The Semiconductor Front End in the Controlled Manufacture Industry (1)

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The Semiconductor Front End in the Controlled
Manufacture Industry

• www.kensingtonlabs.com

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• The semiconductor front end manufacturing
  industries worldwide are upgrading with robotics.
  To fulfill the needs of wafers productions and
  processing, Kensington Laboratories delivers the
  best with precise and controlled manufacture.
• Let us focus on the first three stages of the
  semiconductor production and the semiconductor
  firms that participate in the production process.

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The semiconductor firms conduct the activities
around three significant stages of semiconductor
production or fabrication. The factor that makes
them part of the process is that they are
performed in separate facilities.

• The Semiconductor Design
• This process is also known as fables
  manufacturing, and it is the specific stage
  dedicated to designing semiconductor devices. It
  is different than the other two stages. It
  doesn't indulge in activities in the
  semiconductor fabrication facility. It is why
  this stage is referred to as fables.

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• Front-end Semiconductor Fabrication
• This particular stage is referred to as the
  physical creation or fabrication of the
  semiconductor. It is performed in an ultra-clean
  facility, which is known as fab. This process
  indulges generating similar semiconductors over
  ultrapure round silicon wafers with excessive
  refined equipment, materials, and other
  techniques. It is highly capital intensive, and
  its leading fabs can charge multiple billion
  dollars to construct it.
• Back-end Assembly and Packaging
• Once the front end fabrication stage has gotten
  passed, then the finished Wafer front
  end semiconductor is then carried away to other
  manufacturing facilities where there would be the
  final stage formation. This stage is referred to
  as backend assembly, test, and packaging. It
  mainly begins when the finished wafer forms
  distinctive semiconductor devices or say, dies.
  After that, the die will be tested with the
  abandoned defects, and every functioning die
  packages into full semiconductor devices that are
  ready for final sale to the end customers.

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Wafer Front-end Fabrication

• Similar integrated circuits that are known as die
  are built upon every wafer in a multi-step
  process. Every step counts up an additional layer
  to the wafer or molds the existing one. These
  layers conceive the elements of the specific
  electronic circuits.

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