Chapter 1 Introduction: Electronic products, technologies and packaging

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Chapter 1 IntroductionElectronic products,
technologies and packaging

• The course material was developed in INSIGTH II,
  a project sponsored by the Leonardo da Vinci
  program of the European Union

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Chapter 1 Introduction

• Lecturers Per Ohlckers, Rolf Johannessen etc.
  Laboratory supervisor Roar Danielsen
• Please find on the course web site kursets
  http//www.fys.uio.no/studier/kurs/fys317
• Updated schedule. NB! Please check regularly
  will be changed during the semester!
• Lecturing notes (ppt files and pdf files)
• Guide for laboratory project(s)
  http//www.fys.uio.no/slyng/FYS3260_4260.pdf
• Earlier exam tests and guides.
• Miscellaneous information (elektronic version of
  the textbook, etc)
• Textbook Leif Halbo and Per Ohlckers
  Electronic Components, Packaging and Production
  Textbook, ISBN 82-992193-2-9, 330 pages,
  University of Oslo, December 1995.
• Mandatory reading
• The textbook, project work, lecturing viewgraphs,
  and tentatively some web pages for latest
  technology news. The download documentation from
  the MicroBUILDER course, tentatively to be given
  on April 22nd, 2009.
• The laboratory project work is mandatory
• The company visits are strongly recommended, but
  participation is not mandatory.
• Exam training by answering earlier exam tests is
  very important in order do understand what is
  expected at the final exam test.

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Chapter 1 Introduction

• Detailed mandatory reading
• The complete textbook
• The book could be more updated, but basic content
  is still valid. First of all get the overview
  understanding, then dive into the details, which
  sometimes are too much, for instance tables on
  material properties.
• Laboratory project
• Design, assembly and testing of a surface mount
  printed circuit board. Approved/not approved
  based upon written report and oral presentation.
• Lecturing viewgraphs
• NB! Please observe that the lecturing viewgraphs
  are better updated than the textbook and contains
  additional obligatory reading.(This is especially
  true for Chapter 9 Micro Structure Technology
  and Micromachined Devices for instance the
  basic principles of Silicon Micromachining
• Additional web-sites and downloadable journal
  articles, covering latest technology developments
  and trends og artikler
• Links and download instructions will be given on
  the course web site.
• Download material from the microBUILDER course.
• Oral information in the lectures Mostly covering
  mandatory reading, but some additional issues
  will be covered as illustrations of important
  matters.

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Definition ofELECTRONIC PACKAGING AND
INTERCONNECTION TECHNOLOGY

• "The realization of the physical, electronic
  system, starting with block-/circuit diagram
• Involves choice of technology for implementation,
  choice of materials, detailed design in chosen
  technology, analysis of electrical and thermal
  properties, reliability.
• This definition is one among many, and may shift
  as the field is further developed.

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Multidisciplinarity of Electronic Packaging and
Interconnection Technology

• Requires combination of many disciplines
• Electronics
• Materials properties and materials compatibility
• Mechanics
• Chemistry
• Metallurgy
• Production technology
• Reliability, etc.
• Product development should involve experts from
  the various fields, and the interdependence of
  the fields may be the most important to make a
  good product.

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TYPES OF ELECTRONICS AND DEMANDS ON THEM -
EXAMPLES

• Satellite electronics
• Production volume one unit, 20 years life
  required, no repair, very low weight and power,
  very high development cost acceptable
• Life saving medical electronics
• Similar reliability/power demand, may be in harsh
  environment (body fluids), medium production
  volume.

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Examples, cont

• Telephone main switchboard
• 10 year life, benign environment, very high
  complexity, low and high production volume, high
  price pressure
• Military electronics
• Very high reliability demands, in very rough
  environments. High development cost (and
  production cost) acceptable

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Examples, cont

• Computers
• High performance and reliability required. Very
  short product life, high production volume for
  some, small volume for some products
• Consumer products (watches, calculators...)
• Extreme price pressure, very short product life,
  low weight, power, very big market. No repair.

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Development Phases

• Market research
• Gives product idea

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DEVELOPMENT PHASES, continued

• Pre-study
• Gives product suggestion
• Defining overall specifications
• Gives definition of product, simulation/lab model
  of critical parts
• Prototype A
• Main principles analyzed, important parts
  implemented, technology chosen

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DEVELOPMENT PHASES, continued

• Prototype B
• Detailed design, correct form and components.
  Ready for industrialization.
• Industrialization
• Prototype adapted to producability in available
  production equipment. New production line built
  if needed, pilot series made.
• Marketing started, service planned
• Full scale production
• Product sale, maintenance, service

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LEVELS OF INTERCONNECTION

• Fig 1.2 Levels of interconnections in large
  electronic systems

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End of presentation of Chapter 1
IntroductionElectronic products, technologies
and packaging

• Important issues
• Definitions
• Multidisciplinarity
• Different types of applications with different
  requirements
• Hierarchy for Levels of Interconnections
• Questions and discussions?