Sensor status, June 2004 CiS: 1121 good tiles have been delivered. 1000 good tiles have been tested. 243 wafers (616 good tiles) have been delivered to bumping vendors. 150 wafers (375 tiles) are available for shipment to bumping vendors immediately. - PowerPoint PPT Presentation

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Sensor status, June 2004 CiS: 1121 good tiles have been delivered. 1000 good tiles have been tested. 243 wafers (616 good tiles) have been delivered to bumping vendors. 150 wafers (375 tiles) are available for shipment to bumping vendors immediately.

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243 wafers (616 good tiles) have been delivered to bumping vendors. 150 wafers (375 tiles) are available for shipment to bumping vendors immediately. ... – PowerPoint PPT presentation

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Title: Sensor status, June 2004 CiS: 1121 good tiles have been delivered. 1000 good tiles have been tested. 243 wafers (616 good tiles) have been delivered to bumping vendors. 150 wafers (375 tiles) are available for shipment to bumping vendors immediately.


1
Sensor status, June 2004CiS 1121 good tiles
have been delivered.1000 good tiles have been
tested. 243 wafers (616 good tiles) have been
delivered to bumping vendors. 150 wafers (375
tiles) are available for shipment to bumping
vendors immediately. The final 100 tiles now
being tested.ON26 good tiles have been
delivered. This is a 15 acceptance rate on the
first batch. Second batch has been delivered and
is being measured. With reduced specifications
on p-spray (those tiles would be used in the
outer layer), the acceptance rate will probably
exceed the 15 observed for the first delivery.
2
If ON addresses all problems, the remaining 90
of the order will be delivered in 3 batches of
30 each, in June, July, and August.
Approximately 100 wafers would be sent to each of
4 probing institutes. If the contract with ON is
cancelled, the remaining 1100 tiles would be
provided by CiS. 150 CiS tiles are available
immediately 150 more could be delivered by
approximately September, with the remainder
delivered by approximately December. The probing
institutes are able to characterize the wafers at
a rate of approximately 1 wafer per day.
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