2003 ITRS Factory Integration Chapter Production Equipment Backup Section

1
2003 ITRS Factory Integration Chapter Production
Equipment Backup Section

• Details and Assumptions for Technology
  Requirements and Potential Solutions

2
Production Equipment Backup Outline

1. Contributors
2. How Metrics were Selected
3. SEMATECH and ITRS Metrics Alignment
4. Equipment Configurations
5. Facilities and Standards Integration
6. Process Control Systems
7. Suggested University and Industry Research for
   2004

3
Contributors to Production Equipment

• Don Martin (IBM)
• Mani Janakiram (Intel)
• Martin Haller (Infineon)
• John Fowler (ASU)
• Donald Hicks (UT-Dallas)
• Mike Schwartz (ISMT)
• Shantha Mohan (Consultant)
• Raja Sunkara (National)
• Eric Christensen (AMD)
• John Plummer (Consultant)
• Abol Taghizadeh (Tefen)

• Hiromi Yajima (Toshiba)
• Ashwin Ghatalia (Phillips)
• Dev Pillai (Intel)
• Arieh Greenberg (Infineon)
• Arnie Steinman (ION Systems)
• Court Skinner (Consultant)
• Eric Englhardt (AMAT)
• Shige Kobayashi (Renesas)
• Jeff Pettinato (Intel)
• Junji Iwasaki (Renesas)
• Michio Honma (NEC Electronics)

4
How Metrics were selected

• Almost every metric is a best in class or close
  to best in class
• Sources are Rob Leachmans published 200mm
  benchmarking data, Individual IC maker feedback,
  and I300I Factory Guidelines for 300mm tool
  productivity
• It is likely a factory will not achieve all the
  metrics outlined in the roadmap concurrently
• Individual business models will dictate which
  metric is more important than others
• It is likely certain metrics may be sacrificed
  (periodically) for attaining other metrics
  (Example OEE/Utilization versus Cycle time)
• The Factory Integration metrics are not as
  tightly tied to technology nodes as in other
  chapters such as Lithography
• However, nodes offer convenient interception
  points to bring in new capability, tools,
  software and other operational potential
  solutions
• Inclusion of each metric is dependent on
  consensus agreement

We think the metrics provide a good summary of
stretch goals for most companies in todays
challenging environment.
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International SEMATECH Metrics Alignment

• Rev 1
• 09/06/03

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ITRS/ISMT Metrics Alignment Objective Status

• Align 300mm metrics definitions that are
  collected for ISMT with those for the ITRS for
  consistency
• Status Done and Agreed for 37 metrics by ISMT.
  ITRS sync on production equipment in progress.
  Expect to complete the alignment by the end of
  the 2003 ITRS roadmap year in September
• Long term objective (2004) is to develop a
  process where best in class metrics can be
  collected globally by SIA or an independent
  equivalent and used for ITRS synchronization
• Industry Best in Class (BIC) Data sharing
  proposal will not occur in 2003 and will be
  contingent on number of global 300mm Fabs for
  2004
• JEITA (Japan) is ok with the concept, however,
  since there is only 1 300mm Fab
  (Renesas/Trecenti), all of their values will be
  lined to that fab. Timing is key for them
• Taiwan TSIA has agreed to discuss, but FtF has
  been pushed to August due to SARS
• Need to close on SIA willingness to manage cross
  regional data AR for Jeff to close by September
  FtF

7
300mm Metrics Sync Agreement with ITRSSummary of
Approvals from MMC/PAG/Council FtF Meetings

• ISMT has agreed to definitions for 36 combined
  operations, production equipment and AMHS metrics
  (see slide xx for summary)
• ISMT will use three process technology nodes for
  300mm Fabs
• 1) gt130nm, 2) 130nm and 3) lt 130nm
• ITRS defines current node as 90nm and this will
  be the focus for future BIC calculations
• Use minimum printed image on a process recipe to
  define technology nodes
• Example Use minimum printed image on Poly,
  Contacts or Isolation (DRAM) layers
• ITRS defines 130nm node as having 24 layers
• Please direct any questions or comments to
• Mike Schwartz -gt [phone]
  mike.schwartz_at_sematech.org
• Jeff Pettinato -gt [phone]
  jeffrey.s.pettinato_at_intel.com

