Update on Bump Bonding

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Update on Bump Bonding

• Existing contract
• AIT shipment delivered this morning
• ( 6 FPIX0, 5FPIX1, 1 5-chip
  module)
• 3 more MCM under contract(Late spring) a few
  FPIX1 detectors (thin wafer??)
• MCNC 8 FPIX1 detectors, 2 5-chip module (see
  fig.) delivery expected early Spring
• Plan for these detectors
• Priority will be on MCM
• New inner boards for FPIX0 (minor mods)
• Quick check on FPIX1 detector on test board new
  PCB will be designed that can be readout by PCI
  based test-stand will be used to build new pixel
  telescope

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Pictures from AIT
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Plans for preFPIX2s

• preFPIX2I
• export license issue (AIT ruled out)
• single chip devices so far (MCNC ruled out)
  negotiation with CERN to have 1-2 complete wafer
  received dummy wafer (see fig) will establish
  contract as proof of principle to CERN (8 wafer,
  fine pitch, yield etc)
• UCD (see paper copy) SINTEF wafer
• preFPIX2Tb
• New contract with AIT
• 8 detectors using ATLAS moderated p-spray wafer
  and SINTEF wafer (oxygenated and std)
• Irradiation studies using these detectors

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Alice1LHCb
Fermilab
Transistor testchip
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Real pixel vs dummy(pixel)