CS, CoE, EE 362 Digital Computers II: Architecture - PowerPoint PPT Presentation

1 / 29
About This Presentation
Title:

CS, CoE, EE 362 Digital Computers II: Architecture

Description:

CS, CoE, EE 362 Digital Computers II: Architecture Prof. Mark Franklin: jbf_at_cse.wustl.edu Course Assistants: Drew Frank: ajf1_at_cec.wustl.edu Required Book: Heuring ... – PowerPoint PPT presentation

Number of Views:216
Avg rating:3.0/5.0
Slides: 30
Provided by: MarkF233
Category:

less

Transcript and Presenter's Notes

Title: CS, CoE, EE 362 Digital Computers II: Architecture


1
CS, CoE, EE 362Digital Computers II Architecture
  • Prof. Mark Franklin jbf_at_cse.wustl.edu
  • Course Assistants
  • Drew Frank ajf1_at_cec.wustl.edu
  • Required Book Heuring Jordan 2nd Edition
  • Optional Book Intro. VHDL Yalamanchili
  • Read Academic Integrity Statement.
  • Course Web Site http//www.cse.wustl.edu/jbf/cse
    362.d/cse362.html

2
Four Key Questions
  • What components must every computer have ?
  • How can computers be described, specified and
    evaluated ?
  • What constitutes computer architecture (hardware,
    software, firmware, algorithms, etc.) ?
  • How does technology effect computer architecture
    (chip size, feature size, power, pin density,
    etc) ?

3
Essential Computer Components
  • Processor interpret/execute instructions.
  • Memory store instructions data.
  • Communication Device(s) communicate with outside
    world, I/O.

Classic Computer Architecture (SISD Single
Instruction Stream-Single Data Stream)
Processor
Control Unit
Input/ Output
Memory
ALU
4
Architecture Components
  • INSTRUCTION SET DESIGN Programmer visible
    instruction set Algorithm, compiler, OS
    design, algorithmic complexity
  • HIGH LEVEL COMPONENT ORGANIZATION Memory
    system, bus structure, processor design, branch
    handling, pipelining, execution
    algorithms, instructions/second,
    clocks/instruction.
  • HARDWARE Detailed logic design, packaging VLSI
    Logic design CAD algorithms speed, area,
    power,

5
Program Control Unit
ALU
ALU
ALU
ALU
Program Memory
Interconnection Network
Data Memory Unit
Input / Output
(SIMD) Single Instruction Stream Multiple Data
Stream Architecture
6
Performance Expression Amdahls Law
7
Amdahls Law
It does no good to have many processors if there
is not enough parallelism. What portion of a
computation can be sequential if we want the
processors to be used at 50 percent efficiency ?
( S p/2 )
8
Generalize Amdahls Law
Example Suppose a program runs in 100 seconds
on a machine. Multiply operations are responsible
for 80 seconds of this time. How much do we have
to improve the speed of multiplication if we want
the program to run 4 times faster? What about 5
times faster? PRINCIPAL Make the common case
fast!
9
Computer Market Partitioning(costs are for
processor, not system)
  • Desktop Computing (100 - 1,000)
  • Price-performance
  • Servers (200 - 2,000)
  • Availability (reliability effectiveness)
  • Scalability
  • Throughput
  • Embedded Computers (0.20 - 1,000)
  • Real-time performance
  • Power and memory minimization
  • Cost minimization
  • Interface with special purpose logic use of
    processor cores

10
HLL (e.g., C, C, Perl) vs Machine/Assembly
Language (AL)
  • HLL Pros
  • Easier to express algorithms due to higher level
    constructs (e.g., For, Case, Arithmetic
    expressions, objects, etc.)
  • Type checking (Hardware for type checking ?).
  • Some memory allocation checking.
  • Assembly Language Pros
  • More control over ISA ? more speed, less memory
  • More control over I/O
  • Combination is often best for embedded systems
    HLL calling AL .

