Semiconductor & IC Packaging Materials Market - Regional Trends & Forecast to 2019 - PowerPoint PPT Presentation

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Semiconductor & IC Packaging Materials Market - Regional Trends & Forecast to 2019

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Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019 – PowerPoint PPT presentation

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Title: Semiconductor & IC Packaging Materials Market - Regional Trends & Forecast to 2019


1
MarketsandMarkets Presents
  • Semiconductor IC Packaging Materials Market 
  • Regional Trends Forecast to 2019

2
  • Semiconductor and IC Packaging materials are
    mainly developed to protect the electronic
    components such as semiconductors and ICs from
    external impact and corrosion. A few types of
    semiconductor and IC packaging materials are
    organic substrates, bonding wires, leadframes,
    and encapsulation resins. These materials are
    manufactured with several types of packaging
    technologies such as SP, GA, QFN, and DFN. The
    semiconductor packaging materials market revenue
    was estimated to be 21 billion in 2013.
  • Due to the recent global economic downturn in
    2008, the electronics packaging market witnessed
    a downfall of over 20. The decreased revenue in
    the semiconductor packaging materials market is
    due to the gradual decrease in demand of gold
    bonding wires and also the fluctuations in
    currency exchange rates.

3
  • http//www.marketsandmarkets.com/Market-Reports/se
    miconductor-ic-packaging-materials-market-31363123
    .html
  • Based on the types the semiconductor packaging
    materials market can be classified into eight
    types such as organic substrates, bonding wires,
    lead frames, encapsulation resins, ceramic
    packages, die attach materials, thermal interface
    materials, solder balls, and others. Organic
    substrates constitute the major global market in
    semiconductor and IC packaging materials and are
    widely used as base materials for the packaging
    of semiconductors and ICs. Bonding wires mainly
    of gold have been widely used as packaging
    materials, but lately there has been a shift
    towards copper bonding wires.

4
  • The semiconductor and IC packaging materials
    market is driven by the range of applications,
    which increases the RD efforts to make
    electronic packaging materials highly
    resourceful, along with the huge demand from the
    electronic components industry due to increased
    population that finds electronic packaging
    materials useful in a myriad of applications.
    Growing advancements and technological inventions
    in semiconductor packaging materials market would
    be quite effective in the future. These materials
    have been well perceived in various dominant
    end-user markets in the last few decades, and are
    expected to be used for diverse applications in
    the future.

5
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6
About MarketsandMarkets
MarketsandMarkets is a global market research and
consulting company based in the U.S. We publish
strategically analyzed market research reports
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