ITRS 2005 Factory Integration Chapter Material Handling Backup Section - PowerPoint PPT Presentation

1 / 108
About This Presentation
Title:

ITRS 2005 Factory Integration Chapter Material Handling Backup Section

Description:

Title: ITRS 2001 Main template for Prod Equipment Author: Burkhart (Novellus), Pillai (Intel) Last modified by: mjjung Created Date: 6/29/2000 8:08:33 PM – PowerPoint PPT presentation

Number of Views:114
Avg rating:3.0/5.0
Slides: 109
Provided by: Burkhart2
Category:

less

Transcript and Presenter's Notes

Title: ITRS 2005 Factory Integration Chapter Material Handling Backup Section


1
ITRS 2005 Factory Integration ChapterMaterial
Handling Backup Section
  • Details and Assumptions for Technology
    Requirements and Potential Solutions
  • MPH Backup
  • Hot Lot Backup

2
AMHS Backup Outline
  1. Contributors Page 3
  2. How Metrics were Selected Page 4
  3. Material Handling Technology Requirements
    Table Page 5
  4. Translating Material Handling Technology Reqs to
    Reality Page 6
  5. Supporting Material for Material Handling
    Technology Reqs Pg 7-27
  6. System Throughput Requirements pages 7-17
  7. Reliability pages 18-19
  8. Hot Lot Delivery Time Pages 20-22
  9. Delivery Time Pages 23-27
  10. Potential Solution Options Pg 28-67
  11. Direct Transport (Includes capabilities needed
    from FICS) Pages 28-42
  12. Direct Transport/Delivery Time 3rd Party
    LP/Buffer Pages 43-46
  13. Integrated Flow and Control Pages 47-54
  14. Delivery Time Storage Density Under Track
    Storage Pages 55-59
  15. Inert Gas Purging of FOUPs Pages 60-61
  16. Factory Cross Linkage Protocol Induced
    Constraints Pages 62-67
  17. Potential Research Topics Pg 68-69
  18. 450mm Inputs (2005 addition) Pg 70-98
  19. Inputs on Layout Assumptions (2005 addition) Pg
    99-108

3
2004/2005 AMHS Contributors
  • Mikio Otani, ASI
  • Makoto Yamamoto, Murata
  • YY Chen, UMC
  • Jonathan Chang, TSMC
  • Junji Iwaskai, Renasas
  • Eric Englhardt, AMAT
  • Tom Chang, Asyst
  • Rex Wright, Asyst
  • Mike Bufano, Brooks
  • Bill Fosnight, Brooks
  • Clint Haris, Brooks
  • Mark Magleby, Daifuku
  • Dan Stevens, Hirata
  • Larry Hennessy, IDC
  • Adrian Pyke, Middlesex
  • Ron Denison, Murata
  • Marlin Shopbell, AMD
  • Dave Miller, IBM
  • Melvin Jung, Intel
  • Steve Seall, Intel
  • Len Foster, TI
  • Roy Hunter, TI
  • Sven Hahn, Infineon
  • Harald Heinrich, Infineon

4
How Metrics were selected
  • Almost every metric is a best in class or close
    to best in class
  • Sources are Individual IC maker and AMHS
    Supplier feedback.
  • It is likely a factory will not achieve all the
    metrics outlined in the roadmap concurrently
  • Individual business models will dictate which
    metric is more important than others
  • It is likely certain metrics may be sacrificed
    (periodically) for attaining other metrics.
  • The Factory Integration metrics are not really
    tied to the technology nodes as in other chapters
    such as Lithography
  • However, nodes offer convenient interception
    points to bring in new capability, tools,
    software and other operational potential
    solutions
  • Inclusion of each metric is dependent on
    consensus agreement

