X-Ray Photoelectron Spectroscopy (XPS) - PowerPoint PPT Presentation

1 / 39
About This Presentation
Title:

X-Ray Photoelectron Spectroscopy (XPS)

Description:

X-Ray Photoelectron Spectroscopy (XPS) David Echevarr a Torres University of Texas at El Paso College of Science Chemistry Department Outline XPS Background XPS ... – PowerPoint PPT presentation

Number of Views:2594
Avg rating:5.0/5.0
Slides: 40
Provided by: pc75516
Category:

less

Transcript and Presenter's Notes

Title: X-Ray Photoelectron Spectroscopy (XPS)


1
X-Ray Photoelectron Spectroscopy (XPS)
  • David Echevarría Torres
  • University of Texas at El Paso
  • College of Science
  • Chemistry Department

2
Outline
  • XPS Background
  • XPS Instrument
  • How Does XPS Technology Work?
  • Auger Electron
  • Cylindrical Mirror Analyzer (CMA)
  • Equation
  • KE versus BE
  • Spectrum Background
  • Identification of XPS Peaks
  • X-rays vs. e- Beam
  • XPS Technology

3
XPS Background
  • XPS technique is based on Einsteins idea about
    the photoelectric effect, developed around 1905
  • The concept of photons was used to describe the
    ejection of electrons from a surface when photons
    were impinged upon it
  • During the mid 1960s Dr. Siegbahn and his
    research group developed the XPS technique.
  • In 1981, Dr. Siegbahn was awarded the Nobel Prize
    in Physics for the development of the XPS
    technique

4
X-Rays
  • Irradiate the sample surface, hitting the core
    electrons (e-) of the atoms.
  • The X-Rays penetrate the sample to a depth on the
    order of a micrometer.
  • Useful e- signal is obtained only from a depth of
    around 10 to 100 Å on the surface.
  • The X-Ray source produces photons with certain
    energies
  • MgK? photon with an energy of 1253.6 eV
  • AlK? photon with an energy of 1486.6 eV
  • Normally, the sample will be radiated with
    photons of a single energy (MgK? or AlK?). This
    is known as a monoenergetic X-Ray beam.

5
Why the Core Electrons?
  • An electron near the Fermi level is far from the
    nucleus, moving in different directions all over
    the place, and will not carry information about
    any single atom.
  • Fermi level is the highest energy level occupied
    by an electron in a neutral solid at absolute 0
    temperature.
  • Electron binding energy (BE) is calculated with
    respect to the Fermi level.
  • The core e-s are local close to the nucleus and
    have binding energies characteristic of their
    particular element.
  • The core e-s have a higher probability of
    matching the energies of AlK? and MgK?.

6
Binding Energy (BE)
The Binding Energy (BE) is characteristic of the
core electrons for each element. The BE is
determined by the attraction of the electrons to
the nucleus. If an electron with energy x is
pulled away from the nucleus, the attraction
between the electron and the nucleus decreases
and the BE decreases. Eventually, there will be
a point when the electron will be free of the
nucleus.
This is the point with 0 energy of attraction
between the electron and the nucleus. At this
point the electron is free from the atom.
These electrons are attracted to the proton with
certain binding energy x
7
Energy Levels
8
XPS Instrument
  • XPS is also known as ESCA (Electron Spectroscopy
    for Chemical Analysis).
  • The technique is widely used because it is very
    simple to use and the data is easily analyzed.
  • XPS works by irradiating atoms of a surface of
    any solid material with X-Ray photons, causing
    the ejection of electrons.

University of Texas at El Paso, Physics
Department Front view of the Phi 560 XPS/AES/SIMS
UHV System
9
XPS Instrument
  • The XPS is controlled by using a computer system.
  • The computer system will control the X-Ray type
    and prepare the instrument for analysis.

University of Texas at El Paso, Physics
Department Front view of the Phi 560 XPS/AES/SIMS
UHV System and the computer system that controls
the XPS.
10
XPS Instrument
  • The instrument uses different pump systems to
    reach the goal of an Ultra High Vacuum (UHV)
    environment.
  • The Ultra High Vacuum environment will prevent
    contamination of the surface and aid an accurate
    analysis of the sample.

