Weir%20TR%20Temporal%20and%20Sequential%20Data%20Analysis%20and%20Performance%20Matching%20Interfaces%20of%20Thermal,%20Probe%20and%20CD%20Uniformity%20data - PowerPoint PPT Presentation

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Weir%20TR%20Temporal%20and%20Sequential%20Data%20Analysis%20and%20Performance%20Matching%20Interfaces%20of%20Thermal,%20Probe%20and%20CD%20Uniformity%20data

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Automated data culling. Histograms, contour, vector, XY, etc plots. ... Any variable such as MSE, TCD, BARC, SWA etc can be used to cull data ... – PowerPoint PPT presentation

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Title: Weir%20TR%20Temporal%20and%20Sequential%20Data%20Analysis%20and%20Performance%20Matching%20Interfaces%20of%20Thermal,%20Probe%20and%20CD%20Uniformity%20data


1
Weir TRTemporal and Sequential Data Analysis and
Performance Matching Interfaces ofThermal, Probe
and CD Uniformity data
  • Improvements with Release 2.0
  • Data Loading speed increase 5x to 8x
  • Improved wafer modeling
  • Improved intra-site data interpolation
  • Wafer-Contour plot speed improvement 12x to 20x

2
Product Features Weir TR Sequence Weir TR
Matching
Weir TR Range response by sensor over time
  • Requires Weir TR version 2.0 or later.
  • Product has two interfaces
  • Weir TR Sequence Analysis
  • Time dependent analysis of Temperature or any
    metrology variable
  • Derives critical phase elements of the cycle
  • Weir TR Matching
  • Two dataset/system matching of
  • Thermal-to-Thermal
  • Thermal-to-Metrology
  • Metrology-to-Metrology
  • Can use Weir TR Temporal Analysis calculated
    variables
  • Example
  • Cumulative-Energy vs feature size
  • Match any metrology, probe or sequence data

Weir TR Matching Temperature-to-BCD Feature
3
Weir TR Time Response Analysis Data sources
Weir PW Process Derived Analyses Variables
Scanner log and metrology
Wafer Substrate Sensor
Clean-Track, Develop In-line Data
Metrology Probe Data
CD-SEM and Scatter
  • Accept sequenced or time based data from any
    metrology source

4
Weir TR Temporal AnalysisProduct Features
Sensor change-rate vs Temperature
  • Weir TR Temporal Analysis
  • Time or Sequence dependent analysis of
    Temperature or any metrology variable
  • Automated time-phase deconvolution of constant
    and rise/fall segments
  • Energy or (Time Temperature) calculation with
    temperature threshold
  • Local velocity or rate-calculations of rate of
    local change with time
  • Automated whole-substrate or individual sensor
    response
  • Critical cycle-point analysis
  • Substrate contour mapping/vectoring
  • Matrix display
  • Single time-slice
  • Animation of contour response
  • Variables used and derived include temperature,
    rate-of-change, acceleration-of-change, Energy,
    Cumulative Energy

5
Thermal response ranges
  • Displays variation at each sensor relative to
    average temperature of wafer

6
Average times for each phase
  • Data is saved in Weir Data Workbook

7
Automated Phase Deconvolution
Max Temp
  • Statistics show four thresholds which are plotted
    as yellow-filled squares.
  • Range of data across wafer _at_ time is plotted by
    blue circles

Phase change
Range
Min Temp
8
Critical phase evaluation by sensor point
  • Customize the sampling or graphic to zoom-in on
    time/sequence critical segments

9
Cumulative Energy
Graphics selection interface tabs
  • Integrated energy at each sensor shown
  • and the phase in which it occurred
  • Graphics are provided by
  • Sensor/phase
  • Rise time/sensor phase
  • Substrate Response as a function of Radius

10
Temperature Mean, Rise, Phase Length, Start Value
11
Local Rate Change Variation
rise
  • Local Rate Change plotted at 8 times over
    critical final rise
  • Notice initial rise on left side of wafer at 2295
    seconds with a slope range from 0.217 to 0.256
    dec/sec

12
Vector/Contour mapping of user selected
time-slices
Three vector plots of accumulated energy
13
Local Acceleration, Temperature Rate-of-Change
  • Data taken at 2370 seconds

14
Localized Rise/Fall Plot vs Variable
Raw Temp vs Time Cycle
Mouse-zoomed response at critical settling point
  • Details process-critical response to any variable
    such as temperature

15
Threshold Analysis data
Temperature variation
  • Data from the RiseTimesPhase worksheet for 16
    sensors
  • Transition points are marked on the thermal curve
    as black squares with a yellow center (previous
    slide)
  • Data stored on Weir TR Spreadsheet in data
    workbook

