Advanced Embedded Passives Technology Consortium

1
Advanced Embedded Passives Technology Consortium
Industry Seminar January 30, 2003 Austin, TX
This work was performed under support of the U.S.
Department of Commerce, National Institute of
Standards and Technology, Advanced Technology
Program, Cooperative Agreement Number 70NANB8H4025
2
Large Bandwidth Transmission
New applications enabled by high speed networking
An interactive multimedia magazine, including
text, images, live-audio, live-video, animations,
3D computer graphics and embedded electronic
commerce and communication functions.
A demonstration of several remote monitoring,
steering, and visualization tools for Remote
Black Hole Simulations and Remote Visualization
of Large-Scale Datasets.
Linked Databases
This application emphasizes distributed parallel
supercomputing and a collaborative
virtual-reality computation steering environment
applied to Grand Challenge problems.
Tele-Immersive
3
Project Approach (continued)
4
Assembled Transceiver Module
5
Nortel Emulator Design

• View of board layout as seen looking down on the
  primary layer.
• Reuse of package design and heatsink
• Compare to a 1 meg modem this unit is capable
  10,000 X traffic.

6
Product Emulator Stack-up

• 14 layers
• 4 embedded capacitor layers (each with 2 copper
  layers ground power)
• The power layer of each capacitor will act as a
  power plane for a specific voltage.
• 2 routing layers
• SIG1 ? high speed signals
• SIG2 ? other routing
• 1 layer (PWR) for routing of power values not
  used in the planes of embedded capacitors.

Capacitor sandwich
7
Project Structure

• Nortel wanted to demonstrate embedded passives on
  a high performance product thus chose the 10 Gb
  Transceiver module.
• Product Emulator approach was developed to pipe
  clean the materials and fabrication for embedded
  passives using a real product.
• Nortel worked on several design before settling
  on the 10 Gb optical transceiver module.
• The version 1 design to use MacDermid resistor
  technology and 3M C-Ply capacitor technology.
• This first version was fabricated by Merix.
• The testing was done to show equivalence to the
  existing product.
• A second design was done using the same
  capacitor structure of 3M C-Ply material but
  expanded to include 4 decades of ceramic
  resistors from Dupont.

8
Nortel Emulator
The product emulator modified a current product
under development by embedding resistors and
decoupling capacitors.
9
Cost Analysis

• Circuit board embeddable components cost using
  fix circuit size, the EP version has an adder of
  10
• Circuit board embeddable cost allowing circuit
  size to shrink, the EP version has a cost saving
  of 25 due mostly panelization efficiency
• In an effort to compare /Mb, it is not fair to
  compare the cost/Mb of information transfer
  between a 1 Mb modem or ADSL and the 10Gb optical
  transceiver module even though they perform a
  similar function, because they have different
  customer base, but assuming one could, the system
  cost advantage is about 20X.
• Embedded passive technology is an enabling
  technology to allow cost effective transmission
  of speed greater than 2.5 Gb over copper.

10
Power Decoupling Capacitor Application Trendsand
Comparison with Future Embedded Capacitor Core
Decoupling Capacitance Sum (Ascending Order)
for 3 Different PCB Designs
10000000
1000000
100000
10000
60 nF/sq. in.
Embedded Bulk Capacitor Core
Mixed A/D
Design
1000
10 nF/sq. in.
IOP Card
Capacitance Sum, nano-Farads
100
Processor Card
10
1
0.1
High-Frequency Decoupling Capacitor Population
0.01
0.001
0.01
0.1
1
10
100
1000
10000
100000
1000000
Capacitor Value, nano-Farads
11
Summary

• Embedded passives one of the enabling
  technologies for high performance 10 Gb
  interconnect
• Emulator demonstrated performance improvement in
  reach with signal integrity of 20
• Nortel product groups plan to use EP in products
  that will be in market in 2004