Global 3D IC Market worth $6.55 billion by 2016 at CAGR of 16.9% - PowerPoint PPT Presentation

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Global 3D IC Market worth $6.55 billion by 2016 at CAGR of 16.9%

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The recent report of marketsandMarkets about 3D IC Market forecast that the 3D IC market is expected to reach $6.55 billion by end of 2016 at a CAGR of 16.9%, Followed by North America 35% and Asia is observed to hold the highest share of around 40%. – PowerPoint PPT presentation

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Title: Global 3D IC Market worth $6.55 billion by 2016 at CAGR of 16.9%


1
MarketsandMarkets Presents
Global 3D IC and TSV Interconnect Market worth
6.55 billion by 2016

http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
2
According to a new market research
report Three-dimensional Integrated Circuit (3D
IC/Chip) Through-Silicon Via (TSV)
Interconnects Market - Global Forecast Trend
Analysis (2011 - 2016) By Technology (Substrate,
Bonding Techniques, Process Realization,
Fabrication), Products (Memory, LED, Sensor,
MEMS, Power Analog Components) Applications
(Mobile Devices, Processors, ICT, Networking,
Automotive, Defense) published by
MarketsandMarkets, the total 3D IC market is
expected to reach 6.55 billion by 2016 at a CAGR
of 16.9 from 2011 to 2016. Browse 30 tables and
in-depth TOC on 3D IC Chip and TSV Interconnect
Market Global Forecast and Analysis
(2011-2016).  http//www.marketsandmarkets.com/M
arket-Reports/3D-IC-Chip-and-TSV-Interconnect-Mark
et-117.html
 
http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
3
Early buyers will receive 10 customization on
this report.

 
http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
4
  • The transition from 2 dimensional (2D) packaging
    to 3D packaging is considered to be one of the
    major developments in the semiconductor industry.
    3D packaging is observed to pave way for the
    concept of More than Moore with comparatively
    lesser investment. This has led to strategic
    innovation with respect to 3D integration despite
    the economic downturn. The use of TSV
    interconnects within die stack instead of
    wirebond interconnect and board-level routing
    helps to save the system energy consumption to a
    large extent. Some of the early innovations
    related to TSV include that from Samsung (South
    Korea) and Xilinx (U.S.).


http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
5
  • The two categories of substrates used in the
    production of 3D ICs include silicon on insulator
    (SOI) and bulk silicon. High cost is observed to
    be the key factor hindering the adoption of SOI
    wafer on a large scale. The different bonding
    techniques employed include die to die, die to
    wafer, wafer to wafer, direct bonding, adhesive
    bonding, and metallic bonding. The yield achieved
    in wafer to wafer process is generally below 85
    due to Known Good Die (KGD) issues and is thus
    observed to be cost prohibitive. In direct
    bonding, the wafers can be bonded at room
    temperature. This, in turn, helps to eliminate
    the problem of misalignment, which arises due to
    thermal expansion of one wafer relative to the
    other at the time of bond reaction.


http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
6
  • With respect to process realization techniques,
    it is believed that wafer to wafer and via middle
    processes will become the preferred standard for
    volume production of 3D ICs mainly due to the
    reduced cost of the end-product. On the other
    hand, via last approach can be performed with the
    currently available infrastructure and hence they
    are expected to open the path to better market
    adoption for 3D integration.
  • Amongst the various end-products for 3D ICs and
    TSV interconnects, memories are observed to be
    the most potential product market with a market
    share of approximately 40. This is followed by
    sensors and in particular, image sensors.
    Consumer electronics application sector is
    observed to hold the largest share in 3D ICs and
    TSV interconnects market with high demand for it
    in a number of end-products such as smart phones,
    tablet PCs, e-readers, laptops, and more.


http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
7
  • The two categories of substrates used in the
    production of 3D ICs include silicon on insulator
    (SOI) and bulk silicon. High cost is observed to
    be the key factor hindering the adoption of SOI
    wafer on a large scale. The different bonding
    techniques employed include die to die, die to
    wafer, wafer to wafer, direct bonding, adhesive
    bonding, and metallic bonding. The yield achieved
    in wafer to wafer process is generally below 85
    due to Known Good Die (KGD) issues and is thus
    observed to be cost prohibitive. In direct
    bonding, the wafers can be bonded at room
    temperature. This, in turn, helps to eliminate
    the problem of misalignment, which arises due to
    thermal expansion of one wafer relative to the
    other at the time of bond reaction.


http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
8
  • The global 3D IC market is expected to grow from
    2.21 billion in 2009 to 6.55 billion in 2016 at
    a CAGR of 16.9 from 2011 to 2016. Asian region
    is observed to have the highest growth rate. This
    is mainly attributed to the presence of a huge
    number of companies such as Taiwan Semiconductor
    Manufacturing Company Limited (Taiwan), Samsung
    (South Korea), United Microelectronics
    Corporation (Taiwan), and more who contribute to
    different aspects of 3D IC manufacturing and thus
    help to address the challenges associated with
    its manufacture in a cost effective manner.


http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
9
Contact Us
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Road, Suite 800, Dallas, TX 75252Tel
1-888-6006-441Email sales_at_marketsandmarkets.com
 MarketsandMarkets Bloghttp//twitter.com/market
smarkets
http//www.linkedin.com/company/marketsandmarkets
http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
10
About MarketsandMarkets
MarketsandMarkets is a global market research and
consulting company based in the U.S. We publish
strategically analyzed market research reports
and serve as a business intelligence partner to
Fortune 500 companies across the
world. MarketsandMarkets also provides
multi-client reports, company profiles,
databases, and custom research services. They
cover thirteen industry verticals, including
advanced materials, automotives and
transportation, banking and financial services,
biotechnology, chemicals, consumer goods, energy
and power, food and beverages, industrial
automation, medical devices, pharmaceuticals,
semiconductor and electronics, and
telecommunications and IT. We at
MarketsandMarkets are inspired to help our
clients grow by providing apt business insight
with our huge market intelligence repository.
http//www.marketsandmarkets.com/Market-Reports/3D
-IC-Chip-and-TSV-Interconnect-Market-117.html
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