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TEM charcaterization

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TEM charcaterization Basic modes Bright field microscopy Dark field Microscopy STEM EDAX EELS Operating principles The TEM also has the electron gun and the focusing ... – PowerPoint PPT presentation

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Title: TEM charcaterization


1
TEM charcaterization
  • Basic modes
  • Bright field microscopy
  • Dark field Microscopy
  • STEM
  • EDAX
  • EELS

2
Operating principles
  • The TEM also has the electron gun and the
    focusing optics like the SEM, however, it is
    based on electrons transmitting through the
    material for imaging
  • The 3 main TEM modes are Bright field, Dark
    field, and Scanning transmission electron
    microscope (STEM)
  • The sample is supported by small Cu grid (few mm
    dimension) that is supported in holders
  • The electron energy is few hundred KeV, and the
    magnification obtained could reach up to a
    million times in best cases
  • A part of the image can be blocked to produce
    either bright or dark field images
  • The scattering of electrons in TEM is much less
    than SEM, and almost always in the forward
    direction due to small interaction volume. This
    helps in getting very high resolution.

3
Sample preparation using FIB
  • TEM sample preparation is actually more involved
    than the imaging technique. The sample is usually
    glued in epoxy and polished using until a very
    thin cross-section (tens to hundreds of nm) is
    achieved.
  • FIB Using Focused Ion beam based milling
    technique, the exact location where the image
    needs to be taken can be thinned, thus making the
    imaging process much less complicated and less
    time consuming. In a FIB process Ga ions are
    used for the milling, and resolutions of 10 nm
    are possible to obtain.

4
Dark field imaging
  • This mode is operated by looking at the image
    produced by the diffracted beam with large
    angular deflection. Since the diffracted beam is
    usually very weak, the direct beam is blocked
  • This image can be thought of as some form of
    phase contrast imaging, which are caused by
    interference
  • Mostly used to enhance contrast when bright field
    image is not very of high contrast

5
STEM
  • In STEM, a thin electron beam of diameter down to
    0.1 nm is used to raster the sample and perform
    the imaging. Although the process is similar to
    SEM, the spot size can be more tightly controlled
    due to lower De Broglie wavelength of the
    electrons
  • The operation is similar to that of an SEM with
    the difference that the beam actually passes
    through the sample
  • This mode is usually very useful for elemental
    analysis almost on an atom by atom basis by EELS
    and EDX
  • Magnification obtained is 500,000 times or more.

6
Comparison with SEM
7
Lattice resolved TEM image
  • Lattice resolved TEM image of a Nanowire section
    showing individual atoms sites (courtesy USC EM
    Center Tem facility)

8
Final Exam
  • The final exam will be on Friday, Dec 13,
    2013,12.30 pm.
  • 1 page (double sided) containing only formulas
    will be allowed. No class notes, no worked
    examples, no figures.
  • The project report will be due on Dec 13, 2013.
  • The project report should be 10 pages, and in the
    format of a journal paper i.e. include
    Introduction, discussion of major modes,
    conclusions, and future directions/novel
    suggestions, references etc.
  • With reference to the EBIC line plot,
  • show where the defect density is highest
  • and where it is lowest.

9
Final Exam Guide
  • Short Questions
  • Two advantages of CL over PL
  • Two comparative advantages and disadvantages of
    SEM and TEM
  • The three different characterization techniques
    associated with SEM are ., .. and ..
  • Two comparative advantages and disadvantages of
    SIMS and RBS. Which one would you prefer to
    measure background C impurity in MBE or MOCVD
    growth? Why?
  • Why is Field Emission Gun (FEG) SEM preferred
    over traditional SEM?
  • How do you avoid charging issues in an insulated
    sample in an SEM?
  • What is a suitable method to obtain lattice
    spacing and chemical composition of a 10 nm
    diameter InN nanowire? Justify.
  • A wafer of a unknown material is given. What is a
    simple way to determine its chemical composition?
    What is a more accurate way of determining it
    chemical composition? If this is a semiconductor,
    how will you determine its (i) dopant density and
    (ii) carrier concentration?

10
Final Exam Guide
  • Problems
  • Calculate the De Broglie wavelengths of the
    electrons in SEM (30 keV) and TEM (300 keV)
  • With the help of band diagrams, (i) before
    electrical contact, (ii) after electrical
    contact, and (iii) after application of feedback
    bias to the tip to nullify electric field,
    explain the operation of Kelvin probe
    measurement. Assume n doped Si probe tip (work
    function 4.07 eV) and Au sample (work function
    5.15 eV). What voltage needs to be applied to the
    probe tip for nullifying the electrostatic force
    of attraction? How would the tip bias change is
    the sample has a dc bias of -1 V applied to it?
  • Calculate the amplitude of the 17 KHz force
    acting on the cantilever for an applied ac
    voltage of 10 V rms (frequency 17 KHz). The
    cantilever dimensions are 30 and 100 microns
    respectively. It is held 2 microns above the
    sample. The work function of the cantilever is
    5.65 eV, and that of the sample is 5.15 eV.
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