University of Texas at El Paso, Physics
Department Side view of the Phi 560 XPS/AES/SIMS
UHV System
11
XPS Instrument
X-Ray Source
Ion Source
SIMS Analyzer
Sample introduction Chamber
12
Sample Introduction Chamber
  • The sample will be introduced through a chamber
    that is in contact with the outside environment
  • It will be closed and pumped to low vacuum.
  • After the first chamber is at low vacuum the
    sample will be introduced into the second chamber
    in which a UHV environment exists.

First Chamber
Second Chamber UHV
13
Diagram of the Side View of XPS System
14
How Does XPS Technology Work?
  • A monoenergetic x-ray beam emits photoelectrons
    from the from the surface of the sample.
  • The X-Rays either of two energies
  • Al Ka (1486.6eV)
  • Mg Ka (1253.6 eV)
  • The x-ray photons The penetration about a
    micrometer of the sample
  • The XPS spectrum contains information only about
    the top 10 - 100 ? of the sample.
  • Ultrahigh vacuum environment to eliminate
    excessive surface contamination.
  • Cylindrical Mirror Analyzer (CMA) measures the KE
    of emitted e-s.
  • The spectrum plotted by the computer from the
    analyzer signal.
  • The binding energies can be determined from the
    peak positions and the elements present in the
    sample identified.

15
Why Does XPS Need UHV?
  • Contamination of surface
  • XPS is a surface sensitive technique.
  • Contaminates will produce an XPS signal and lead
    to incorrect analysis of the surface of
    composition.
  • The pressure of the vacuum system is lt 10-9 Torr
  • Removing contamination
  • To remove the contamination the sample surface is
    bombarded with argon ions (Ar 3KeV).
  • heat and oxygen can be used to remove
    hydrocarbons
  • The XPS technique could cause damage to the
    surface, but it is negligible.

16
The Atom and the X-Ray
X-Ray
Free electron
Valence electrons
Core electrons
The core electrons respond very well to the X-Ray
energy
17
X-Rays on the Surface
18
X-Rays on the Surface
  • The X-Rays will penetrate to the core e- of the
    atoms in the sample.
  • Some e-s are going to be released without any
    problem giving the Kinetic Energies (KE)
    characteristic of their elements.
  • Other e-s will come from inner layers and collide
    with other e-s of upper layers
  • These e- will be lower in lower energy.
  • They will contribute to the noise signal of the
    spectrum.

19
X-Rays and the Electrons
X-Ray
Electron without collision
Electron with collision
The noise signal comes from the electrons that
collide with other electrons of different layers.
The collisions cause a decrease in energy of the
electron and it no longer will contribute to the
characteristic energy of the element.
20
What e-s can the Cylindrical Mirror Analyzer
Detect?
  • The CMA not only can detect electrons from the
    irradiation of X-Rays, it can also detect
    electrons from irradiation by the e- gun.
  • The e- gun it is located inside the CMA while the
    X-Ray source is located on top of the instrument.
  • The only electrons normally used in a spectrum
    from irradiation by the e- gun are known as Auger
    e-s. Auger electrons are also produced by X-ray
    irradiation.

21
X-Rays and Auger Electrons
  • When the core electron leaves a vacancy an
    electron of higher energy will move down to
    occupy the vacancy while releasing energy by
  • photons
  • Auger electrons
  • Each Auger electron carries a characteristic
    energy that can be measured.

22
Two Ways to Produce Auger Electrons
  • The X-Ray source can irradiate and remove the e-
    from the core level causing the e- to leave the
    atom
  • A higher level e- will occupy the vacancy.
  • The energy released is given to a third higher
    level e-.
  • This is the Auger electron that leaves the atom.
  • The axial e- gun can irradiate and remove the
    core e- by collision. Once the core vacancy is
    created, the Auger electron process occurs the
    same way.

23
Auger Electron
2
e- of high energy that will occupy the vacancy of
the core level
Free e-
3
e- released to analyze
1
4
e- gun
e- Vacancy
1, 2, 3 and 4 are the order of steps in which the
e-s will move in the atom when hit by the e- gun.
24
Auger Electron Spectroscopy (AES)
e- released from the top layer
Outer surface
Inner surface
Electron beam from the e- gun
Atom layers
25
Cylindrical Mirror Analyzer (CMA)
  • The electrons ejected will pass through a device
    called a CMA.
  • The CMA has two concentric metal cylinders at
    different voltages.
  • One of the metal cylinders will have a positive
    voltage and the other will have a 0 voltage. This
    will create an electric field between the two
    cylinders.
  • The voltages on the CMA for XPS and Auger e-s are
    different.

