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The Market for Thermal Management Technologies

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Title: The Market for Thermal Management Technologies


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The Market for Thermal Management Technologies
Bharat Book Bureau

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Summary
  • REPORT HIGHLIGHTSThis report provides
  • An overview of the global market for thermal
    management products, including hardware,
    software, interface products, and substrates.
  • Analyses of global market trends, with data from
    2011 and 2012, and projections of compound annual
    growth rates (CAGRs) through 2017.
  • Discussion of individual materials, hardware, and
    software product segments in terms of market size
    and revenue trends.
  • Forecasts for the most important applications by
    product.
  • Examination of the competitive aspects of each
    product segment, along with several successful
    suppliers strategies in the market.
  • A current industry directory, a survey of recent
    U.S. thermal management patents and patent
    applications pending.

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  • REPORT SCOPE
  • In recent years, there has been tremendous
    progress, technologically and in terms of demand,
    in electronic devices and systems. The
    technological progress has come on two main
    fronts increased functionality on a single device
    unit and miniaturization of each unit. Both of
    these developments have increased the need for
    thermal management technologies.Thermal
    management is the term used to describe the
    array of material technologies and
    problem-solving design tools that systems
    manufacturers apply to regulate the unwanted heat
    caused by the normal functioning of an electronic
    system.This report segments thermal management
    technologies into four segments hardware,
    software, interfaces and substrates.

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  • The hardware segment includes several product
    subsegments, including heat sinks, fans and
    blowers, fan sinks, heat pipes and cold plates.
    These segments were chosen because they are
    established technologies and represent revenue
    markets of significant size.The software
    segment consists of electronic design software
    designed to model and analyze the thermal
    characteristics of an electronic system design.
    Specific types of thermal management software
    examined in this study include computational
    fluid design (CFD), computational heat transfer
    (CHT), power management, circuit design and other
    electronic design automation (EDA).

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  • Thermal management interface materials are
    products that stand between a heat sink and the
    device to be cooled, where their function is to
    improve the thermal transfer in the joint between
    the heat sink and the device to be cooled by
    increasing or securing the area of contact
    between the two surfaces. In some cases, the
    interface actually performs the job of the heat
    sink. This role has become increasingly common in
    a number of applications in which, due to the
    height or weight constraints of the system, a
    conventional hardware heat sink is not
    feasible.Finally, the report analyzes
    substrates, which are the foundations of
    integrated circuits (ICs), or planar components
    of electronic packages or modules. The report
    focuses on substrates that have been developed
    specifically to enhance the thermal handling
    capability of an electronic component.

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  • STUDY GOAL AND OBJECTIVESThis report is
    an update of an earlier BCC Research report
    prepared in 2011. The overall goal of this
    updated report is to provide an analysis of the
    most recent developments and current trends in
    the global thermal management marketplace.
    Specific objectives include
  • Identifying thermal management technologies and
    products with the greatest commercial potential
    in the near to mid-term (20122017).
  • Analyzing the key drivers and constraints that
    will shape the market for thermal management
    technologies and products over the next five
    years.
  • Estimating the current and future demand for
    thermal management technologies and products.
  • Ascertaining the companies that are best
    positioned to meet this demand because of
    proprietary technologies, strategic alliances or
    other advantages.

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  • INTENDED AUDIENCEThis report is intended
    especially for suppliers of thermal management
    technologies and products, and others with a need
    to understand the status and dynamics of the
    market for these products. Although the report is
    organized around specific technologies, it is
    largely nontechnical in nature and coverage. That
    is, it is concerned less with theory and jargon
    than with what works, how much the market is
    likely to purchase and at what price.As such,
    the reports main audience is executive
    management personnel and marketing and financial
    analysts. It is not written specifically for
    scientists and technologists, although its
    findings concern the market for their work and
    include the availability of government and
    corporate research funding for different
    technologies and applications, which should
    interest them.

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  • SCOPE AND FORMATThe scope of this report
    is broad, covering several product areas. The
    individual materials, hardware and software
    product segments are presented in terms of market
    size and revenue trends. The revenue forecasts
    are explained in terms of the key market issues
    for that product segment, and are projected for
    five years from 2012 to 2017. The application
    sections feature forecasts for the most important
    applications by product.The technology
    discussion concentrates on trends that will
    develop more significantly during the forecast
    period. The report also includes a discussion on
    the competitive aspects of each product segment,
    along with several successful suppliers
    strategies in the market. A current industry
    directory, a survey of recent U.S. thermal
    management patents and patent applications
    pending, and profiles of a selection of the
    leading thermal management suppliers are also
    included.

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  • The report addresses the global market for
    thermal management products during the period
    from 2011 through 2017, including
  • Thermal management hardware.
  • Thermal management software.
  • Thermal management interface products.
  • Thermal management substrates.
  • The report format includes the following
    major elements.
  • Executive Summary.
  • Thermal management industry overview.
  • Thermal management products major segments,
    subsegments, technology trends,
  • applications, world market estimates and
    projections.
  • Industry structure market shares and company
    profiles.
  • Patent analysis.

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  • METHODOLOGYThe findings and conclusions
    of this report are based on information gathered
    from a variety of sources, using both primary and
    secondary research methodologies. Sources of
    information include Internet searches and
    industry association data, and interviews
    conducted with thermal management component
    suppliers, custom engineering companies and
    manufacturers of representative applications. In
    addition, other secondary sources were consulted
    for the report, including industry journals and
    publications, product literature, white papers
    and technical journals, and financial reports for
    industry suppliers.The base year for analysis
    and projection is 2011. With 2011 as a baseline,
    market projections were developed for 2012 and
    2017. These projections are based on a
    combination of a consensus among primary contacts
    combined with our understanding of key market
    drivers and their impact from a historical and
    analytical perspective. The analytical
    methodologies used to generate the market
    estimates are described in detail in the market
    analysis. All dollar projections presented in
    this report are in 2011 constant dollars. 

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    devices-market-research-report/the-market-for-ther
    mal-management-technologies.html Contact us

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  • Phone 91 22 27810772, 27810773

  • Toll Free No for USA/Canada 1-866-279-83

  • E-mail info_at_bharatbook.com

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