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Enhance Performance of GaN based LEDs Under High Currents

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An electrical device that, with bias voltage, allows varying degrees of current to flow ... Derrick, Ben, and Jordan for being in the office. The End ... – PowerPoint PPT presentation

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Title: Enhance Performance of GaN based LEDs Under High Currents


1
Enhance Performance of GaN based LEDs Under High
Currents
  • Luke Seale Barry Zhong
  • Shuji Nakamura Steven DenBaars

2
Diodes
  • An electrical device that, with bias voltage,
    allows varying degrees of current to flow
  • A typical diode consists an electron rich N-type
    material and a hole rich P-type material

N
?
N
OFF
ON
?
P
P
3
Gallium Nitride-based Materials
  • Doped with Magnesium for P-type, Silicon for
    N-type
  • Grown epitaxially with MOCVD (Metallic Organic
    Chemical Vapor Deposition)
  • Trimethol Gallium and ammonia gas are flown over
    a substrate at 1000º C, so they get deposited
  • InGaN is used for the active region, from which
    light is emitted

4
How an LED Works
  • An efficient LED uses a direct bandgap material,
    such as Nitrides
  • A bandgap is the energy difference between the
    conduction and valence energy bands
  • When an electron recombines with a hole, it emits
    a photon with the equivalent energy of the band
    gap.
  • Diffusion area

Gallium Nitride
N
Conduction Band (electrons)
3.2 eV released
Diffusion length
Valence Band (holes)
P
5
Double Heterostrucure and Quantum Well LEDs
  • InGaN layer with smaller bandgap
  • Higher carrier concentration
  • R Bnp

N
electrons
N
3.2 eV
holes
P
P
Band diagram of double heterostructure (invented
by Herbert Kroemer)
Band diagram of quantum well structure
6
Consequences of Using Quantum Well Design
  • Current overflow
  • Possible solutions
  • Increasing quantum well numbers
  • Larger surface area to reduce current densities

7
How LEDs are Made
  • MOCVD for epitaxial layer growth
  • Rapid Thermal Annealing for P-type GaN activation
  • ITO for transparent P contacts
  • Photolithography
  • Plasma etching to form mesas
  • E-Beam evaporation for metal contacts

8
Finished Device
A cross-section of a device (not proportional)
Top view of the device
1 mm
9
Test Subjects
  • Small .25mm x .5 mm device
  • Large 1mm x 1mm device (Powerchip)

10
Testing the Devices
  • Use a function generator to bias the device and
    measure current
  • Use a spectrometer for wavelength
  • Use a photometer for output power

11
I-V Curve
  • The dark line is the powerchip, the dashed is
    the small device.
  • The small devices curve ends earlier because we
    were afraid of burning it
  • The powerchip has lower voltages for the same
    drive current

12
L-I Curve
  • The thick line is the powerchip, the dashed is
    the small device
  • While the small device performs better at lower
    currents, the powerchip is more intense at higher
    currents, which we care about.

13
Conclusion
  • The Powerchip performed better in both criteria
  • Since it is larger, the injecting area for
    carriers is larger and the device can be operated
    at higher currents

? An awesome powerchip LED being tested under
high current
14
What I learned
  • That semiconductor physics is fascinating,
    complex, and very intriguing
  • That college textbooks use dense language to
    describe relatively simple things
  • That clean rooms are full of expensive machines
  • That LEDs are the future
  • That Barry is helpful and hilarous

15
Acknowledgements
  • Barry Zhong for being my mentor
  • Shuji, Steve, and Jim for advising Barry
  • The other AR interns for being good company
  • Derrick, Ben, and Jordan for being in the office

16
The End
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