Molded Interconnect Devices Market to hit USD 840 million by 2024 - PowerPoint PPT Presentation

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Molded Interconnect Devices Market to hit USD 840 million by 2024


Request Sample of Report @ The European molded interconnect devices (MID) market is projected to grow at a CAGR of 10.5 % from 2018 to 2024. The presence of a large number of prominent automotive OEMs in the region, particularly in Germany, France, and Italy, will promote industry growth. The surge in the provision of automotive electronics and advanced features by automotive OEMs has enabled the development of MID for applications such as seatbelt safety systems, positioning sensors, light fixtures, etc. The German molded interconnect devices market is characterized by the presence of some prominent vendors such as LPKF Laser & Electronics AG, Harting Mitronics AG, and Teprosa AG, among others. – PowerPoint PPT presentation

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Title: Molded Interconnect Devices Market to hit USD 840 million by 2024

Molded Interconnect Devices Market to cross
840mn by 2024 Global Market Insights Inc.
Fuel Cell Market size worth 25.5bn by 2024
Key Insights from Molded Interconnect Devices
  • (MID) Molded Interconnect Devices Market was
    estimated at over USD 320 million in 2017, is set
    to expand USD 840 million by 2024 according to a
    new research report by Global Market Insights,
    Inc. The molded interconnect devices market is
    projected to witness a strong growth across
    consumer device applications owing to the ability
    of the devices to integrate numerous electrical
    and mechanical functions, reduce circuit density,
    and facilitate miniaturization of the products.
  • The devices require fewer auxiliary components,
    thereby saving considerable costs and driving the
    industry growth. Low failure ratio and high
    reliability of these devices can be attributed to
    the existence of less auxiliary components and a
    low degree of system complexity. These devices
    also have superior environmental benefits such as
    recyclable thermoplastic materials with minimal

  • These devices enable the combination of
    mechanical components and electrical circuits on
    three-dimensional thermoplastic materials. The
    technology allows to integration of chips
    directly with their assemblies, saving space and
    facilitating miniaturization. For instance, the
    smartphone antennas can be installed directly
    within the housing with the help of the devices.
    The products can be manufactured with fewer
    assembly steps as compared to the traditional PCB
    manufacturing and offer a high degree of freedom
    to circuit designers. Integration of sensors and
    functions reduces assembly time and production
    steps, resulting in high-quality components and
    optimization of supplementary costs. These
    factors are anticipated to positively impact the
    MID market growth over the coming years.
  • LDS molded interconnect devices market is
    expected to grow at a CAGR of over 15 over the
    forecast timespan. Several industrial and
    aerospace defense manufacturers are developing
    compact and advanced models by integrating
    mechanical electrical functions in a single
    product. This helps manufacturers to save
    production costs and offer aesthetically-improved
    features along with the reduction in their
    production times.

U.S. molded interconnect devices (MID) market
size, by end-use, 2017 2024 (USD Million)


Browse Full Market Research Report On Molded
Interconnect Devices Market _at_ https//
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Report _at_ https//
  • A major trend driving the molded interconnect
    devices market is the implementation of the
    devices for LDS in the automotive industry. These
    devices are used for reducing vehicle weight and
    increasing reliability owing to the benefits such
    as the elimination of circuits boards and wired
    circuitry. Rapid technological advancements in
    seatbelt safety system, position sensors, brake
    sensors, motorcycle LED lights, steering wheel
    hubs, and control switches are generating several
    opportunities for the industry growth.
  • Moreover, the devices provide video-based driving
    assistance by using vehicle camera systems,
    thereby strengthening the driver safety. Vehicle
    tracking systems are majorly implementing these
    devices in the LED displays and monitors to
    assist parking and traffic situations and monitor
    the driving behavior. Design flexibility and low
    cost of the solution are expected to drive the
    growth of the automotive molded interconnect
    device market.

  • The Asia Pacific MID market is projected to
    exceed USD 400 million by 2024. Strong growth in
    the region can be attributed to the presence of
    several companies including Samsung Electronics,
    Co., Ltd. and Sony Corporation. These companies
    are expanding and upgrading their product
    portfolio thereby offering several opportunities
    for vendors operating in the molded interconnect
    devices market. Several players in the region are
    also entering into collaborations for the
    development of new technologies. They are
    offering high-end products at competitive prices
    and are adopting aggressive marketing strategies.
    The exponential advancements in the technology
    and increasing commercialization of several
    innovative products have resulted in high growth
    prospects thereby attracting more players to the
    MID market.
  • Key industry players operating in the molded
    interconnect devices market include MacDermid
    Enthone, Harting Mitronics, Molex, SelectConnect
    Technologies, and RTP Company. The designers and
    electronic developers have expanded their
    capabilities in the prototyping and functioning
    of the final device by using advanced 3D design
    tools such as the Target 3001.

Industry Coverage

Table OF Content
Chapter 1. Methodology and Scope 1.1.
Methodology 1.1.1. Initial data
exploration 1.1.2. Statistical model and
forecast 1.1.3. Industry insights and
validation 1.1.4. Definition and forecast
parameters Definitions
Assumptions, methodology and forecast
parameters 1.2. Data Sources 1.2.1.
Primary 1.2.2. Secondary Chapter 2. Executive
Summary 2.1. MID industry 3600 synopsis, 2013 -
2024 2.1.1. Business trends 2.1.2. Process
trends 2.1.3. End-use trends 2.1.4. Regional
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