • Results in structurally weak component with small
    amount of binder remaining

9
Sintering
  • Sintering densification increases the atomic
    bonds between particles
  • Temperature is near melting point
  • Density of up to 98.5
  • Real world example ice cubes sticking together
    in freezer

Sintering Furnace
10
Shrinkage in Sintering
  • Green part typically shrinks 15 during sintering
  • Density increases
  • Strength increases
  • Final mechanical properties attained

11
Post-Sintering Structure
3000x Magnification
12
CNC Machining and Plating
  • MIM tolerances
  • /- 0.5
  • For features lt4.0 mm it is /- 0.02 mm
  • CNC tolerances
  • /- 15 µm
  • Plating
  • Gold
  • Nickel
  • Other

13
MIM Materials Kovar
  • Photonic and optoelectronics packages which match
    CTE of borosilicate glass
  • 29 W, 17 Co, 53 Fe
  • Properties
  • CTE (30-400oC) 4.4-5.2 ppm/ oC
  • Density 7.95 g/cm3
  • Density 97

14
MIM Materials Iron-Nickel
  • Photonic and optoelectronics packages
  • 50 Fe, 50 Ni
  • Properties
  • CTE 8.8 ppm/ oC
  • Density 7.75 g/cm3
  • Density - 95

15
MIM Materials Tungsten-Copper
  • Heatsinks for photonic housings which mirror CTE
    of borosilicate glass
  • 80W, 20 Cu as Example
  • Properties
  • CTE 7.4 ppm/ oC at 50oC
  • Themal Conductivity 189 W/m K
  • Density 14.89 g/cm3
  • Density - 95

16
Tungsten Copper Structures
Infiltrated Tungsten skeleton with liquid Copper
Vacuum Sintered Tungsten-Copper powder
17
Why use MIM?
  • Reduce or eliminate individual CNC machining
  • Reduce material waste
  • Enable mass production of intricate, highly
    detailed structures
  • Reduce total cost

Kovar Lens Holder
18
Machine Once or Many?
  • CNC machining
  • Each part is machined to final shape individually
  • MIM
  • The mold is machined once and parts are molded to
    final shape

CNC MIM
package cost ?
production volume ?
19
Shape Complexity
  • CNC machining
  • Each detail adds to cost (and time)
  • MIM
  • Details are machined into the mold once
  • Reproduced in each package during molding

CNC MIM
package cost ?
shape complexity ?
20
Material Waste Reduction
  • CNC removes large amounts of metal to yield
    housing
  • MIM uses only metal necessary
  • 75 waste reduction typical
  • Runners, gates can be recycled on-site

Material waste with CNC Machining
21
Future Directions
  • Complex designs specifically for MIM
    manufacturing
  • Custom MIM alloys/mixtures
  • Higher dimensional tolerance MIM components
  • Increasing adoption of MIM package use in North
    America

22
Conclusions
  • MIM can be an enabling technology for photonic
    and optoelectronic packaging
  • Mass production
  • Low/no cost structures
  • Reduced material waste
  • Designs not possible or economical with CNC
    machining
  • Greater alloy flexibility through batch
    compounding

23
Additional Information on MIM
  • Organization
  • CISP-Center for Innovative Sintered Products-Penn
    State
  • Book
  • Injection Molding of Metals and Ceramics German
    Bose
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