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ISMT and ITRS Metrics Synchronization
Equipment Metrics Operational Metrics AMHS Metrics
Total Litho Aligns / Day DUV 248nm Scanner Aligns / Day 193 Scanner Aligns / Day PVD Metal Dep Outs / Day Metal etch Outs / Day Implant (HC) Outs / Day Implant (MC) Outs / Day Implant (HE) Outs / Day CMP Oxide Outs / Day CMP W Outs / Day CMP Cu Outs / Day Copper plating Outs / Day CVD ILD Outs / Day CVD Low K Outs / Day klt2.8 Spin On Low K Outs / Day Cu barrier seed Outs / Day Availability E10 (Litho, ILD Etch, Cu CMP, Cu Plating, Cu Barrier/Seed, CVD Dialectric) Utilization (Litho, ILD Etch, Cu CMP, Cu Plating, Cu Barrier/Seed, CVD Dialectric) Production Cycle Time Hot Lot Cycle Time Direct H/C (Aligns / Day) Indirect H/C (Aligns / Day Non Product Wafer Starts Usage Gas/Chemical cost / litho align Space Effectiveness (layers-wspm / mfg area) Non-Product Wafer Starts Usage ( non-revenue generating starts / total wafer starts) Non-Product Wafer Starts Usage ( non-revenue wafers processed / total wafers processed) Supplier Focused Storage MTTR Interbay Transport MTTR Intrabay Transport MTTR Storage Cycles between Failure Interbay Transport Cycles between Failure Intrabay Transport Cycles between Failure Interbay Throughput Design (Moves / Hour) Design Capable vs. actuals Intrabay Throughput (Moves / Hour) Design Capable vs. actuals General Factory Intrabay Transport Cycles between Failure Total System Avg. Fab Wide Carrier Delivery Time
9
Aligner Productivity

• Photo Alignments Completed per aligner per Work
  Day
• The average number of photo wafer alignments
  performed per machine per work day (over the
  quarter), taking into account all photo wafer
  alignments tools in the factory
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fractions if aligner only available part
  time (new installations only -not down for
  repairs)

10
248nm Scanner Productivity- I Line

• Photo Alignments Completed Per 248nm Scanner Per
  Work Day
• The average number of photo wafer alignments
  performed per machine per work day, considering
  only photo wafer alignments performed on 248nm
  Scanners in the Fab
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fractions if aligner only available part
  time (new installations only -not down for
  repairs)

11
193nm Scanner Productivity

• Photo Alignments Completed per 193nm Scanner per
  Work Day
• The average number of photo wafer alignments
  performed per machine per work day, considering
  only photo wafer alignments performed on 193nm
  Scanners in the Fab
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fractions if stepper available part time
  (new installations only -not down for repairs)

12
PVD Productivity

• PVD Metal Deposition Outs per Day per System
• Total number PVD metal deposition moves completed
  per day per system. Metal deposition refers to
  all processes in PVD tools eg interconnect,
  salicide, Ti/TiN barrier.Do not include copper
  processes
• Notes
• Rework not included
• Include production wafers, engr.wafers
  (optional), no monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - chambers/tool

13
Metal Etch Productivity

• Dry Metal Etch Outs per Day per System
• Total number Dry or non-wet metal etch moves
  completed per day per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
• (new installations only -not down for repairs)
• System is complete tool not - chambers/tool
• Metal interconnect levels only

14
High Current Implant Productivity

• High Current Implant Outs per Day per System
• Total number high current implant moves completed
  per day per system.
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - chambers/tool

15
Mid Current Implant Productivity

• Mid Current Implant Outs per Day per System
• Total number mid current implant moves completed
  per day per system.
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers Can use fraction if system
  available part time (new installations only -not
  down for repairs)
• System is complete tool not - chambers/tool

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High Energy Implant Productivity

• High Energy Implant Outs per Day per System
• Total number high energy implant moves completed
  per day per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - chambers/tool

17
CMP Oxide Productivity

• CMP Oxide Outs per Day per System
• Total number CMP Oxide moves completed per day
  per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