We think the metrics provide a good summary of
stretch goals for most companies in todays
challenging environment.
5
Material Handling Technical Requirements
2005 Update
Year of Production 2005 2006 2007 2008 2009 2010 2011 2012 2014 2017 2020
Technology Node     hp65     hp45          
DRAM ½ Pitch (nm) 80 70 65 55 50 45 40 35 28 20  
MPU/ASIC ½ Pitch (nm) (Un-contacted Poly) 80 70 65 55 50 45   35 28 20  
Wafer Diameter (mm) 300 300 300 300 300 300   450 450 450 450
Transport E-MTTR (minutes) per SEMI E10 10 9 9 8 8 8 8 8 8 7 6
Storage E-MTTR (minutes) per SEMI E10 25 25 20 20 20 20 20 20 20 15 10
Transport MMBF 8,000 11,000 15,000 25,000 35,000 35,000 35,000 45,000 45,000 55,000 65,000
Storage MCBF 25,000 35,000 45,000 55,000 60,000 60,000 60,000 70,000 70,000 80,000 100,000
Peak system throughput (40K WSPM)                      
Interbay transport (moves/hour) 2250 2500 2575 2660 2660 2660 2660 2660 2660 2660 2660
Intrabay transport (moves/hour) high throughput bay 250 260 270 280 290 300 300 300 300 300 300
Transport (moves/hour)unified system 4240 4740 4900 5000 5000 5000 5000 5000 5000 5000 5000
Stocker cycle time (seconds) (100 bin capacity) 12 10 10 10 10 10 10 10 10 10 10
Average delivery time (minutes) 6 5 5 5 5 5 5 5 5 5 5
Peak delivery time (minutes) 12 10 10 10 10 10 10 10 10 10 10
Hot lot average delivery time (minutes) 3 2 2 2 2 2 2 2 2 2 2
AMHS lead time (weeks) 12 lt9 lt8 lt8 lt8 lt8 lt8 lt8 lt8 lt8 lt8
AMHS install time (weeks) 24 lt10 lt10 lt10 lt10 lt10 lt10 lt10 lt10 lt10 lt10
Downtime to extend system capacity when previously planned (minutes) 120 lt30 lt15 lt15 lt0 lt0 lt0 lt0 lt0 lt0 lt0
Time required to integrate process tools to AMHS (minutes per LP) 15 12 12 10 10 5 5 5 5 5 5
6
Translating Material Handling metrics to Reality
Metric Potential Solution it is driving
Wafer Transport System Capability Direct transport (or integrated interbay intrabay). Needed for hot lot, gating send-ahead, hand-carry TPT targets
Transport MMBF, Storage MCBF, Transport E-MTTR, Storage E-MTTR Storage and transport redundancy schemes fault tolerant MCS e-Diagnostics, EES, APC for AMHS
Stocker cycle time per system Fundamental capability that permits the AMH system to successfully transport hot lots, gating send-aheads and hand-carries
Stocker storage density New storage ideas which significantly reduce stocker footprint in the fab cleanroom (Under Track Storage, Conveyors)
Downtime required for adding increased system capacity when previously planned New track and stocker extension designs that permit AMHS retrofit/expansion in a working factory with minimum downtime
7
2003 Supporting Material for Material Handling
Technology RequirementsAMHS System Throughput
8
2003 Inputs, Assumptions Output (Numbers used
in 2003 AMHS Requirements Table)
M. Jung Intel
9
Peak AMHS MPH Sample Calculation
  • System Throughput Requirements for 2004-2005
    transition to direct transport
  • Sample Calculation for 2005

40K WSPM Process Steps 25 layers X 29
steps/layer X 40k wspm
(725 steps X 40k wspm) 1593 process
steps per hour (727 Hrs/month X 25 wafers /lot)
  • Direct Transport Average MPH
  • ((Tool to Tool moves x 1 Move)((1-Tool to
    Tool moves) x 2 Moves)) x Process Steps per Hour
  • ((10 x 1) ((1 10) x 2)) x 1593
  • 3027 MPH
  • Direct Transport Peak MPH
  • Average AMHS MPH x (12std dev)
  • 3027 x (1 2 x .20)
  • 4240 MPH