26
Cylindrical Mirror Analyzer (CMA)
  • When the e-s pass through the metal cylinders,
    they will collide with one of the cylinders or
    they will just pass through.
  • If the e-s velocity is too high it will collide
    with the outer cylinder
  • If is going too slow then will collide with the
    inner cylinder.
  • Only the e- with the right velocity will go
    through the cylinders to reach the detector.
  • With a change in cylinder voltage the acceptable
    kinetic energy will change and then you can count
    how many e-s have that KE to reach the detector.

27
Cylindrical Mirror Analyzer (CMA)
Electron Pathway through the CMA
Slit
Detector
28
Equation
KEhv-BE-Ø
KE Kinetic Energy (measure in the XPS
spectrometer) hv photon energy from the
X-Ray source (controlled) Ø spectrometer work
function. It is a few eV, it gets more
complicated because the materials in the
instrument will affect it. Found by
calibration. BE is the unknown variable
29
Equation
KEhv-BE-Ø
  • The equation will calculate the energy needed to
    get an e- out from the surface of the solid.
  • Knowing KE, hv and Ø the BE can be calculated.

30
KE versus BE
KE can be plotted depending on BE Each peak
represents the amount of e-s at a certain energy
that is characteristic of some element.
BE increase from right to left
1000 eV
0 eV
KE increase from left to right
31
Interpreting XPS Spectrum Background
  • The X-Ray will hit the e-s in the bulk (inner e-
    layers) of the sample
  • e- will collide with other e- from top layers,
    decreasing its energy to contribute to the noise,
    at lower kinetic energy than the peak .
  • The background noise increases with BE because
    the SUM of all noise is taken from the beginning
    of the analysis.

32
XPS Spectrum
  • The XPS peaks are sharp.
  • In a XPS graph it is possible to see Auger
    electron peaks.
  • The Auger peaks are usually wider peaks in a XPS
    spectrum.
  • Aluminum foil is used as an example on the next
    slide.

33
XPS Spectrum
O 1s
O Auger
O because of Mg source
C
O 2s
Al
Al
Sample and graphic provided by William Durrer,
Ph.D. Department of Physics at the Univertsity of
Texas at El Paso
34
Auger Spectrum
Characteristic of Auger graphs The graph goes up
as KE increases.
Sample and graphic provided by William Durrer,
Ph.D. Department of Physics at the Univertsity of
Texas at El Paso
35
Identification of XPS Peaks
  • The plot has characteristic peaks for each
    element found in the surface of the sample.
  • There are tables with the KE and BE already
    assigned to each element.
  • After the spectrum is plotted you can look for
    the designated value of the peak energy from the
    graph and find the element present on the surface.

36
X-rays vs. e- Beam
  • X-Rays
  • Hit all sample area simultaneously permitting
    data acquisition that will give an idea of the
    average composition of the whole surface.
  • Electron Beam
  • It can be focused on a particular area of the
    sample to determine the composition of selected
    areas of the sample surface.

37
XPS Technology
  • Consider as non-destructive
  • because it produces soft x-rays to induce
    photoelectron emission from the sample surface
  • Provide information about surface layers or thin
    film structures
  • Applications in the industry
  • Polymer surface
  • Catalyst
  • Corrosion
  • Adhesion
  • Semiconductors
  • Dielectric materials
  • Electronics packaging
  • Magnetic media
  • Thin film coatings

38
References
  • Dr.William Durrer for explanations on XPS
    technique, Department of Physics at UTEP.
  • www.uksaf.com
  • www.casaxps.com
  • www.nwsl.net
  • XPS instrument from the Physics Department.

39
Acknowledgements
  • Elizabeth Gardner, Ph.D.
  • from the Department of Chemistry at the
    University of Texas at El Paso
  • William Durrer, Ph.D.
  • from the Department of Physics at the
    University of Texas at El Paso
  • Roberto De La Torre Roche
  • Lynn Marie Santiago
Write a Comment
User Comments (0)
About PowerShow.com