Coupled Electrical-Thermal Co-analysis of Power Delivery Networks in Si3D Structure

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Coupled Electrical-Thermal Co-analysis of Power
Delivery Networks in Si3D Structure
Jianyong Xie, Daehyun Chung, Madhavan Swaminathan

• Objectives
• DC IR drop analysis of power delivery network in
  Si3D structures
• Coupled electro-thermal analysis of PDN
• Electro-thermal analysis tool development and
  tradeoffs design guideline

• Accomplishments
• Developed the procedure for static coupled
  electro-thermal analysis
• Simulation of electro-thermal problem for power
  plane

A 3D package
3D silicon package structure
Procedure for electro-thermal analysis

• Recent results
• IR drop and temperature trends with iterations of
  stacked chips

• Future work
• Develop static electro-thermal analysis tool for
  3D structure
• Transient electro-thermal analysis
• Develop or employ new method for coupled
  electro-thermal analysis

IR drop trend and final voltage distribution
Hot spot trend and final on-chip temperature
distribution
IR drop with iterations