Enabling Technologies for the Mass Storage Industry Dr. David Tuckerman, CTO [e-mail]

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Enabling Technologies for the Mass Storage
IndustryDr. David Tuckerman, CTOdtuckerman_at_tess
era.com
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Enabling Technologies for Data Storage

• Semiconductor evolving to ever-smaller devices
• Feature size going down, currently 65 nm
• Die Thickness below 100 micron
• Reduced voltages and power needs
• Advanced Packaging keeps finished ICs small
• Chip Scale Packaging, final footprint is
  die-size
• Ball Grid Arrays attach directly to PCB without
  leads
• Stacked and Folded Packages
• Systems in a Package Designs
• Different functions combined at die level
• One chip does the work of many die
• Complete function in a single package (GPS,
  cellular, imaging)

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Tessera Enabling Technologies
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FLASH µZ Ball Stack
FLASH Die
Substrate
2mm
Wire Bond and Encapsulation
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µZ - Ball Stack Package

• The µZ Ball Stack package is a multi-chip
  solution that is capable of increasing memory
  capacity up to 8x for DRAM, SRAM and for Flash
  applications.
• Tesseras technology provides near-100 yield by
  allowing each die to be individually tested prior
  to stacking.
• Ball Stack uses the existing µBGA assembly
  infrastructure, ensuring low cost.
• Stacking of DDR-SDRAM chips in memory modules
  for increased memory density in space restricted
  applications.
• Flash Stacking applications include high density
  solid state drives, solid state mission recorder
  and memory cards.

2-Stack DRAM
4-Stack Flash
4-Stack DRAM
8-Stack DRAM
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Small Device Applications

• Cellular Phones
• Intel pioneered stacked memory in hand-held
  devices
• Features added while shrinking overall phone
  dimensions
• New features require more memory
• Federal mandate requires GPS receivers on new
  cellular phones
• PC and Server Memory
• Blade servers and laptops are severely space
  constrained
• Die stacking allows 8X the device count in same
  footprint
• Fewer leads, simpler PCB
• Military and Aerospace
• Land Warrior requires ultra small wearable
  computer
• Devices must work in hostile environments (high
  G, vacuum)
• High reliability, low power, survivability are
  key issues

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Packaging technology for system-level
miniaturization
Enabling Tomorrows Feature-Rich Products
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Typical Applications
Military Space Harsh environment Solid State
Mass Storage
90GB
275GB
Up to 32 GB Flash. Advanced protection in
conditions of extremely high shock, vibration,
temperature, and altitude.
MONSSTR MOdular Non-volatile Solid STate
Recorder
RMS-SS Solid-State Removable Memory System
Network Solid State Disks
Records all types of airborne data, including
data from reconnaissance sensors Up to 25 GB
Solid State Mission Data Recorder (SSMDR)
2.048GB - 688GB
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Solid State Drive Application
THIS PRESENTATION being delivered via FSSD in a
Dell Laptop 20 GByte in 2.5 HDD form factor 24
stacks of 7 die, using 1 Gbit Flash
devices Instant on, no spin-up time Very low
power, needs no air for head flight or
cooling Extremely robust, works in space under
water too. Parallel controller achieves gt30
MByte/sec transfer rate Same speed as a
conventional HDD Custom controller addresses 8
die in parallel Roadmap shows 192 GByte using
current technology 4 Gbit Flash devices, 24
stacks of 8, Dual Nand die 2.5 HDD form factor,
9.5mm high
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3D Packaging21 GB Solid State Drive

• System designed to leverage stacked packaging
• Low-profile (9.5 mm) 2.5 flash solid state
  drive (F-SSD)
• drop-in replacement for conventional hard disk
  drive
• custom FPGA controller required to handle high
  capacity
• SDRAM, processor included
• NAND flash stacks
• 7 ICs/site
• 12 sites / side
• 2 sides
• 24 sites
• 168 devices

Miniaturization of Flash storage capability
achieved with Tesseras stacked packaging
allows drop-in solid state replacement for
conventional hard disk drive.
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Dual NAND FLASH Options
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Dual Die in 2.5 Solid State Drive
Drive Height Max Pkg Height Capacity (1Gb Die) Capacity (2Gb Die) Capacity (4Gb Die) of Stacked Packages
9.5 mm 3.92 mm 48GB 96GB 192GB 8
8.5 mm 2.94 mm 36GB 72GB 144GB 6
8.0 mm 2.45 mm 30GB 60GB 120GB 5
5.0 mm 0.98 mm 12GB 24GB 48GB 2

• Dual NAND flash stacks
• 16 ICs/site (8 high package stack)
• 12 sites / side
• 2 sides
• 24 sites, 384 devices

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PCB area savings
21.0 GB in a 2.5 Flash Solid State Drive
(FSSD) Area of 168 TSOP array is 415.9 cm2,
equivalent area for 24 µZTM stacks (7 die each)
is 50.4 cm2 Space consumed by stacks is 12 of
TSOP, space savings is 88 !
Size Reductions Translate to Higher Density
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Summary and Conclusions
Semiconductor Packaging a key element for solid
state memory products Higher frequencies need
shortest possible connections System in a
Package simplifies PCB, improves
reliability Memory demand growth requires die
stacking Todays nice to have will be
tomorrows must have features DDR-2 requires
Chip Scale Packaging, so will DDR-3 More
products must be tolerant of hostile
environments Additional space savings from
Integrated passives More products will depend
on miniature and/or hand-held form
factors Military devices carried by personnel
and ordnance Business needs for tracking people,
equipment, products (RFID) Consumer goods,
increasing use of wired/wireless networks