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CREEP

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CREEP CREEP Mechanical Metallurgy George E Dieter McGraw-Hill Book Company, London (1988) Plastic deformation Mechanisms / Methods by which a can Material can FAIL ... – PowerPoint PPT presentation

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Title: CREEP


1
CREEP
  • CREEP

Mechanical Metallurgy George E Dieter
McGraw-Hill Book Company, London (1988)
2
Review
If failure is considered as change in desired
performance- which could involve changes in
properties and/or shape then failure can occur
by many mechanisms as below.
Mechanisms / Methods by which a can Material can
FAIL
Elastic deformation
Chemical /Electro-chemicaldegradation
Creep
Physicaldegradation
Fatigue
Plastic deformation
Fracture
Microstructuralchanges
Twinning
Wear
Slip
Twinning
Erosion
Corrosion
Phase transformations
Oxidation
Grain growth
Particle coarsening
Beyond a certain limit
3
Review
Though plasticity by slip is the most important
mechanism of plastic deformation, there are other
mechanisms as well (plastic deformation here
means permanent deformation in the absence of
external constraints)
Plastic Deformation in Crystalline Materials
Slip(Dislocation motion)
Twinning
Phase Transformation
Creep Mechanisms
Grain boundary sliding
Other Mechanisms
Vacancy diffusion
Grain rotation
Dislocation climb
Note Plastic deformation in amorphous materials
occur by other mechanisms including flow
(viscous fluid) and shear banding
4
High-temperature behaviour of materials
  • Designing materials for high temperature
    applications is one of the most challenging tasks
    for a material scientist.
  • Various thermodynamic and kinetic factors tend to
    deteriorate the desirable microstructure.
    (kinetics of processes are an exponential
    function of temperature).
  • Strength decreases and material damage (void
    formation, creep oxidation) tends to accumulate.
  • Cycling between high and low temperature will
    cause thermal fatigue.

5
High temperature effects (many of the effects
described below are coupled)
  • Increased vacancy concentration ? at high
    temperatures more vacancies are thermodynamically
    stabilized.
  • Thermal expansion ? material will expand and in
    multiphase materials/hybrids thermal stresses
    will develop due to differential thermal
    expansion of the components.
  • High diffusion rate ? diffusion controlled
    processes become important.
  • Phase transformations can occur ? this not only
    can give rise to undesirable microstructure, but
    lead to generation of internal stresses.?
    Precipitates may dissolve.
  • Grain related? Grain boundary weakening ? may
    lead to grain boundary sliding and wedge
    cracking. ? Grain boundary migration ?
    Recrystallization / grain growth ? decrease in
    strength
  • Dislocation related ? these factors will lead to
    decrease in strength? Climb? New slip systems
    can become active? Change of slip system ?
    Decrease in dislocation density
  • Overaging of precipitate particles and particle
    coarsening ? decrease in strength
  • The material may creep (time dependent elongation
    at constant load/stress).
  • Enhanced oxidation and intergranular penetration
    of oxygen

6
CREEP ? Permanent deformation of a material
under constant load (or constant stress) as a
function of time
  • Normally, increased plastic deformation takes
    place with increasing load (or stress)
  • In creep plastic strain increases at constant
    load (or stress)
  • Usually appreciable only at T gt 0.4 Tm ? High
    temperature phenomenon.
  • Mechanisms of creep in crystalline materials is
    different from that in amorphous materials.
    Amorphous materials can creep by flow.
  • At temperatures where creep is appreciable
    various other material processes may also active
    (e.g. recrystallization, precipitate coarsening,
    oxidation etc.- as considered before).
  • Creep experiments are done either at constant
    load or constant stress.

7
Constant load creep curve
I
II
Strain (?) ?
III
?0 ? Initial instantaneous strain
?0
t ?
  • The distinguishability of the three stages
    strongly depends on T and ?

8
Constant Stress creep curve
II
I
Strain (?) ?
III
?
?
t ?
9
Stages of creep
I
  • Creep rate decreases with time
  • Effect of work hardening more than recovery

II
  • Stage of minimum creep rate ? constant
  • Work hardening and recovery balanced

III
  • Absent (/delayed very much) in constant stress
    tests
  • Necking of specimen start
  • specimen failure processes set in

10
Effect of stress
Strain (?) ?
Increasing stress
?0 increases
?0
t ?
11
Effect of temperature
Strain (?) ?
E? as T?
Increasing T
? ?
?0 increases
?0
? ?
t ?
As decrease in E with temperature is usually
small the ?0 increase is also small
12
Creep Mechanisms of crystalline materials
Cross-slip
Climb
Dislocation related
Glide
Harper-Dorn creep
Coble creep
Creep
Grain boundary diffusion controlled
Nabarro-Herring creep
Diffusional
Lattice diffusion controlled
Dislocation core diffusion creep
Diffusion rate through core of edge dislocation
more
Interface-reaction controlled diffusional flow
Grain boundary sliding
Accompanying mechanisms creep with dynamic
recrystallization
13
Harper-Dorn creep
Phenomenology
Power Law creep
Creep can be classified based on
Mechanism
14
Cross-slip
  • In the low temperature of creep ? screw
    dislocations can cross-slip (by thermal
    activation) and can give rise to plastic strain
    as f(t)

15
Dislocation climb
  • Edge dislocations piled up against an obstacle
    can climb to another slip plane and cause plastic
    deformation as f(t), in response to stress
  • Rate controlling step is the diffusion of
    vacancies

16
Nabarro-Herring creep ? high T ? lattice diffusion
Diffusional creep
Coble creep ? low T ? Due to GB diffusion
  • In response to the applied stress vacancies
    preferentially move from surfaces/interfaces (GB)
    of specimen transverse to the stress axis to
    surfaces/interfaces parallel to the stress axis?
    causing elongation.
  • This process like dislocation creep is controlled
    by the diffusion of vacancies ? but diffusional
    does not require dislocations to operate.

17
Grain boundary sliding
  • At low temperatures the grain boundaries are
    stronger than the crystal interior and impede
    the motion of dislocations
  • Being a higher energy region, the grain
    boundaries melt before the crystal interior
  • Above the equicohesive temperature grain
    boundaries are weaker than grain and slide past
    one another to cause plastic deformation

18
Creep Resistant Materials
  • Higher operating temperatures gives better
    efficiency for a heat engine. Hence, there is a
    need to design materials which can withstand high
    temperatures.

High melting point ? E.g. Ceramics
Dispersion hardening ? ThO2 dispersed Ni (0.9 Tm)
Creep resistance
Solid solution strengthening
Single crystal / aligned (oriented) grains
19
  • Cost, fabrication ease, density etc. are other
    factors which determine the final choice of a
    material
  • Commonly used materials ? Fe, Ni (including
    superalloys), Co base alloys
  • Precipitation hardening (instead of dispersion
    hardening) is not a good method as particles
    coarsen (smaller particles dissolve and larger
    particles grow ? interparticle separation ?)
  • Ni-base superalloys have Ni3(Ti,Al) precipitates
    which form a low energy interface with the matrix
    ? low driving force for coarsening
  • Cold work cannot be used for increasing creep
    resistance as recrystallization can occur which
    will produced strain free crystals
  • Fine grain size is not desirable for creep
    resistance ? grain boundary sliding can cause
    creep elongation / cavitation? Single crystals
    (single crystal Ti turbine blades in gas turbine
    engine have been used)? Aligned / oriented
    polycrystals

20
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