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Digital Integrated Circuits A Design Perspective

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The First Integrated Circuits. Bipolar logic. 1960's. ECL 3 ... E = Energy per operation = Pav tp. Energy-Delay Product (EDP) = quality metric of gate = E tp ... – PowerPoint PPT presentation

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Title: Digital Integrated Circuits A Design Perspective


1
Digital Integrated CircuitsA Design Perspective
Jan M. Rabaey Anantha Chandrakasan Borivoje
Nikolic
Lecture 1 Introduction
February 10, 2002
2
The First Integrated Circuits
Bipolar logic 1960s
ECL 3-input Gate Motorola 1966
3
Intel Pentium (IV) microprocessor
4
Moores law in Microprocessors
1000
2X growth in 1.96 years!
100
10
P6
Pentium proc
Transistors (MT)
486
1
386
286
0.1
8086
Transistors on Lead Microprocessors double every
2 years
8085
0.01
8080
8008
4004
0.001
1970
1980
1990
2000
2010
Year
Courtesy, Intel
5
Frequency
10000
Doubles every2 years
1000
P6
100
Pentium proc
Frequency (Mhz)
486
386
10
8085
286
8086
8080
1
8008
4004
0.1
1970
1980
1990
2000
2010
Year
Lead Microprocessors frequency doubles every 2
years
Courtesy, Intel
6
Power Dissipation
100
P6
Pentium proc
10
486
286
8086
Power (Watts)
386
8085
1
8080
8008
4004
0.1
1971
1974
1978
1985
1992
2000
Year
Lead Microprocessors power continues to increase
Courtesy, Intel
7
Not Only Microprocessors
CellPhone
Digital Cellular Market (Phones Shipped)
(data from Texas Instruments)
8
Design Abstraction Levels
SYSTEM
MODULE

GATE
CIRCUIT
DEVICE
G
D
S
n
n
9
Design Metrics
  • How to evaluate performance of a digital circuit
    (gate, block, )?
  • Cost
  • Reliability
  • Scalability
  • Speed (delay, operating frequency)
  • Power dissipation
  • Energy to perform a function

10
Cost of Integrated Circuits
  • NRE (non-recurrent engineering) costs
  • design time and effort, mask generation
  • one-time cost factor
  • Recurrent costs
  • silicon processing, packaging, test
  • proportional to volume
  • proportional to chip area

11
Die Cost
  • Single die

Wafer
Going up to 12 (30cm)
From http//www.amd.com
12
Yield
13
Defects
a is approximately 3
14
Some Examples (1994)
15
Reliability?Noise in Digital Integrated Circuits
(
t
)
V
v
DD
i
(
t
)
Inductive coupling
Capacitive coupling
Power and ground
noise
16
DC OperationVoltage Transfer Characteristic
VOH f(VOL) VOL f(VOH) VM f(VM)
17
Mapping between analog and digital signals
V

1

OH
V
IH
Undefined
Region
V
IL

0

V
OL
18
Definition of Noise Margins
"1"
V
OH
Noise margin high
NM
H
V
IH
UndefinedRegion
V
NM
Noise margin low
L
IL
V
OL
"0"
Gate Input
Gate Output
19
Noise Budget
  • Allocates gross noise margin to expected sources
    of noise
  • Sources supply noise, cross talk, interference,
    offset
  • Differentiate between fixed and proportional
    noise sources

20
Key Reliability Properties
  • Absolute noise margin values are deceptive
  • a floating node is more easily disturbed than a
    node driven by a low impedance (in terms of
    voltage)
  • Noise immunity is the more important metric the
    capability to suppress noise sources
  • Key metrics Noise transfer functions, Output
    impedance of the driver and input impedance of
    the receiver

21
Regenerative Property
Regenerative
Non-Regenerative
22
Regenerative Property
A chain of inverters
Simulated response
23
Fan-in and Fan-out
M
Fan-in M
24
The Ideal Gate
V
out
Fanout NMH NML VDD/2
g ?
V
in
25
Delay Definitions
26
Ring Oscillator
27
A First-Order RC Network
tp ln (2) t 0.69 RC
Important model matches delay of inverter
28
Power Dissipation
Instantaneous power p(t) v(t)i(t)
Vsupplyi(t) Peak power Ppeak
Vsupplyipeak Average power
29
Energy and Energy-Delay
Power-Delay Product (PDP) E Energy per
operation Pav ? tp
Energy-Delay Product (EDP) quality metric
of gate E ? tp
30
A First-Order RC Network
R
v
out
v
CL
in
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