11
Example HLL ? AL Mapping
HLL
AL
  • b c de
  • LOAD R1, d
  • LOAD R2, e
  • LOAD R3, c
  • MPY R4, R2, R1
  • ADD R5, R4, R3
  • STORE R5, b

12
Buses I
  • A set of path(s) (wires) connecting on-chip or
    off-chip modules.
  • Serial bus transmit one bit at a time
  • Parallel bus transmits many bits simultaneously
  • Generally time-shared.
  • Generally has separate data control paths.
  • Typically has a separate bus controller or
    arbiter that decides which modules can use the
    bus at any given time.

13
Buses II
  • Some common buses
  • On-chip AMBA, Wishbone, (generally not standard)
  • Off-chip PCI Bus Family),
  • ---------------- 32bit transfer 64bit transfer
  • 33-MHz PCI 133 MB/sec 266 MB/sec
  • 66-MHz PCI 266 MB/sec 532 MB/sec
  • 100-MHz PCI-X ------------ 800 MB/sec
  • 133-MHz PCI-X ------------ 1 GB/sec
  • PCI-e(xpress) serial, 1 lane 500 MB/sec
  • PCI-e(xpress) serial, 4 lanes 2 GB/sec
  • Off-chip Other buses - SCSI, IDE, Infiniband
  • Common issues Arbitration, congestion.
  • Logical equivalence between buses, multiplexers
    and switches.

14
Bandwidth Requirements
15
Bandwidth Trend
16
Simple Queuing Theory View of Buses
  • Bus is a shared resource and can be viewed as a
    server in a queuing system.
  • Modules attached to the bus present inputs
    (i.e., requests) to the server (or Bus) and are
    queued up if the server is busy.

Memory
Server
CPU
Queue
BUS
I/O
17
Basic Queueing Theory
  • Utilization time a server is busy
  • Average Queue Length Avg of jobs in queue.
  • Average System Delay (latency) Avg time from job
    entry into, to job departure from system.
  • Arrival Time Distribution Poisson Distribution
    of arrival times (exponential interarrival
    times).
  • Service Time Distribution Exponentially
    distributed service times.
  • Queue Charactericstics Infinite length FIFO
    service discipline.

18
Basic Queueing Results
19
Basic Queueing Results
Waiting Time
M/M/1
Queue Length
M/M/1
20
Computer Generations
  • 1 1950 - 1959 Vacuum Tubes
  • 2 1960 - 1968 Transistors
  • 3 1969 - 1977 Integrated Circuit
  • 4 1978 - 2005 LSI-Large Scale
    Integration VLSI-Very LSI
  • 5 2005 - 20?? ULSI-Ultra LSI parallel
    processing

21
Technology How we make a chip (roughly)
22
Integrated Circuit Cost




  • Cost.per.wafer
  • Cost.per.die -----------------------------------
  • (Dies.per.wafer) x
    (Yield)
  • Wafer.area
  • Dies.per.wafer -------------------
    (approximate)
  • Die.area
  • 1
  • Yield ------------------------------------------
    ---- (empirical observation)
  • (1 (Defects.per.area)x(die.area/2))2
  • Typical Die area 1.5 cm x 1.5 cm Wafer
    Diameter 10 inches
  • Defects.per.cm2 1.7 Yield 50

23
TECHNOLOGY TRENDS
  • Semiconductors
  • Transistor Density 50/year, quadruple in 4
    years.
  • Die Size 10 - 25/year
  • IC Logic Technology
  • Transistors per Chip 50 - 60/year
  • Device Speed 30/year
  • Wire/Communications Speed constant (Cu vs Al)
  • Magnetic Disk Technology
  • Density 25 - 60 / year
  • Access Time 35 / 10 years (8 ms).

24
Feature and Die Size
25
Wafer Size
12-inch wafer
26
SILICON MAGNETIC DENSITIES
27
Processor Performance Gains
Performance (x VAX-10/780)
28
Processor Cost Trends with Time
29
SILICON MAGNETIC DENSITIES
Write a Comment
User Comments (0)
About PowerShow.com