Project: Electromigration

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Do you want to know what is inside a chip?
Vloer 3 THE place to be!!!
Leerstoel HC Groep IDR
chip
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IC-technology, devices and reliability
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IC-technology, devices and reliability

• Dielectrics
• Reliability of very thin dielectrics
• Novel materials to replace SiO2
• Metallization
• Fabrication of advanced metallization (deposition
  and CMP)
• Reliability of interconnects
• Thin Film Physics
• Deposition
• Modelling and characterisation
• Application (TFTs)
• ElectroStatic Discharge
• Modelling ESD effects in Integrated Circuits and
  TFTs

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IC-technology

• Optimising process steps used for the fabrication
  of advanced IC devices.
• Thin dielectrics
• Cu metallization
• Issues
• New materials
• New processes
• Processing, material and electrical
  characteristics

• Optimising process steps used for the fabrication
  of advanced IC devices.
• Thin dielectrics
• Cu metallization
• Issues
• New materials
• New processes
• Processing, material and electrical
  characteristics

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Devices

• Device physics
• Understanding
• fundamental principles
• New devices
• TFTs, memories
• New applications
• Nanolamps

Pentium 3
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Reliability

• Degradation
• Shift in parameters during lifetime (Vt, Ids
  ,...)
• Predictions of lifetime based on models
• Failure mechanisms
• Physical mechanisms of breakdown
• What happens during Electrostatic discharges
• What is the bottleneck?
• Modeling
• Device and circuit simulations
• Understanding degradation and breakdown
• Suggestions for improvements

FIB analysis
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Project
Plasma damage
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Project
Dielectric Limits for EMbedded(non-volatile)
Memory Applications
Door de steeds kleiner wordende afmetingen op
chip wordt embedded flash geheugen steeds
belangrijker. Denk hierbij bijvoorbeeld aan het
adressenbestand in je GSM. Maar door deze kleiner
wordende afmetingen komen we ook steeds dichter
bij de fysische limiet. Dit project probeert uit
te zoeken hoe dun het tunnel-oxide in flash
geheugen mag zijn voor de toekomstige 100 nm
technology. Samenwerking met Philips
Semiconductors Nijmegen en Philips Research
Eindhoven.
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Project
Thin film dielectricsDeposition and
characterisation
Our aim is to obtain high-quality dielectrics at
glass compatible temperatures, for thin film
transistors. MOS devices are used to test the
dielectrics deposited by Jet Vapor Deposition and
Electron Cyclotron Resonance PECVD.Cooperation
with DIMES, Delft.
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Project
Technology for stable TFTs
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Project
Reliability of TFTsESD phenomena in a-SiH TFTs
for AM-LCD applications
Thin film transistors (TFT) are widely used
devices, especially for liquid crystal displays
(LCD), but they are very hard to understand. We
investigate the behaviour of TFTs during
electrostatic discharges (by applying short
(100ns) high voltage (gt500V) pulses).
Cooperation with Philips Research UK and
Eindhoven.
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Project
ElectroStatic Discharge
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Project
Chemical Mechanical Polishing of Copper
80386, 80486, 80586, Pentium, Pentium II
Our microprocessors are getting bigger and
faster, devices in chips are getting smaller and
packed at higher density. Aluminium then no
longer can be used in wiring circuits in chips.
Dont panic, COPPER HAS ARRIVED! We are doing
research on know-how to form Copper circuits in
chip by using Chemical Mechanical
Polishing. Cooperation with Philips
Semiconductors Nijmegen and Philips Research
Eindhoven.
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Project
CVD barriers for Cu metallization
Ultra-thin barrier and adhesion layers are
needed when Cu is used for metallization in
advanced ICs. Barriers can be characterised by
C(V) measurements of capacitors or transistors,
before and after BTS (Bias Thermal Stress), or by
I(V) measurements of diodes. What are the reasons
for barrier failure? Cooperation with Philips
Semiconductors Nijmegen and Philips Research
Eindhoven.
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Project
Electro-thermo-mechanical effects in
metallization films
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Project
Silicon Nanoscale LightEmitting Anti-fuse Diodes
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EU Project
SafegasSensor Array for Fast Explosion-proof Gas
Monitoring
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Upcoming projects

• 1/f noise, physical characterization
  (collaboration with IC-O)
• Reliability of advances dielectrics
• Charge-Device-Model ESD
• Temperature stability of gate-dielectrics

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Scientific staff IC-technology, devices and
reliability
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Conclusies

• IDR biedt een heel scala aan onderwerpen
• Technisch Cleanroom
• Elektrisch Meten/karakteriseren, eigen
  meetlaboratorium
• Modelleren en simuleren verschillende world
  class pakketten
• Veel contact met de industrie
• Samenwerken met promovendi
• Kom eens langs bij promovendi of medewerkers!

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