???? ??? KANEKA Corporation ?????????????? Polyimide Film APICAL / PIXEO

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???? ???KANEKA Corporation ??????????????
Polyimide Film APICAL / PIXEO
Note The contents of this data sheet are
exclusive property of KANEKA Corp.. Prior
Permission must be obtained for any use of these
contents for purpose outside of that intended by
KANEKA Corp..
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Corporate Data
Corporate Data

• Name KANEKA
  CORPORATION
• Date of establishment September 1, 1949
• Paid-in Capital 33,046 million yen
  (as of March 31,2011)
• Net Sales 453,826 million yen
  (as of March 31,2011)
• Number of employees 8,400 (consolidated
  basis/as of March 31,2011)
• Line of business Chemicals, Functional
  Plastics,
• Expandable Plastics and
  Products,
• 
  Foodstuffs Products, Life Science Products,
• Electronic Products,
• 
  Synthetic Fibers and Others
• Head Office Osaka, Tokyo
  
• Domestic Facilities Office Nagoya
• Plant Takasago (Hyogo), Osaka,
• Shiga, Kashima (Ibaraki)
• Oversea Facilities U.S.A. / Belgium
  / Singapore /
• 
  Malaysia / Australia / China /India etc...

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Business Fields Products ?
?Chemicals
Caustic Soda
Kanevinyl
KanekaCPVC
PVC compounds
KanevinylPaste
PVC pipe for underground electric cables
?Functional Plastics
Kane Ace B
Kaneka MS Polymer
Kaneka Silyl
Kanevilack
Kaneka Hyperite
Sunduren
?Expandable Plastics and Products
Eperan- PP
Eperan
Kanepearl
Kanelite Foam
Kanelite Inser
Kanepearl Soil Block
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Business Fields Products ?
?Foodstuffs Products
PAPRÈ
Kaneka Yeast
Belco
Kaneka Margarine Kaneka Shortening
LACHENTE,FRANJE
Spices
?Life Science Products
Kaneka Plasmapheresis System
Intervention catheters
Pharmaceutical Intermediates
Kaneka Q10
Kaneka QH
Kaneka Glavonoid
?Electronics Products
Solar Circuit
Photovoltaic solar power generation system
See-through photovoltaic modules
Apical
Elmech
Kaneka Flux
Graphinity
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Business Fields Products ?
?Synthetic Fibers
Kanekalon, Kanecaron
Protex
ULTIMA
?Business Development
KANEKA Biopolymer AONILEX
Thermal solution materials for use in
electronic device components
OLED Lighting Devices
New heat-resistant materials for use in optical
device components ILLUMIKA
(a polyester biopolymer comprised primarily of
plant oil)
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Plants
Plants

• Takasago Plant(Hyogo)
• AreaAbout 1million and 280 thousand square
  meters.
• Manufacturing of caustic soda, vinyl chloride
  monomer, PVC resins, EPS resins,
• MBS resins, modified silicone polymers, acrylic
  synthetic fibers, pharmaceutical
  bulk/intermediates, functional food ingredients,
  bakery yeast, margarine, shortening.

• Osaka Plant(Osaka)
• Area About 370 thousand square meters.
• Manufacturing of extruded polystyrene foam
  boards, molded items of expanded polyolefin by
  beads method, soft PVC compounds, PET resin for
  molding purposes, medical equipment (blood plasma
  and blood purification devices), heat resistant
  PVC resins.

• Shiga Plant(Shiga)
• About 110 thousand square meters .
• Manufacturing of ultra heat-resistant polyimide
  film, optical film.

• Kashima Plant(Ibaraki)
• About 610 thousand square meters .
• Manufacturing of PVC resins, EPS resins,
  extruded polystyrene foam boards, expanded
  polyolefin by beads method, end-reactive
  polyisobutylene oligomer.

