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Readout of the ATLAS Liquid Argon Calorimeters John Parsons Nevis Labs, Columbia University Represen

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10 different custom rad-tol ASICs, relatively few COTs. Overview of main FEB components ... ASICs. extensive irradiation test programs for both custom ASICs and ... – PowerPoint PPT presentation

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Title: Readout of the ATLAS Liquid Argon Calorimeters John Parsons Nevis Labs, Columbia University Represen


1
Readout of theATLAS Liquid ArgonCalorimeters
John ParsonsNevis Labs, Columbia
UniversityRepresenting the ATLAS LAr
Collaboration
ATLAS
2
LHC pp collisions _at_ vs 14 TeV Design
Luminosity 1034 cm-2 s-1
Liquid Argon Calorimeters Barrel EM 110208
channels End Cap EM 63744 HEC 5888 FCAL
3584 In total 190 K channels
3
Requirements of ATLAS LAr Frontend Crate
Electronics
  • read out ? 190k channels of calorimeter
  • dynamic range ? 16 bits
  • measure signals at bunch crossing frequency of 40
    MHz (ie. every 25 ns)
  • store signals during L1 trigger latency of up to
    2.5 ?s (100 bunch crossings)
  • digitize and read out 5 samples/channel at a max.
    L1 rate of 100 kHz
  • measure deposited energies with resolution lt
    0.25
  • measure times of energy depositions with
    resolution ltlt 25 ns
  • high density (128 channels per board)
  • low power (? 0.8 W/channel)
  • high reliability over expected lifetime of gt 10
    years
  • must tolerate expected radiation levels (10 yrs
    LHC, no safety factors) of
  • TID 5 kRad
  • NIEL 1.6E12 n/cm2 (1 MeV eq.)
  • SEU 7.7E11 h/cm2 (gt 20 MeV)

4
Overview of ATLAS Liquid Argon (LAr) Calorimeter
Readout
5
ATLAS LAr Frontend Crate Electronics Overview
  • On-detector electronics
  • Boards tested functionally on Mod 0
  • ATLAS rad-tol boards being finalized

Controller 116 boards
Calibration 116 boards _at_ 128 ch
Front End Board (FEB) 1524 boards _at_ 128 ch
Tower builder (TBB) 120 boards _at_ 32 ch
6
Module 0 Electronics Experience
  • Approx. 6000 channels of full functionality
  • Module 0 boards were developed and produced
  • 50 FEB , 12 calib, 2 TBB
  • Provided verification of electronics design
    concepts
  • Have been operating reliably in testbeam runs
    with
  • Module 0 and production calorimeter runs at CERN
    for
  • past several years
  • Performance meets or exceed ATLAS specifications
  • (for sample results, see other ATLAS LAr talks
  • at this conference)
  • Due to schedule, Mod 0 electronics were developed
  • without requiring radiation tolerance
  • the main task remaining in the development of the
    final ATLAS boards was to radiation harden the
    designs, and in particular to replace several
    FPGAs and other COTs with custom rad-tol ICs

7
Radiation Tolerance Requirements
  • Over 10 yrs at design luminosity,
  • on-detector electronics must tolerate
  • significant exposure to ionizing
  • radn, neutrons, and other hadrons
  • TID 5 kRad
  • NIEL 1.6E12 n/cm2 (1 MeV eq.)
  • SEU 7.7E11 h/cm2 (gt 20 MeV)
  • Radn qualification requires extensive
  • testing of components, including large
  • SAFETY FACTORS due to uncertainties
  • in simulation, possible low dose rate effects,
    and possible lot-to-lot variations
  • Combined safety factors can be as high as 70 (!!)
  • In addition to total damage, need to pay careful
    attention to possible single event upsets (SEU)
    of digital logic

Barrel FEC
Endcap FEC
8
Radiation Hardening the ATLAS LAr Readout
  • Reduce/avoid use of COTs
  • Developed 12 different custom ASICs using
  • specialized rad-tol processes
  • 9 DMILL chips
  • 3 DSM chips (using rad-tol standard cell library)
  • Paid careful attention in ASIC design
  • to harden design against SEU.
  • Triple-redundancy and majority
  • voting techniques for critical registers
  • Parameter storage with Hamming
  • code and EDC logic
  • eg. DSM SCA Controller reduces
  • reqd FEB Reset rate by factor 70
  • (residual rate lt 1 FEB/hr in whole system)
  • Radiation qualification process requires
  • TESTING, TESTING, TESTING!!

9
Controller Board Overview
  • Provide redundant
  • optical links to off-detector
  • control electronics for
  • TTC (trigger/timing) and
  • SPAC (serial control for
  • downloading/reading back
  • configuration parameters)
  • Provide (bussed) SPAC
  • and (point-to-point) TTC
  • signals to rest of boards
  • in ½ crate
  • Prototype being developed now to be delivered
    end Oct. for beginning of set up of system crate
    test

10
Calibration Board Overview
  • Generate 0.1 precision calibration pulses
  • Rise time lt 1 ns
  • Current pulse amplitude from 200 nA up to 10 mA
  • Delay programmable from 0 to 24 ns in 1 ns steps
  • Number of current pulsers per CALIB board is 128

11
Overview of Main CALIB Components
DMILL
AMS
COTS
Enable
Spac
VDAC
6 CALogic
128 opamp 10 µV offset
1 DAC 16 bits
1 SPAC
128 Output signals
IDAC
TTC
CMD
16 driver
128 HF switch
1 TTCRx
2 delay
4 pos. Vreg and 1 (non-essential?) neg. Vreg
12
8 Channel CALIB Prototype
  • Include digital control plus analog chain for 8
    channels
  • 3 boards received in April 02
  • Design of full-sized 128 channel board is
    underway delivery by Nov.

