Molded Interconnect Devices Market – Global Industry Analysis Report, Share, Size, Growth, Price Trends and Forecast, 2024

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Molded Interconnect Devices Market Global
Industry Analysis Report, Share, Size, Growth and
Forecast, 2016 2024 Fractovia.org
Fuel Cell Market size worth 25.5bn by 2024
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Key Insights of Molded Interconnect Devices
Market

• Molded interconnect devices market share worth
  USD 225 million in 2015, is predicted to touch
  USD 692.45 million by the end of 2024, with a
  CAGR of 13.8 over the period of 2016-2024.
  Factors such as high functional density and
  flexible design are predicted to benefit the
  industry growth over the next few years.
• Molded interconnect devices support
  miniaturization by integrating electronic
  mechanical parts and circuits directly on 3D
  plastic devices. They integrate functions and
  help in minimizing assembly time, resulting in
  the production of high-quality parts. This helps
  in saving costs and reducing the production time
  as only a few components are involved in the
  system.
• High reliability owing to design flexibility of
  the products and less auxiliary parts along with
  eco-friendly features are some of the factors
  predicted to boost the market demand in the next
  eight years.

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Continued

• These devices are finding growing applications in
  automotive, medical, telecommunication,
  industrial, and consumer sectors. They find their
  implementation in products like cell phones,
  antennas, joysticks, cars, flashlights, and
  airplanes.
• Automotive application segment is anticipated to
  be worth USD 82.5 million by 2024, with a CAGR of
  14.8 over the period of 2016-2024 due to rising
  acceptance of molded interconnect devices in
  brake-light fixtures.
• Medical applications segment worth USD 7.6
  million in 2015, is predicted to touch USD 22
  million by 2024. Growing awareness about benefits
  of device use is expected to boost the segment
  growth over the forecast period.
• Telecommunications applications segment is
  anticipated to record a CAGR of 13.6 over the
  period of 2016-2024 owing to rising use of
  antennas.

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China molded interconnect device market size, by
application, 2012-2023 (USD Million)

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Continued.

• Asia Pacific molded interconnect devices (MID)
  market worth USD 175 million in 2015, is
  predicted to touch USD 555.5 million by 2024 with
  a CAGR of 14.3 over the forecast timeline. The
  growth in this region is primarily attributed to
  the easy availability of components with low
  costs in countries like China.
• Europe MID market size worth USD 24 million in
  2015, is anticipated to record a CAGR of 12.2
  over the period of 2016-2024 as a result of the
  large-scale production of vehicles contributing
  towards the regional growth.
• U.S. molded interconnect devices (MID) market
  share is expected to surpass USD 27.5 million by
  the end of 2024.
• Key industry players include MacDermid
  Incorporation, Harting Technology Group,
  SelectConnect Technologies, Molex, and RTP
  Company.

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