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Global Network
Global Network
Europe
America
Kaneka Belgium N.V. Kaneka Pharma Europe
N.V. Eurogentec S.A.
Kaneka Texas Corporation Kaneka New York
Holding Company,Inc. Kaneka America LLC Kaneka
Pharma America LLC Kaneka Nutrients L.P.
Asia/Oceania
Kaneka Singapore Co.(Pte.)Ltd. ?Kaneka Trading
(Shanghai) Co.,Ltd. Kaneka Eperan (Suzhou)
Co.,Ltd. HiHua Fiber Co.,Ltd. Kaneka (Malaysia)
Sdn.Bhd. Kaneka Eperan Sdn.Bhd. Kaneka Paste
Polymers Sdn.Bhd. Kaneka Innovative Fibers
Sdn.Bhd. ?Kaneka Pharma Vietnam Co.,Ltd. ?Kaneka
India Pvt.Ltd. ?TGA Pastry Company Pty. Ltd.
Major Overseas Consolidated Subsidiaries ?Major
Overseas Non-Consolidated Subsidiaries
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??????????? Development Concept of Kaneka
??? Kaneka
Market Needs ?????
?? Product
???? Core Technology
Polyimide Film APICAL
Key Technology
????? High-Density Interconnection
??????? Film Casting Technology ???? Molecule
Design Technology ???? Polymer
Synthesis Technology ???? Formulation
Technology
????? New Process ???????? Fine
Pattern ???? Thermal Management
Design ???? Circuit Design
Polyimide Film for Two Layer Copper Clad
Laminates PIXEO-BP
????? Parts Downsizing Miniaturization
High Thermal Conductive Graphite Sheet
GRAPHINITY
LED?? LED Chip Mounting
Development Concept Target
????????? Power Devices
Colored PI
???? High Speed Transmission ????????????? Imped
ance Control
Photo Sensitive PI
Thermal Conductive PI
Transparent PI
KANEKA CONFIDENTIAL
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Development Status
?????? CL 3?FCCL? 3L FCCL 2?FCCL? 2L FCCL ???? Related Materials
?? Current Line-ups APICAL AH APICAL NPI APICAL AH APICAL NPI PIXEO FC ????????? Graphite seat
??? Under Development ?????? Photo Image-able Ink ??PPI White PI PIXEO FRS PIXEO 2mil ???PI Soluble PI ??PI Transparent PI
?? Future Line-ups Low CTE PI Heat spread PI Low CTE PI Heat spread PI
KANEKA CONFIDENTIAL
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PI?????PI Business History of Kaneka
1980 ????????????????? KANEKA Begins RD on
Polyimide Film 1984 ???????????????(1??)1st
Apical Production Line Started in Japan
FPC???????????? Market Penetration with focusing
on FPC Application 1987 ??????????(2??)2nd Line
Started in Japan 1988 ??????????????NPI???
Developed Apical NPI High-Dimensional Stability
Grade 1989 ????????????????? US Production line
Started 1994 ISO9002?? Apical ISO 9002
Certification world-wide 1998 ??????????(3??)3rd
Line Started in Japan 1999 ISO14000?? KANEKA ISO
14000 Certification 2000 ???????????(CERN)???????
????????? ????????????? Approved as a sole
supplier of the insulation material for
superconductive accelerators at CERN
(European Organization for Nuclear Research) 2001
???? ??????(4??)4th Line Started in Japan 2004
???? ??????(5??)5th Line Started in Japan in
April 2005 ???? ??????(6??)6th Line started in
October in Japan 2006 ?????BP????? Started Sales
of PIXEO BP ????? 2400t(??)?200t(??)Current
Capacity 2400MT in JPN, 200MT/Yr in USA
KANEKA CONFIDENTIAL
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?Polyimide Film APICAL
?? Features ??????????????? Ultra-heat /
cold-resistant, Radioactive rays-resistant
?? Applications ??????(?????????????????)
Insulation Materials for Motors and Cables of
Aircraft / Locomotives. FPC(?????HDD?????????
?) Flexible Print Circuit(Mobile Phones, HDD,
Optical pick-up) ?????????????? Supper
Insulation Materials for Satellites and
Supper-conductive Equipments
KANEKA CONFIDENTIAL
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?????????Current line up of Polyimide Film
APICAL

• ????AH???????????????
• APICAL AH Conventional Grade
• 
  
• ????NPI??????????
• APICAL NPI High-Dimensional Stability
  Grade
• - ?????????
• Similar coefficient of thermal expansion as Cu
  foil
• - ????AH???30?????
• Modulus is 30 higher than Apical AH grade

???? Grade ??(µm)Thickness
APICAL AH 12.5 25 50 75 125
APICAL NPI 10 12.5 25 50 75 125
KANEKA CONFIDENTIAL
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??????? Typical Properties of APICAL
KANEKA CONFIDENTIAL
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?????2???????? Polyimide Film for Two Layer
Flexible Copper Clad Laminates ???? BP PIXEO BP
?? Features

• ???? High Heat Resistance
• ???? High Flexibility
• ??????? Lower Stiffness
• ?????? High Dimensional Stability
• ?????????? Migration resistance
• ?????? Laminating properties
• ??????? Green material

KANEKA CONFIDENTIAL
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?? Structure
??? ???? FPI Core layer APICAL FPI
???? ???????? Adhesive layer TPI
???????? Line Up of Products

• ?FC ????? Standard Type
• ?FRS ????? High Heat Resistance Type

KANEKA CONFIDENTIAL
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???????? Grade Line-Up (by Thickness)
????Grade ?? Thickness FC FRS ??? Under Development
12.5µm ?
14µm ?
18µm ? ?
25µm ? ?
50µm ?
KANEKA CONFIDENTIAL
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???? BP ??? Typical Properties of PIXEO BP
KANEKA CONFIDENTIAL
?????????????????????????? ?These data are not
guaranteed values but the typical measurement
values at Our Company.
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????BP????2?????????? Typical Properties of Two
Layer FCCL using PIXEO BP
?? Item ?? Item ?? Unit ???? Method FC Type FRS Type
????? Dimensional Stability MD/TD ?????? After etching IPC-TM-650 2.2.4 -0.02/-0.02 -0.02/-0.02
????? Dimensional Stability MD/TD ??? After aging 150?/30min IPC-TM-650 2.2.4 -0.01/0.01 -0.01/-0.01
?????1 Peel Strength ?? As received N/cm IPC-TM-650 2.4.6 17 17
?????1 Peel Strength ??? After solder float 288?/10sec N/cm IPC-TM-650 2.4.6 17 17
????? Solder Resistance ?? As received - IPC-TM-650 2.4.13 300?/60sec ???? No popcorn 350?/60sec ???? No popcorn
????? Solder Resistance ?? After conditioning 85?/85RH/72hrs - IPC-TM-650 2.4.13 250?/60sec ???? No popcorn 300?/60sec ???? No popcorn
KANEKA CONFIDENTIAL
?????????????????????????? ?These data are not
guaranteed values but the typical measurement
values at Our Company.
1 ????18µm(1/2oz) Copper foil Rolling
1/2oz ????????????? Measured by Kaneka
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Kanekas photosensitive liquid coverlay material
?Features? UL94 VTM Flammability (Halogen
free) Exceptional low modulus (0.51.0GPa)
Excellent bending resistance (1020times)
Compatibility with processing conditions of
conventional PSR
KANEKA CONFIDENTIAL
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