10
2001/2002 Inputs, Assumptions Output (Reference)
M. Jung Intel
11
2001/2002 Inputs, Assumptions Output(Reference)
  • System Throughput Requirements for Intrabay
    (2004/2005)
  • Sample Calculation
  • High throughput 20 tools/bay X 125
    wafers/hour
  • Intrabay MPH 25 wafers/carrier
  • 100 Moves / Hr Average
  • 200 Moves / Hr Peak ( i.e., Avg 2xStd
    Dev)

12
2003 Inputs, Assumptions, Outputs Description
(Additional AMHS Configurations)
M. Jung Intel
13
Transport Move Definition/Details (AMHS
Configuration Move Type Definitions)
M. Jung Intel
14
Separate Interbay Intrabay
  1. Between Tools in same bay T1 -gt L1 -gt T2
  2. Between Tools in different bays T1 -gt L1 -gt S1 -gt
    L5 -gt S3 -gt L2 -gt T3
  3. Between Tool and Storage T1 -gt L1 -gt S1
  4. Between two Storage devices S1 -gt L5 -gt S3

M. Jung Intel
15
Separate Interbay Intrabay w/ Some Bays
Connected
  • Between Tools in same bay T1 -gt L1 -gt T2
  • Between Tools in different bays T1 -gt L1 -gt T3
    OR T1 -gt L1 -gt S1 -gt L3 -gt S5 -gt L2 -gt T5
  • Between Tool and Storage T1 -gt L1 -gt S1
  • Between two Storage devices S1 -gt L1 -gt S3
    OR S1 -gt L3 -gt S3

M. Jung Intel
16
Unified Transport System Capable of Direct Tool
to Tool
  1. Between Tools in same bay T1 -gt L1 -gt T2
  2. Between Tools in different bays T1 -gt L1 -gt T3
  3. Between Tool and Storage T1 -gt L1 -gt S1
  4. Between two Storage devices S1 -gt L1 -gt S3

L1
M. Jung Intel
17
Multiple Transport System w/ Handoff Between
Transport Systems Capable of Direct Tool to Tool
1. Between Tools in same bay T1 -gt L1 -gt
T2 2. Between Tools in different bays T1 -gt L1 -gt
S1 -gt L5 -gt S3 -gt L2 -gt T3 OR T1 -gt L1 -gt X1 -gt
L5 -gt X2 -gt L2 -gt T3 3. Between Tool and Storage
T1 -gt L1 -gt S1 4. Between two Storage
devices S1 -gt L5 -gt S3
M. Jung Intel
18
2003 Supporting Material for Material Handling
Technology RequirementsAMHS Reliability
Metrics
19
AMHS MCBF Translated into Failures/Day
Need to update
  • Inputs
  • Outputs

20
2003 Supporting Material for Material Handling
Technology RequirementsHot Lot Delivery Time
21
AMHS Hot Lot Delivery Time
  • Goal Determine Regular AMHS Hot Lot Delivery
    Time to meet Cycle Time.
  • Factory Operations and process step assumptions
    are listed below.
  • If a Queue time of 2 days is acceptable for Hot
    Lots then AMHS Delivery Times meet Cycle Time
    Requirements.

M. Jung Intel
22
AMHS Hot Lot Delivery Time
  • Cycle / Processing / Transport / Queue Time
    Output and Assumptions
  • The following table outlines the Required Cycle
    Time and the expected processing time.
  • The transport time is directly dependent on the
    AMHS Delivery Time.
  • The Queue Time is determined by subtracting the
    Transport Time and Processing Time from the Cycle
    Time.

M. Jung Intel
23
2003 Supporting Material for Material Handling
Technology RequirementsDelivery Time
24
Carrier Delivery Time Values Metrics 1
Timestamp Description Comment Example
Write a Comment
User Comments (0)
About PowerShow.com