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Field Effect Transistors (FETs)

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Field Effect Transistors (FETs) In a field effect transistor, current flow through a semiconductor channel is controlled by the application of an electric field ... – PowerPoint PPT presentation

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Title: Field Effect Transistors (FETs)


1
Field Effect Transistors (FETs)
  • In a field effect transistor, current flow
    through a semiconductor channel is controlled by
    the application of an electric field (voltage)
    perpendicular to the direction of current flow.
  • We consider the MOSFET (MOST)- the metal oxide
    semiconductor (field effect) transistor.

2
Field Effect Transistors (FETs)
  • In a depletion mode MOSFET a channel is built in
    so that conduction occurs with no control voltage
    applied.
  • We consider an n-channel enhancement mode device
    which has no built-in conduction channel.

3
N-channel enhancement mode MOSFET (schematic)
Source (S)
4
Symbol for N-channel enhancement mode MOSFET
  • Note connection to substrate shown

5
Symbol for N-channel enhancement mode MOSFET
  • Note connection to substrate shown

6
N-channel enhancement mode MOSFET outline of
operation
  • VGS 0, little or no current can flow S ? D, back
    to back p-n junctions.
  • As a positive VGS is applied , holes in the
    p-region are repelled.
  • As VGS increases further, electrons are attracted
    from the substrate towards the positive gate.
  • An inversion layer of mobile electrons forms near
    the silicon surface.

7
N-channel enhancement mode MOSFET with inversion
layer
Source (S)
8
N-channel enhancement mode MOSFET outline of
operation
  • This inversion layer is effectively n-type.
  • Electrons can carry current in an continuous
    n-type path (or channel) from source to drain.
  • The conduction channel forms when VGS attains a
    threshold voltage, VT

9
N-channel enhancement mode MOSFET
  • The value of VT is determined by the device
    process and the level of the p-type (substrate)
    doping.
  • Note that an n-channel device is formed with a
    p-type substrate.

10
N-channel enhancement mode MOSFET
  • As VGS increases further, more electrons are
    drawn into the inversion layer and the channel
    resistance decreases (The device operates as a
    voltage controlled resistor).
  • However

11
N-channel enhancement mode MOSFET
  • The voltage between gate and channel varies from
    VGS at the source end to VGS -VDS at the drain
    end.
  • Thus as the voltage at the drain end, VDS , is
    increased the effective gate-channel voltage
    (vertical field) is decreased.

12
N-channel enhancement mode MOSFET
  • This causes the carrier density at the drain end
    of the inversion layer to decrease.
  • The current levels off or saturates.
  • The FET is then said to have entered its
    saturation region (This expression had a
    different meaning in our discussion of BJTs).

13
N-channel enhancement mode MOSFET
  • The boundary where saturation starts occurs at
    (VGS VDS ) VT.
  • i.e. VDS (VGS VT)
  • Ideally we would want a further increase in VDS
    to have no effect on the drain current ID

14
N-channel enhancement mode MOSFET
  • In practice as VDS is increased further ID also
    increases.
  • This is due to a reduction in the effective
    channel length with VDS .
  • We note, for design purposes, that the gate
    current (IG) is effectively zero. (We have an
    insulating oxide region)

15
N-channel Depletion mode MOSFET
  • In a depletion mode MOST a channel is built into
    the device.
  • Conduction occurs at VDS 0.
  • (The threshold voltage VT is negative)

16
Symbol for N-channel depletion mode MOSFET
  • Connection to substrate shown.
  • The solid line indicates that a physical channel
    exists at VGS 0.

17
P-channel devices
  • These are widely used, particularly in
    Complementary MOS (C-MOS) circuits.
  • Electron mobility is larger than hole mobility so
    n-channel devices are faster, i.e. they have a
    higher frequency response.

18
Plots and Equations, Enhancement mode, VT ? 2 V
19
FET Plots and equations
  • The FET is a voltage controlled device.
  • The control parameter is VGS compare with IB
    in the BJT.

20
Loose equivalences
  • FET
  • Drain
  • Source
  • Gate
  • BJT
  • Collector
  • Emitter
  • Base

21
Plots and Equations
Saturation region
22
Plots and Equations
Triode region
23
Transfer Characteristic
  • Gives the relationship between ID and VGS in the
    saturation (constant current) regime.
  • e.g. for an enhancement mode device

24
Transfer Characteristic
  • This I-V curve in the saturation region can be
    approximated by the parabola
  • This equation is very important!
  • The ID-VGS relationship is not a linear one!

25
Transfer Characteristic
  • K is a device parameter whose value is typically
    0.25mA/V2

26
Transfer Characteristic
  • Detailed analysis shows that
  • L channel length, W channel width, ?e
    electron mobility and Cox is the capacitance per
    unit area formed by the the gate-oxide- substrate

27
Transfer Characteristic
  • We could allow for channel length modulation by
    including a small linear dependence of ID on VDS
    in the saturation region.

28
Non-saturation (triode) region
29
Non-saturation (triode) region
30
Small Signal Model
  • In the saturation region we can model the square
    law device by a linear small signal equivalent
    circuit.
  • (Although the device characteristic is a parabola
    we approximate it by a straight line for small
    signals)

31
Small signal model
32
FET Small Signal Equivalent Circuit
33
FET Small Signal Equivalent Circuit
  • Channel length modulation makes the output
    resistance in saturation finite

r0
34
Bias Circuit A Voltage Divider Bias
  • Remember IG 0

VDD
RD
R1
ID IS
D
IG
S
G
R2
VGG
RS
IS ID
GND
35
Bias Circuit A
  • Solve VGS VGG IDRS
  • with
  • to give

36
Bias circuit A
37
Bias circuit A
  • This is a quadratic equation for ID.
  • Usually one solves for ID then for VGS and
    determines the small signal transconductance gm
    as

38
Bias circuits
  • We note that gm is determined by the d.c. bias
    condition in much the same way as the dynamic
    resistance r? was for the BJT.

39
Bias circuit B (Drain Feedback Bias)
VDD
RD
ID
RG 100M?
IG 0
IS ID
GND
40
Bias circuit B
  • IG 0
  • VGS VDS
  • VDD-RDID- VDS 0
  • For fixed supply VDD, an increase in ID means VDS
    decreases. This corresponds to a decrease in VGS
    which tends to decrease ID via
  • RG is large to minimise current flow from output
    back to input (we assume IG 0).

41
Common Source Amplifier
  • Same procedure as for BJT but using the simpler
    FET small signal equivalent circuit
  • Remember the FET has Zin? and id is

ig ?0
id
G
D
vgs
gmvgs
vds
S
42
For Example Common Source Amplifier with Bias
Circuit A
VDD
RD
R1
vout
R2
RS
vi
GND
43
For Example Common Source Amplifier with Bias
Circuit A
D
id
RD
gmvgs
vds
S
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