INES

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INES
Marcel F. Sevat Philips October 11, Workshop
2 Micro-electronics design Conference on IST
for Broadband Europe
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Role of micro-electronics

• Aspects in Ambient Intelligence vision
• Mobility wireless, low-power, small.
• Communication high bandwidth.
• Computation high processing speed, real-time.
• Ubiquity cheap, low-power, wireless, small.
• Major role for micro-electronics !

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Master plan micro-electronics
System on Chip
Strategic Domain IC Technology for the Networked
Society
Process Integration
Strategic Domain NanoCMOS
Process Building Blocks
Strategic Domain Lithography
Strategic Domain Interconnect
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FP6 Expressions of Interest
Integrated Projects for the Strategic Domains
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Relation INES / NanoCMOS
INES
Design methods
NanoCMOS
IC Processes
Digital
RF/Analog
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INES Core consortium

• Companies
• Philips (lead)
• Infineon
• STM
• Alcatel
• Thales

• Institutes
• IMEC
• LETI
• CNRS
• FHG

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INES Design topics and priorities
Reduction of the design gap
RTD on design methods design tools (synthesis,
verification, simulation, testing, debug)

• Challenges
• Shortening design time (TTM).
• Increasing system complexity (HW, SW).
• Growing operating frequencies, power density.
• Interconnect dominated timing, timing closure.
• Growing process variation, DSM effects.
• Growing mask costs, lack of designers.

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INES Design topics and priorities
Solutions paradigm shifts evolution

• Networks on silicon
• Interconnect centric
• Tile-based design
• Smart power
• Low voltage design
• Software mapping
• Design for Test
• Fault tolerant design
• Reuse,standardisation
• IP, wrappers

• GALS
• Platform based design
• Embedded SW
• Mixed RF/A/D design
• Mixed level design
• Automated design
• Training education

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INES Process topics and priorities
Realisation of Moores law
RTD on IC processes for high bandwidth (materials,
devices, interconnect, packages, )

• Challenges
• Very high operating frequencies.
• Increasingly small dimensions.
• Reducing power consumption.
• Improving / maintaining reliability.
• Reducing influence of parasitics / interconnect.

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INES Technology topics and priorities
Solutions paradigm shifts evolution

• High mobility devices
• High voltage devices
• Electro-optical devices
• RF MEMS
• III-V, SiGeC processes
• RFCMOS, BiCMOS
• Optical interconnect
• Integration of passives
• Integration of III-V in Si

• Lossless substrates
• Interconnect / dissi-
• pation strategies
• System in package
• . . .