16
Separate window display of Thermal variation
  • Matrix view
  • Animation also provided

17
Weir TR MatchingProduct Features
Across-Wafer Modeled Bottom CD Variation Across
two Bake Plates
  • Weir TR Matching
  • Match any two Temporal/Metrology/Log sources
  • Match Bake, Temperature,Cumulative Energy ,
    Process etc uniformity
  • Infinitely-Variable Rotation and Notch Alignment
    Controls
  • Features Includes
  • Automated data culling
  • Histograms, contour, vector, XY, etc plots.
  • Individual time-slice or integrated analysis
  • Model across-wafer variation
  • User-customized graphics
  • Easy plot/copy into reports/html interfaces
  • Reports and data stored in standardized workbook
    format

(Scatter data)
18
Weir TR Time Response Analysis Data sources
Weir PW Process Derived Analyses Variables
Scanner log and metrology
Weir TR Temporal Analysis Variables
Wafer Substrate Sensor
Clean-Track, Develop In-line Data
Metrology Probe Data
CD-SEM and Scatter
  • Any metrology, sequenced or log based data

19
Basic Operation of Weir TR Matching
  • Wafers from two separate bake plates shown
  • Provides a basic visual statistical match
    comparison
  • Covariance matching over time/space
  • Compare static or sequential data
  • For example Bottom CD to Temperature or
    Cumulative Energy on the substrate

20
Variable Culling
  • BCD based culling removed 309 data points to
    properly display wafer-graphic shown on left
  • Easily removed Intra-Field variation and improves
    accuracy

Original BCD data distribution
Command used to generate histogram
And then apply the wafer model
21
Individual graphics
  • Comparison of BCD variation for wafers generated
    on two separate hot-plate Post Exposure Bakes

22
Variation by X-location on wafer
Vector Contour Radial XY Horizontal XY
Vertical VS Time/sequence Data here not modeled,
this is raw data
23
Modeled wafer variation
  • BCD Modeled variation due to slow across-wafer
    changes
  • Data from two bake plates

24
BCD wafer fit to temperature
  • Response as a function of X position on the wafer
  • On-Wafer Temperature at 135.52 sec vs final
    Wafer-Modeled BCD
  • 2nd order line fitted to each dataset using mouse
    interface

25
Weir TR calculated Cumulative Energy and BCD
Variation
  • Contour grid (left) can be turned on/off

26
Thermal-Time Cycle BCD Information
27
Thermal Energy wafer-modeled BCD
  • Problem
  • OnWafer probe and CD-SEM oriented wafer
    differently
  • LeftThermal vector plot
  • Right Scatter-tool Contour

28
Thermal rotated by 135 degrees
  • Data Rotation interface allowed thermal data to
    be rotated by 135 degrees to provide improved
    alignment

29
PEB and feature- BCD as contour plots
  • Weir TR calculated Accumulated Energy from PEB
    cycle matched to BCD variation
  • Performed after rotation

30
Radial Variation
31
Horizontal Variation Temperature vs BCD modeled
32
Modeled Comparison of Temperature Top CD (TCD)
  • Analysis used the BCD variable to remove poor
    metrology
  • Any variable such as MSE, TCD, BARC, SWA etc can
    be used to cull data

33
Thermal and Feature Distributions
Temperature _at_ 30 sec
BARC
SWA2 (Side Wall Angle)
Bottom Feature Size (BCD)
Top Feature Size (TCD)
SWA1 (Side Wall Angle)
34
Weir TR MatchingThermal Response Comparison of
two hot plates
  • Comparison of two separate PEB bake plates

35
Time sequence for two bake plates
36
Timed Response of Temperature
37
Temperature response at curve peak
38
Temperature at 148.77 Sec
39
Horizontal variation across plate
  • Hot-plate comparison for two PEB sequences
  • Temperature variation at 148.77 seconds
  • Fitted curves up to 4th order can be mouse-added
    to plots

40
Total cumulative Energy _at_ end of cycle
41
Summary
  • Two very-unique companion products are offered
  • Weir TR Time/Sequence Response Analysis
    software
  • Weir TR Matching for any sequence, probe or
    metrology data
  • Weir TR Time Response
  • Goes beyond thermal sensor software provided by
    OnWafer SensArray
  • Automated
  • Sequence Phase extraction
  • Process-Energy Injection calculation
  • Localized Rise/Fall calculation plotting
  • Individual phase and sensor analysis
  • Vector, histogram and XY plots of any
    time/sequence slide
  • Matrix, Animation and visualization plots
  • Weir TR Matching
  • Matching software for Critical Features and
    metrology elements
  • Similar to historic overlay matching methods
  • Includes ability to match time/sequenced data
  • Such as Post-Exposure Bake, scanner logs, OnWafer
    SensArray data
  • Match
  • Time-to-time
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