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Global System in Package Market (1)

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Global System in Package Market is expected to reach 11.26 Billion by 2024 from 5.44 Billion in 2016 at 9.5 % CAGR of (Detailed analysis of the market CAGR is provided in the report – PowerPoint PPT presentation

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Date added: 22 May 2019
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Title: Global System in Package Market (1)


1
  • Global System in Package Market is expected to
    reach 11.26 Billion by 2024 from 5.44 Billion in
    2016 at
  • 9.5 CAGR of (Detailed analysis of the market
    CAGR is provided in the report).
  • Global System in Package Market
  • Global System in Package Market is divided in six
    key market segments that include
  • By Packaging Technology
  • By Package Type
  • By Device
  • By Packaging Method
  • By Application
  • By Geography

The System in Package is a technique used in
latest mechanizations for packaging of small or
microelectronic bits bounded in a single module.
This Integration of microelectronic bits
increases the performance of the device and also
helps in reduction of the production cost. The
System in Package mostly adopted in various
applications in consumer electronics,
telecommunications and automotive due to its
enhanced efficiency and durability. Global System
in Package Market is mainly driven by rising
demand in the semiconductor packaging industry
for efficient electronic devices with high
performance and durability. Due to variation in
some physical properties like thermal expansion
of electrical components used in packaging with
respect to material of ICs, is considered to be
drawback of in system in package technology,
which restrains the growth of Global System in
Package Market. The report has addresses and
analyzed the Global System in Package Market by
five key geographies i.e.
2
  • North America
  • Europe
  • Asia-Pacific
  • Middle East Africa
  • Latin America
  • APAC region is going to emerge as one of the
    faster growing market in forecast period followed
    by North America and Europe.
  • Key Highlights
  • Assessment of market definition along with the
    identification of key players and analysis of
    their strategies to determine the competitive
    outlook of the market, opportunities, drivers,
    restraints and challenges for Global System in
    Package Market during the forecast period
  • Complete quantitative analysis of the industry
    from 2016 to 2024 to enable the stakeholders to
    capitalize on the prevailing market opportunities
  • In-depth analysis of the industry on the basis of
    market segments, market dynamics, market size,
    competition companies involved value chain.
  • Global System in Package Market analysis with
    respect to packaging technology, packaging type,
    device, packing method , application and
    Geography to assist in strategic business
    planning.
  • Global System in Package Market analysis and
    forecast for five major geographies North
    America, Europe, Asia Pacific, Middle East
    Africa, Latin America and their key regions.

3
  • Research Methodology
  • The market is estimated by triangulation of data
    points obtained from various sources and feeding
    them into a simulation model created
    individually for each market. The data points are
    obtained from paid and unpaid sources along with
    paid primary interviews with key opinion leaders
    (KOLs) in the market.
  • KOLs from both, demand and supply side were
    considered while conducting interviews to get the
    unbiased idea of the market. This exercise was
    done at the country level to get the fair idea of
    the market in countries considered for this
    study. Later this country-specific data was
    accumulated to come up with regional numbers and
    then arrive at the global market value for Global
    System in Package Market.
  • Key players in Global System in Package Market
    are
  • Amkor Technology Inc.
  • TriQuint Semiconductor Inc.
  • KLA-Tencor Corporation
  • China Wafer Level CSP Co. Ltd
  • ChipMOS Technologies Inc
  • STATS ChipPAC Ltd.
  • IQE PLC
  • Deca Technologies
  • Siliconware Precision
  • AOI Electronics
  • Tongfu Microelectronics

4
  • Semiconductor foundry players
  • Outsourced semiconductor assembly testing
    services players
  • Integrated device manufacturers
  • Research institutes and organisations
  • Integrated circuit designers
  • System in package manufactures
  • The scope of the Global System in Package Market
  • The research report segments Global System in
    Package Market based on packaging technology,
    packaging type, device, packing method,
    application and Geography.
  • Global System in Package Market, By Packaging
    technology
  • 2-D IC Packaging
  • 2.5-D Packaging
  • 3-D Packaging
  • Global System in Package Market, By Packaging
    type

5
Maximize Market Research provides B2B and B2C
research on 20,000 high growth emerging
opportunities technologies as well as threats
to the companies across the Healthcare,
Pharmaceuticals, Electronics Communications,
Internet of Things, Food and Beverages, Aerospace
and Defense and other manufacturing
sectors. Contact info Name Lumawant
Godage Organization MAXIMIZE MARKET RESEARCH
PVT. LTD. Email sales_at_maximizemarketresearch.com
Address Omkar Heights, Sinhagad Road, Manik
Baug, Vadgaon Bk,Pune, Maharashtra 411051, India.
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