18
CMP W Productivity

• CMP W Wafer Outs per Day per System
• Total number CMP W wafer moves completed per day
  per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

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CMP Cu Productivity

• CMP Cu Wafer Outs per Day per System
• Total number CMP Cu wafer moves completed per day
  per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

20
Copper Plating Productivity

• Copper Plating Outs per Day per System
• Total number Copper Plating moves completed per
  day per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

21
CVD ILD Productivity

• CVD ILD Outs per Day per System
• ILD Inter Level Metal Dielectric
• Total number CVD ILD moves completed per day per
  system. ILD refers to inter-level metal
  dielectric. Typically kgt/ 2.8
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

22
CVD Low k (lt2.8) Productivity

• Low k Outs per Day per System- CVD
• Total number Low k moves completed per day per
  system by CVD
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

23
Spin-On Low k (lt2.8) Productivity

• Low k Outs per Day per System- Spin on
• Total number Low k moves completed per day per
  system by Spin on Process
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

24
PVD Copper Barrier/Seed Productivity

• PVD Copper Barrier/Seed Outs per Day per System
• Total number PVD Copper Barrier/Seed moves
  completed per day per system
• Notes
• Rework not included
• Include production wafers, engineering wafers
  (optional)
• No monitor wafers
• Can use fraction if system available part time
  (new installations only -not down for repairs)
• System is complete tool not - heads/tool

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Process Equipment Availability

• Availability defined as 100 - (scheduled
  unscheduled downtime) as per SEMI E10
• Calculate as a yearly benchmark for following
  tools
• 193nm Scanner
• 248nm Scanner
• Damascene ILD etch
• Cu CMP
• Cu Plating
• Cu barrier/seed
• Intermetal level dielectric (CVD)
• Notes
• Measure availability for cluster tools at the
  chamber level
• How to calculate chamber aggregate level?

26
Facilities and Standards Integration with
Production Equipment
27
Prod Equipment New backup foils based on
Facilities WG inputs
Design tools to operate within mainstream
facilities services capabilities
Heat load removal by increased use of
Process Cooling Water
Drive 3-5 most important tool installation
standards including pass/fail criteria test
methods
Predictable consistent tool connections for
Utilities, Drains, Exhaust, Interconnects
Production equipment must Not be affected by use
of mainstream wireless technologies (cell
phones, pagers, PDA, etc)
Use higher efficiency (higher Voltage not
current) power distribution. (gt 480V, 3 phase,
today most are 208V, single phase, very high
current)
Side view (Prod Equip)
Raised floor
Physical Separation of waste streams
Sub-fab space support equipment must fit into
shadow footprint as determined by
prime manufacturing area
Shadow footprint in sub-fab
See Next Page for Additional Details
28
Feedback to Prod Equip Team from Facilities
29
Production Equipment Standards
Legend -gt Standards Exist -gt Standards Are Under
Development -gt Standards Are Needed
30
Future Equipment Configurations
31
Type 1 Carrier Level integrated Flow and Control

Sorter Metrology with Stockers

• When Solutions Are Needed
• Research Required in 2001
• Development Underway by 2002
• Qualification/Production by 2003

• Potential Solutions Require
• Standardized Intrabay Operation
• Integrated Software
• High reliability equipment

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Type 2-1 Wafer Level Integrated Flow and
Control(Connected EFEM)
Equipment Supplier A
Equipment Supplier C
Equipment Supplier B
Wafer Staging
Carrier Staging

• Potential Solutions Require
• I/F Standard (H/W, S/W)
• Standardized EFEM
• Software
• Integrated
• Wafer level APC
• Standardized Intrabay Operation

• When Solutions Are Needed
• Research Required by 2002
• Development Underway by 2004
• Qualification/Production by 2005

Conceptual Only
33
Type 2-2 Wafer Level Integrated Flow and
Control(Expanded EFEM)
Standard Tool Widths

• Potential Solutions Require
• System controller of Equipment Group
• Wafer Dispatcher
• Module structure of equipment
• Standardized I/F
• Standardized Width
• Modular Process Steps
• High Speed Wafer Transfer
• Standardized Intrabay Operation

• When Solutions Are Needed
• Research Required by 2003
• Development Underway by 2005
• Qualification/Production by 2006

