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Using SystemonaChip as a Vehicle for VLSI Design Education

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Title: Using SystemonaChip as a Vehicle for VLSI Design Education


1
Using System-on-a-Chip as a Vehicle for VLSI
Design Education
  • Andrew Laffely and Wayne Burleson
  • Electrical and Computer Engineering
  • University of Massachusetts Amherst
  • alaffely,burleson_at_ecs.umass.edu

This material is based upon work supported by the
National Science Foundation under Grant No.
9988238 and SRC Tasks 766 and 1075
2
Challenges in VLSI Education
  • Advancing Processing Technology
  • Higher level design tools
  • Realistic yet tractable design projects
  • Preparation for jobs in semiconductor and other
    sectors.
  • Making best use of faculty/student time and
    university resources

3
ECE 559/659 VLSI Design Project (10 grads, 20
seniors)
Course Objectives
  • Learn design process for a complex VLSI in deep
    sub-micron CMOS
  • Learn VLSI design skills and tools, including
    working in teams
  • Learn about a particular application component
    and its VLSI implementation
  • Learn to present formal design reviews using
    oral, written, graphical and web-based techniques

4
Key Aspects of the Course
  • aSoC (home-grown SoC platform)
  • Provides a unifying framework to class
  • Allows for subdivision but inter-relation of
    projects
  • Interesting cutting edge architecture based on
    NSF- and SRC-funded research at UMASS and
    elsewhere
  • Covers many aspects of VLSI Design
  • Realistic constraints on area, timing, power and
    I/O
  • Graduate and undergraduate teamwork
  • Graduate students provide leadership, motivation
    and experience
  • Commercial tools and design flow
  • Review-based evaluation
  • Oral and web-based reports for 4 different
    reviews
  • proposal, feasibility, implementation,
    integration

5
Adaptive System-on-a-Chip (aSoC)
  • Tiled architecture with mesh interconnect
  • Point to point communication pipeline
  • Allows for heterogeneous cores
  • Differing sizes, clock rates, voltages
  • Low-overhead core interface for
  • On-chip bus substitute for streaming applications
  • Based on static scheduling
  • Fast and predictable

6
Communication Interface
Core
  • Custom design to maximize speed and reduce power
  • Core-ports
  • Crossbar
  • Controller
  • Instruction memory
  • Local frequency and voltage supply

Core-ports
North
North
South
South
East
East
West
West
Outputs
Inputs
Local Config.
Local Frequency Voltage
Decoder
Controller
Crossbar
North to South East
PC
Instruction Memory
7
Class Projects
  • SoC Infrastructure1,3
  • Communication Interface
  • Interconnect3
  • Power Distribution
  • Clock System
  • Power Management
  • Cores
  • Motion estimation for video encoding2,3
  • AES Cryptography3
  • Cache2,3
  • Huffman Coding
  • 3D Graphics1,2,3
  • Discrete Cosine Transform2,3
  • Smart Card2,3

1 Used in PhD Dissertation 2 Used in Masters
Thesis 3 Used in Publications
8
Design Flowhttp//vsp2.ecs.umass.edu/vspg/658/TA_
Tools/design_flow.html
  • Architecture to Layout
  • Architecture Block diagram of system and
    behavioral description
  • Logic Gate level or schematic description
  • Circuit Transistor sizing
  • Layout Floorplanning, clock and power
    distribution
  • Tools
  • VerilogXL behavioral representation
  • VTVT standard cell library
  • Synopsys standard cell gate level netlist
    generation
  • Silicon Ensemble standard cell netlist to layout
  • Cadence LayoutPlus schematic and layout design
  • NCSU CDK design and extraction rules
  • Cadence Layout vs. Schematic layout verification
  • HSPICE circuit simulator

9
aSoC Implementation and Integration
2500 l
.18m TSMC technology Full custom
3000 l
10
Advanced Signaling Techniques (building on
SRC-funded work)
Differential current sensing
Booster Insertion
Multi-level current signaling
Phase coding
11
Circuit Level Simulation (HSPICE)Evaluating
Subsystems with realistic models
  • Capacitance, resistance and inductance
  • Process variations
  • Process generations

12
Interconnect CharacterizationComparing delay
and power of signaling techniques for different
tile sizes at 250nm, 180nm, 130nm, 100n
13
Voltage Scaling Approach
  • Core-ports
  • Single buffer for each stream to cross
    clock/voltage barrier between core and interface
  • Reading/Writing success rates indicate core
    utilization
  • Input blocked Core too slow
  • Output blocked Core too fast
  • Controller
  • Interprets core-port success rates to adjust
    local clock and voltage

Core
Processing Pipeline
Local Vdd
Local Clock
Buffer
Input Core-port
Output Core-port
Clock and Supply Controller
Blocked
Blocked
Interconnect
14
Vdd Selection Criteria
Normalized Core Critical Path Delay vs. Vdd
12
Normalized Delay
  • As Vdd decreases delay increases exponentially
  • Use curve to match available clock frequencies to
    voltages
  • The voltage and frequency change reduces power by
    79, 96, and 98.7
  • P aC(Vdd)2f

10
1/8 Speed
8
6
1/4 Speed
4
1/2 Speed
2
Max Speed
0
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0.73
1.16
Voltage
15
Clock Distribution
Tile
  • Tiled architecture extends life of globally
    synchronous systems
  • Precise H-tree implementation
  • Load is small and equal at each branch
  • Skew can be reduced by 70 with advanced deskew
    circuits1

1 S. Tan et al. Clock Generation and
Distribution for the First IA-64 Microprocessor
IEEE JSSC, Nov. 2000
16
Power Distribution
  • Heterogeneous cores may require multiple power
    supply voltages
  • Tile structure enables uniform interwoven grid
  • Larger grid for higher current demands
  • Reduced resistance
  • Higher capacitance

Gnd
Vml
Vl
Vmh
Vh
17
Architecture Evaluation(Motion Estimation)
Memory
  • Array-based architecture
  • Pipelined ME
  • Parameterized search window size
  • Full search
  • Choose 16x16 or 8x8 windows
  • Reduce power

FIFOs
Address Generation Unit
Processing Element Array
18
Modify Existing Designs
  • Take existing Verilog code or hardware and
    improve or change functionality (e.g. add motion
    estimation algorithms, provide AES key-length
    flexibility)
  • Evaluate changes in performance and overhead

- Old PE Layout - New
PE Layout
19
Conclusions
  • Advancing Process Technology
  • Target .18u for affordable fab but also do
    scaling studies
  • Higher level design tools
  • Combine synthesis and custom techniques
  • Realistic yet tractable design projects
  • Re-use existing projects and provide unifying
    themes
  • Preparation for jobs in semiconductor and other
    sectors.
  • Focus on system design and appropriate levels of
    abstraction
  • Teach how to learn new tools
  • Making best use of faculty/student time and
    university resources
  • Leverage research
  • Combine grad and undergrad
  • Re-use materials, tools
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