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EE M252B MAE M282 MEMS PHYSICS

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Fluidic. Applications and Case Studies: Inertia sensors. Capacitive accelerometers ... Fluidic, Biological, Example: Airbag in your car. MAE 282/EE 252. 11 ... – PowerPoint PPT presentation

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Title: EE M252B MAE M282 MEMS PHYSICS


1
EE M252B /MAE M282MEMS PHYSICS DESIGN
Spring 2007 MW 200 350 pm 5422 Boelter Hall
  • Eric P. Y. Chiou
  • UCLA Mechanical and Aerospace Engineering
    Department, Eng. IV 37-138
  • Los Angeles, CA 90095-1594
  • pychiou_at_seas.ucla.edu

2
Scope
  • Introduction to MEMS design
  • Sensing and actuation mechanisms
  • Microsensors, and microactuators
  • BioMEMS and Microfluidics
  • Case study of MEMS products

3
Textbook
  • Microsystem Design
  • Steve Senturia (MIT)
  • First published in 2001
  • Kluwer Academic Publishers
  • ISBN 0-7923-7246-8
  • Emphasis on
  • Physics
  • Modeling
  • CAD
  • Detailed case studies

4
Reference Books
  • Greg Kovacs, Micromachined Transducers
    Sourcebook, McGraw Hill, 1998
  • Covers a wide range of topics
  • Comprehensive list of references
  • N. Maluf, An Introduction to Microelectromechanica
    l Systems Engineering, Artech House, 2000
  • Intended for use as an introductory textbook
  • T.R. Hsu, MEMS and Microsystems, McGraw-Hill,
    2002
  • Introductory textbook
  • Research papers listed on the web
  • http//www.seas.ucla.edu/pychiou/M282.html

5
Syllabus
  • Grade
  • Homework (15), Midterm (30), Final (40),
    Project(15)
  • Office Hour
  • Fri 12 pm, other time by appointment.
  • Team Base Design Project
  • 3 people a group (from different departments and
    groups)
  • Midterm

6
Background
  • Basic MEMS fabrication processes
  • Prerequisite EE M250A (MAE 280)
  • May be substituted by EE M150L
  • Layout tool
  • Have access to a layout tool such as L-Edit,
    Cadence, Magic, etc.
  • If you dont have access, you need to find a
    partner
  • Mathematical tools
  • Familiar with and have access to at least one of
    the following numerical packages (or its
    equivalent)
  • MathCAD
  • MATLAB
  • Numerical Simulation Tools (Plus but not
    required)
  • ANSYS,
  • FEMLAB

7
Topics Covered in This Course
  • Transduction principles
  • Mechanical
  • Electrostatic
  • Magnetic and Electromagnetic
  • Thermal
  • Piezoelectric
  • Fluidic
  • Applications and Case Studies
  • Inertia sensors
  • Capacitive accelerometers
  • Piezoelectric rate gyros
  • Pressure sensors (piezoresistive)
  • Projection display
  • Digital Micromirror Devices
  • Grating Light Valve (GLV)
  • Optical switching
  • RF MEMS
  • RF switches
  • Tunable capacitors
  • RF resonator

8
Course Schedule
  • Week Topic
  • 1-1(4/2) Welcome, Administration, MEMS
    Literature, MUMPS, SUMMIT V
  • 1-2(4/4) Lumped-Element Modeling, Transduction
    Mechanisms
  • 2-1(4/9) Electrostatics
  • 2-2(4/11) Electrostatic Devices
  • 3-1(4/16) Magnetostatics
  • 3-2(4/18) Magnetostatic Devices
  • 4-1(4/23) Elasticity
  • 4-2(4/25) Piezoelectricty, piezoresistive
  • 5-1(4/30) Energy Methods
  • 5-2(5/2) MIDTERM EXAM (May 2nd)
  • 6-1(5/7) Thermal Devices
  • 6-2(5/9) Fluidics (Electrophoreis,
    Electroosmosis, AC electroosmosis)
  • 7-1(5/14) Fluidics (Optical Tweezers, Magnetic
    Tweezers, DEP, OET)
  • 7-2(5/16) Case Studies (Capacitive Sensor)
  • 8-1(5/21) Case Studies (DMD Display, GLV
    Display)
  • 8-2(5/23) Case Studies (RF MEMS)
  • 9-1(5/28) Case Studies
  • 9-2(5/30) Memorial Day Holiday

9
What is Design?
  • Find a solution that satisfies a set of boundary
    conditions
  • The boundary conditions usually have conflicting
    requirements
  • Trade-offs have to be made
  • Performance is not the only goal. It is often
    traded off for manufacturability ( maybe the
    biggest difference between engineer and scientist)

10
MEMS System
Electronic Signal Processing, Computing Storage
Sensor
MEMS Transducers
Physical World
Actuator
Electrical Signals
Mechanical, Optical, RF, Fluidic, Biological,
Example Airbag in your car
11
What is MEMS Design?
System Architecture
Requirements
MEMS Subsystem
Non-MEMS Subsystem
Packaging Consideration
Capabilities and Limitations
Device Structure
Detailed Design
Detailed Design
Transduction Method
Manufacturing Yield Cost
Fabrication Process
Trade-offs
12
High Level Design Issues(Before You Start
Designing MEMS)
Technology Push
Market Pull
MEMS-Enabled Systems
MEMS Technologies
Market
Market Looking for Technologies
Technologies Looking for Solutions
Other Competing Technologies
Other Competing Systems
  • Is MEMS the best solution?
  • Does it have high impact?
  • Does MEMS produce a paradigm shift?
  • Competition with both conventional technologies
    and other MEMS producers
  • Manufacturability
  • Cost
  • Real need for the market
  • Who are the customers?
  • Market size
  • Market timing
  • Mass or niche market?
  • Technology available?
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