Conceptual Only
34
Type 2-3 Wafer Level Integrated Flow and
ControlContinuous EFEM (Revolving Sushi Bar)
Single Wafer
Conceptual Only
Wafer Transport

• Potential Solutions Require
• Ultra High Speed Wafer Transfer
• Target M/C to M/C 7sec.
• Wafer Level Dispatching

Carrier Level Transport
Single Chamber Process Tool
Stocker
Metrology Tool
Multi-Wafer Carrier

• When Solutions Are Needed
• Research Required by 2007
• Development Underway by 2010
• Qualification/Production by 2013

Target 450mm
35
Process Control Systems
36
Future Equipment Automation CapabilitiesDevelop
ment in 2001 with standards.
Qualification/Production by 2005
Manufacturing Execution System (MES)
Operations Data
WIP
Tool Control
Dispatch
MCS
SECS/GEM Control Line
Integrated APC/Yield Data Systems
Equipment Data Acquisition (EDA) Standards Line
Equipment Process Data
SPC
Run To Run
FDC
Yield
PCS
Today 100 variables _at_ 3 Hz each 300 values per
sec
Future EDA Goal 500 variables _at_10 Hz each
10,000 values per sec

• Equipment Capabilities
• Standardized data and connectivity
• Fast sensor sampling data transfer rates
• Host ability to stop processing as needed
• Graceful recovery when a fault occurs
• Ability to change parameters and values between
  wafers
• Wafer tracking all points within the tool

• Automation System Capabilities
• Data Sharable between APC applications
• High data transfer rates
• Single point configurations
• Integrated yield, process control, and
  operational systems
• Rapid application development (run to run
  algorithms, etc.)

37
Research Opportunities
38
Research Summary Page
Title Objective Area
FORCe II Program (SRC, ISMT, NSF) Conduct university research, directed by SRC/ISMT MC in order to address factory operations and production equipment challenges as indicted in ITRS FI Various Equipment utilization versus Cycle time, Set up reduction (High Mix), Planning, Scheduling, Modeling, PM, Data analytics, etc.



39
Proposed Research Details

• Title FORCe II
• Objective and Industry Benefit Conduct
  university research, directed by SRC/ISMT MC in
  order to address factory operations (main) and
  production equipment challenges as indicted in
  ITRS FI
• Key Deliverables Solutions in the form of
  software tools, algorithm, commercialization and
  qualified students for hire
• Timeline 3 years, starting from 2004
• Resources and Funding Needed 1M per year for 3
  years
• Potential Funding Sources NSF, SRC and ISMT will
  be funding this equally

40
FORCe II Research Topics

• 1.Performance improvements for simulation models
  for full factory with and without AMHS
  (inter-bay, intra-bay, and future direct
  transport systems) for both wafer and reticle
  delivery in fabs
• 2.Factory labor modeling tools appropriate for
  alternative labor deployment strategies under
  various automation conditions of 1) No AMHS, 2)
  Interbay AMHS, 3) Interbay intrabay AMHS
• 3.Operational control of equipment and fab output
  and cycle time variability. Including scheduling
  and preventative maintenance (PM).
• 4.Supply Chain, specific focus areas to include
  sourcing models, demand planning and modeling
• 5.Improving equipment efficiency for high mix
  factories
• 6.Backend solutions including - final wafer
  operations or bond, assembly, test of chips
• 7.Future factor design, including plug-and-play
  design and single wafer processing
• 8.Improving AMHS system throughput for interbay
  and intrabay
• 9.Financial/cost attributes in modeling (various
  business models, wafer cost, mask cost, etc.)
• 10.Factory of the future (breakthrough/disruptive
  technologies, single wafer processing, direct
  transport, etc.)

41
Process Equipment Utilization

• Utilization defined as Operational Efficiency as
  per SEMI E10, which is defined as
• (Production Time) / (Available Time)
• Calculate as a yearly benchmark for following
  tools
• 193nm Scanner
• 248nm Scanner
• Damascene ILD etch
• Cu CMP
• Cu Plating
• Cu barrier/seed
• Intermetal level dielectric (CVD)
• Notes
• Measure utilization for cluster tools at the
  chamber level
• How to calculate chamber aggregate level?