Defense and Aerospace Screening Flows

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Defense and Aerospace Screening Flows

• Joe Fabula
• joef_at_xilinx.com

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A Little History

• The following slides show what military and
  aerospace flows were available from Xilinx for
  many years
• Feedback from the space industry and recent
  military satilitte failures indicated the need
  for more intensive screening for some
  applications
• Our currently proposed full-V flow will follow
  this brief history

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Manufacturing Flows Serving the needs from
Space to Base
R, V, H, SMD
C, I, N, M, SMD
C, I, N, M, SMD
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Supporting the Aerospace and Defense Market
PLUS
Space environmentRadiation hardened
(Mil Temp, SMDs)
Harsh environments requiring hermeticity
Ceramic packages
Select Products
(Mil Temp)
N-Grade
Wider temperature range required Plastic
packages
All Xilinx Products
CI-Grade
Controlled environments Plastic packages
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Manufacturing Flows

• C and I grade - Commercial or Industrial
  Temp, Plastic
• M grade - Military Temp, Ceramic
• N grade - Military Temp, Plastic
• R grade (for space) - Radiation tolerant,
  Military Temp, Plastic, Extended Flow
• V grade (for space) - Radiation tolerant,
  Military Temp, Ceramic, Similar to Class-V
• H grade (for space) - Radiation Tolerant,
  Military Temp, non-hermetic ceramic
• Standard Microcircuit Drawing (SMD) -
  Military and Radiation Tolerant, DSCC part number

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Extended Flows for Space

• Extended burn-in (up to 240 hours)
• XRAY
• DPA
• PIND for hermetic packages
• CSAM for plastic packages

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Product Grade ComparisonsFor Critical Supply
Chain Issues
Full documentation and controlled extended
product life cycle
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Product Grade Summary
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Where we are going

• Many changes are coming from what I will call
  acquisition reform II.
• Xilinx response to customer needs was to work
  with industry and customer experts and with DSCC
  to define screening flows that will satisfy
  future customer needs in the space and military
  markets.
• BUT, an issue arose in that technology developed
  packages to which traditional full class-S/V
  flows did not seem to apply.
• The solution was to work with our partners to
  develop screening flows for these devices which
  would demonstrate and the ensure equivalent
  reliability as standard military screening flows
  provided.

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CG560 - Ceramic Column Array

• Package Attributes
• Cavity Down, 42.5mm x 42.5 mm
• Ceramic substrate
• Interconnect 90/10 hard solder column, 0.2mm
  tall attached with 63/37 soft solder.
• Column Pitch 1.27 mm
• Thermal Resistance Theta JA 14.3 C/Watt, Theta
  JC 1.6 C/Watt
• Hermetic Product

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CG717-Ceramic Column Array
In Process Configuration - LGA

• Package Attributes
• Cavity Up, 35mm x 35mm, 1.27 mm pitch, Ceramic
  Substrate
• Interconnect 90/10 hard solder column 0.2mm tall
  attached with 63/37 soft solder
• Pin Compatible with the Virtex-II BG728
• Thermal Resistance Theta JA 12 deg C/Watt
• Hermetically sealed with Au-Sn Lid
• 60 microns Bonding Pad Pitch

Post Group D Burn-in Configuration
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CG717 Package X-Section
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CG717 Package Qualification Data
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CF1144 - Ceramic Flip Chip

• Package Attributes
• 35mm x 35mm, 1.0 mm pitch, Multi Layer Ceramic
  Substrate
• 90Pb/10Sn flip chip solder
• 90Pb/10Sn hard solder column
• Thermal Resistance Theta JA 10 deg C/Watt,
  Theta JC 0.5 deg C/Watt
• MSL1 (Non-hermetic)
• IBM technology with 30 years experience (Column)
• Lid strength 1200psi

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CF1144 Outgassing Data
Total package weight 19.3g

• Epoxy Components
• Underfill (0.56 of package weight)
• TML 0.13
• CVCM 0.00
• Lid attach material (0.31 of package weight)
• TML 0.28
• CVCM 0.16

Tested by NASA.
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CF1144 Package Qualification Data
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Xilinx/Aerospace full class V flow
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