Factory Integration International FtF Meeting

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Factory IntegrationInternational FtF Meeting

• Grenoble, France
• 26-27 April 2001

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Factory Integration Grenoble FtF Attendees

• Eric Christiansen, AMD
• Klaus Eberhardt, MW-Zandar
• John Ellis, SISA
• Randy Goodall, ISMT
• Dave Gross, AMD
• Michio Honma, NEC
• Richard Oechsner, Fraunhofer IIS-B
• Lance Rist, ISMT
• John OReilly, ION
• Jeff Pettinato, Intel
• Dev Pillai, Intel
• Claus Schneider, Fraunhofer IIS-B
• Brad Van Eck, ISMT

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2001 Key Focus is on Integration and Productivity

• Productivity continues to be the key driver for
  factory integration
• Integration across all aspects of the ITRS is
  essential to drive continued productivity. These
  drive equipment and operations.
• Integration with Defect Reduction, Lithography,
  Front End Processes, Interconnect, Metrology
  TWGs is essential for these areas and basic
  manufacturing productivity

Process Technology Requirements DR, Litho, FEP,
etc
Business Drivers (Product Mix, Volume)
Factory Operations Technical Requirements (Cost,
Products Delivery Time, etc.)
Production Eqpt Tech Rqmts
Factory Info Control Systems Tech Rqmts
Material Handling Tech Rqmts
Facilities Tech Rqmts
Production Eqpt Potential Solution
FISC Potential Solution
Material Handling Potential Solution
Facilities Potential Solution
Potential Solutions
Integrated Agile Manufacturing Potential Solutions
Integrated Intrabay Potential Solutions
Integrated Process Control Potential Solutions
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2001 Focus areas for Factory Integration

• Test Manufacturing
• - Functional Test EoL Test Program Complexity
• - Production equipment standards
• - Material Handling Standards
• - Control System and CIM Standards
• - Traceability Requirements

• 300mm Intrabay Operations
• - Send-Ahead processing with AMHS
• - Direct Transport AMHS roadmap
• - Integrated Sorter roadmap
• - Reticle Handling roadmap
• - AMC 157nm Litho implications to Facilities

Integrated

• Agile Manufacturing
• - Single wafer control roadmap
• - MES Model and functions roadmap
• - e-Diagnostics standards and roadmap
• - TPT reduction and OEE improvement
• - High volume/hi-mix operations understanding
• - Scalable Fab, Risk Mgmt (redundancy, etc.)

• Process Control
• - Fault Detection Systems
• -Advanced Process Control including feed forward
  and feedback systems
• - Potential solutions roadmap
• - Standards roadmap
• - 70nm, 100nm process requirements

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Key Integration Topics with other ITWGsMeeting
Focus on Cross TWG engagement is very positive

• Defect Reduction (Discussed 26 April)
• Integrated Metrology need to ensure footprint,
  cost, productivity improvements, tool matching
  implications are well understood
• Yield Management Systems need to extended
  capabilities to support defect traceability,
  mis-process prevention, and cross correlation of
  data from multiple sources (need standards)
• Reduction of non-product test wafers for improved
  productivity
• Metrology
• Process Control need for run to run process
  control (feed forward and feedback) based on high
  payback (reduced rework/scrap) priorities. Need
  for standards, data rates, etc to facilitate
• Integrated Metrology (See above)

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Key Integration Topics with other ITWGs

• Lithography
• Intercept timeline and impacts of Litho
  Technologies on the factory/equipment
• 157nm Litho, 157nm Phase Shift Mask, Next
  Generation Litho (EUVL, X-Ray, IPL, etc), Next
  Generation Litho Reticles (no pellicle?)
• Ned for requirements on vibration isolation,
  Nitrogen environments (AMC), other
• Reticle handling and productivity in high
  volume/high mix factories
• Implications of ESD and AMC on 157nm lithography
• Integrated Metrology (See above)
• Process Control (See above)
• Interconnect
• New Technology introduction and the impact to the
  factory
• Low k dielectric, silicon on insulator,
  Electroplate Cu vs. CVD Cu, Chemically Enhanced
  Planar (CEP), Slurry-less CMP
• Process Control (See above)

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Key Integration Topics with other ITWGs

• Front End Processes
• Intercepts and Impact of FEP Technologies on the
  equipment and Factory
• High k gate stack, Solvent free post metal
  etch/Via cleans
• Process Control (See above)
• Test (Discussed 26 April)
• Need communication and data standards to transmit
  Test results and control factory equipment
• Need standard language and tools for developing /
  editing test programs
• Need for material handing to address probe head
  weight/ergo issues
• Excellent discussion on future disruptive
  technologies that may have an impact on factory
  operations and productivity (Strip testing, wafer
  level burn-in, etc)
• ESH
• Central abatement systems vs. Point of Use (POU)?
• Reduced Energy and water consumption requirements
• Stay below EPA major source limits

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Table 51 Factory Integration Difficult
Challenges (1)Summary of Agreed changes from
April 18/19th International Teleconference
Supply chain management is increasingly important
in the e-World factory output, efficiency, cost
and profitability are impacted
Reflects need to move greater volumes of material
with increasing process steps and more control
Growing need to produce multiple products / wafer
for product flexibility prelude to normal 450mm
operations?
Integrated reliability is very important to
output. Add an example
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Table 51 Factory Integration Difficult
Challenges (2)Summary of Agreed changes from
April 18/19th International Teleconference
Customer expectations have increased overall
As ASPs fall, factories must be more productive
and effective
High yield and low wafer cost are required to
address effects of high capital costs and reduced
product ASPs
Companies must conform to regulations for their
factories located around the world
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Far Year Difficult Challenges

• Post CMOS
• We do not understand and cannot predict the
  factory requirements for post CMOS semiconductors
• Will need to work extensively with IRC and other
  TWGs to comprehend potential changes
• 450mm wafer size Change
• See alternate factory models
• Intercept timing for 450mm conversion is not well
  understood
• May require vacuum or Ni atmosphere based wafer
  transportation integrated with multiple process
  equipment (See Honma-sans picture)
• This is radically different from todays factory
  model
• Alternate factory models driven by economic and
  business drivers
• Potential for significant paradigm changes in
  manufacturing away from current fab model
• Movement away from stand alone equipment,
  multi-wafer carriers,
• Factory design and capabilities will be driven by
  product volume and create clearly separate
  manufacturing models

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ITRS IRC Issues from Factory Integration

• Need a consistent intercept timing for 450mm
  wafer size. Current FI TWG assumption is 2016.
• SEMATECH model shows intercept to be 2011, but
  many believe this to be too early
• Questions about model accuracy (3 years from
  300mm experience)
• It took 5-6 years to properly intercept 300mm
  with requirements standards before equipment
  designs are too far underway.
• Need to understand intercept timing from 5 to 10
  years in advance of pilot lines and high volume
  manufacturing
• Note if 450mm factory model is drastically
  different than 300mm (I.e. single wafer
  transport/control) than conversion
  planning/research may take 10 years
• Current roadmap includes different dates for this
  intercept. Need to sync all TWGs on the
  projected intercept timing for the 2001 roadmap
• Post CMOS
• We do not understand and cannot predict the
  factory requirements for post CMOS semiconductors
• There are lots of implication to how the industry
  designs high volume operational factories that
  meet economic and business drivers