13
Frontend Board Overview
  • functionality includes
  • receive input signals from calorimeter
  • amplify and shape them
  • store signals in analog form using SCA while
    awaiting L1 trigger
  • digitize signals for triggered events
  • transmit output data bit-serially over optical
    link off detector
  • provide analog sums to L1 trigger sum tree

14
SCA Analog Memory
  • Provides analog signal storage during L1 latency
    of up
  • to 2.5 ?s (100 bunch crossings)
  • 144 cell pipeline, to give multi-event
    derandomizing buffer
  • Design developed in rad-soft technology, and then
  • successfully migrated to rad-hard DMILL version
  • Some performance numbers
  • Signal range 3.8V
  • Noise 300 ?V
  • Fixed Pattern Noise 190 ?V
  • DC Dynamic range 13.3 bits
  • Cell-to-Cell DC gain spread lt 0.02
  • Chan-to-chan offset spread 10mV RMS
  • Voltage droop lt 3mV/ms
  • To automatically test gt 50000 SCA chips,
  • a robotic test station was developed
  • SCA tests underway (yield 70) finish by end
    2002
  • Same setup already used to test gt 50000 Shaper
    chips

15
Overview of main FEB components
DMILL
AMS
DSM
COTS
  • 10 different custom rad-tol ASICs, relatively few
    COTs

128 input signals
32 SCA
16 ADC
8 GainSel
1 MUX
32 Shaper
32 0T
1 fiber to ROD
Analog sums to TBB
1 GLink
1 Config.
2 SCAC
2 LSB
TTC, SPAC signals
14 pos. Vregs 6 neg. Vregs
1 TTCRx
7 CLKFO
2 DCU
1 SPAC
16
FEB Prototype
128 I/P signals
  • 128 channels/FEB
  • components on both
  • sides to achieve density
  • Need neg. Vregs before launching 20 FEB
    pre-production for system crate test, last major
    milestone before beginning production

Preamps
Shapers
SCAs
ADCs
GainSel
SCA Controllers
SPAC
TTCRx
O/P optical link
17
FEB Optical Links
  • one GLink output link per FEB, with rate of 1.6
    Gbps
  • ? Total raw data rate from 1524 LAr FEBs ? 2.4
    Tera bps

1.6 Gb/s
18
Overview of ATLAS Liquid Argon (LAr) Calorimeter
Readout
19
Readout Driver (ROD) Overview
  • Process raw data in real time _at_ 100 kHz L1 rate
  • Apply calibration constants
  • From 5 time samples per channel, calculate
  • (via optimal filtering)
  • Deposited energy
  • Time of energy deposition
  • Pulseshape quality (?2)
  • Format processed data and transmit to L2/DAQ
  • Perform histogramming monitoring of raw data
  • ROD Demo program allowed
  • successful prototyping of several
  • different commercial DSPs
  • selected 600 MHz TI 6414
  • ROD prototype being finalized
  • DSP on plug-in daughter board
  • allows staging of ROD system for initial
    running (at lower L1 rate) by originally
  • producing only 50 of the processing power

20
Some 6414 ROD Demonstrator Results
  • 600 MHz TI 6414 can process
  • 128 channels (one FEB) in less
  • than 10 ?s
  • Independent DMAs for I/P
  • and O/P streams provide
  • enough I/O bandwidth without
  • significant impact on processing
  • DSP memory sufficient to
  • store reasonable set of histos
  • Due to 6414 cache structure,
  • simulator gives overly optimistic
  • results
  • Design of final Double Processing Unit (PU) with
    two 6414 DSPs, and of ROD Motherboard
    incorporating 4 Double PUs, is underway
  • Prototypes should be available in early 2003

21
Summary
  • Radiation hardening the Module 0 electronics
    designs has required a VERY significant effort
    over several years
  • development of a large number of custom ASICs
  • extensive irradiation test programs for both
    custom ASICs and COTs
  • All components are in, or will move into,
    production by the end of 2002
  • Final prototypes of all front end electronics
    boards will be available by the end of 2002
  • We have suffered a significant delay due to
    continued problems in the development of rad-tol
    negative Vregs (hopefully resolved very soon)
  • During 2003, a system crate test of 2500
    channels will be performed, as the last remaining
    major milestone before moving to production
  • Prototypes of ROD and other off-detector
    electronics will be available by Spring 2003
  • Testbeam in 2004 could provide operating
    experience with final electronics
  • Final electronics installation in ATLAS pit
    scheduled to begin Nov. 2004
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