The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022

View by Category
About This Presentation
Title:

The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022

Description:

Report Description Table of Content Summary Request Sample According to the MarketsandMarkets forecasts, the flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The growth of flip chip technology market is mainly attributed to the increasing demand for miniaturization and high performance in electronic devices and strong penetration of the advanced packaging technology in the consumer electronics sector. There has been considerable reduction in the size of the die, with the introduction of flip chip packaging technology, thereby saving the silicon cost – PowerPoint PPT presentation

Number of Views:5

less

Write a Comment
User Comments (0)
Transcript and Presenter's Notes

Title: The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022


1
Flip Chip Technology Market by Wafer Bumping
Process (CU Pillar, Lead-Free), Packaging
Technology (2D IC, 2.5D IC, 3D IC), Packaging
Type (BGA, PGA, LGA, SIP, CSP), Product (Memory,
LED, CPU, GPU, SOC), Application and Geography -
Global Forecast to 2022
www.MarketsandMarkets.com
2
According to the new market research report "Flip
Chip Technology Market by Wafer Bumping Process
(CU Pillar, Lead-Free), Packaging Technology (2D
IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA,
LGA, SIP, CSP), Product (Memory, LED, CPU, GPU,
SOC), Application and Geography - Global Forecast
to 2022 The flip chip technology market is
expected to grow from USD 19.01 Billion in 2015
to USD 31.27 Billion by 2022, at a CAGR of 7.1
between 2016 and 2022. The flip chip technology
market is driven by factors such as increasing
demand for miniaturization and high performance
in electronic devices, and strong penetration in
consumer electronics sector. PDF Brochure
https//www.marketsandmarkets.com/pdfdownload.asp
?id264572064

3
3D IC packaging technology to register the
highest growth rate On the basis of packaging
technology, the flip chip technology market is
segmented into 2D IC, 2.5D IC, and 3D IC
packaging technology. With the semiconductor
technology moving towards integration of diverse
chips, 2.5D IC packaging technology and 3D IC
packaging technology are becoming the mainstream
trend in obtaining the integration objectives.
Owing to the growing demand for increasing
density, higher bandwidth, and lower power,
design teams are expected to adopt 3D ICs with
TSVs, which promise more than Moore integration
by packaging a great deal of functionality into
small form factors, while improving performance
and reducing costs. Applications in consumer
electronics held the largest market size and
would also grow at the highest rate Smartphones
tablets are observed to have the highest
adoption among all the consumer electronic
devices, owing to their small form factor and
better performance requirements to operate at a
higher bandwidth, at a relatively lower cost. The
automotive market is expected to grow at a
second-highest CAGR rate, catapulting the flip
chip technology market further.
4
The market in Asia-Pacific to grow at the highest
rate The APAC held a large share of the overall
flip chip technology market in 2015 moreover,
the market in APAC is expected to grow at the
highest CAGR between 2016 and 2022. Countries in
Asia-Pacific are major manufacturing hubs and are
expected to provide ample opportunities for the
growth of the flip chip technology. On the
basis of wafer bumping process, the flip chip
technology market is segmented into copper
pillar, lead free, tin/lead eutectic solder, and
gold stud plated solder. The product segment
consists of CPU, SoC, GPU, memory, LED, CMOS
image sensor, and RF, mixed signal, analog, and
power IC. On the basis of application, the market
is segmented into consumer electronics,
telecommunications, automotive, industrial
sector, medical devices, smart technologies, and
military and aerospace. The packaging type
segment includes FC BGA, FC PGA, FC LGA, FC QFN,
FC SiP, and FC CSP. The packaging technology in
flip chip has been segmented into 2D IC, 2.5D IC,
and 3D IC. This global report gives a detailed
view of the market across the four regions,
namely, Americas, Europe, Asia-Pacific, and the
Rest of the World which includes the Middle East
and Africa. The report profiles the 10 most
promising players in the flip chip technology
market.
5
Browse gtgt 66 market data
tables 71 figures
157 Pages and in-depth TOC on Flip Chip
Technology Market- Global Forecast to
2023 Early buyers will receive 10
customization on this report. This is a Premium
Report Priced at Single user US
5650 Corporate User US8150 This study
answers several questions for the stakeholders,
primarily which market segments to focus on in
the next two to five years to prioritize efforts
and investments.
6
Key players - The Flip Chip Technology Market is
dominated by
  • Intel (U.S.), TSMC (Taiwan)
  • Samsung (South Korea)
  • GlobalFoundries (U.S.)
  • ASE group (Taiwan)
  • Amkor Technology (U.S.)
  • UMC (Taiwan)
  • STATS ChipPAC (Singapore)
  • Powertech Technology (Taiwan)
  • STMicroelectronics (Switzerland)

For More Information - https//www.marketsandma
rkets.com/Market-Reports/flip-chip-technology-mark
et-264572064.html
7
Contact Mr. Shelly Singh MarketsandMarkets
INC.630 Dundee Road Suite 430 Northbrook, IL
60062 USA 1-888-600-6441 Email
sales_at_marketsandmarkets.com