0. Deposit film of interest onto substrate.

1
Patterning using Photolithography Pattern
Transfer by Etching
All the patterns (devices features) to make the
transistors are made using the photolithographic
process.
0. Deposit film of interest onto substrate.

2. Softbake photoresist to dry it.
3. Align photomask to wafer features.
4. Expose photoresist through mask.
5. Develop photoresist.
6. Etch film using resist as a mask.
7. Strip the remaining photoresist.
1. Spin photoresist onto wafer.
thick SiO2
Si wafer
At the end of the sequence, new features have
been patterned in the film.