Nanofab Lab Microfab Lab Surface Analysis and Nanoimaging Lab

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Nanofab LabMicrofab LabSurface Analysis and
Nanoimaging Lab
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Nanofab Overview

• 5300 ft2 of clean lab space
• Research and teaching activities
• Major support by Users, COE, VP, and State
• Personnel
• 6 full time staff gt5 part time and work study
• Directly supports classes for gt5 faculty
• TAs for classes
• Users
• 30-40 PIs across multiple colleges, universities,
  and industries
• 70-90 Users/Students

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Nanofab Expansion

• Actively pursuing a new building
• 25M USTAR
• Leverage with regional partnerships and govt
  agencies
• Support for bricks and mortar
• Support for new tools
• Newer infrastructure
• Greater safety

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Toolset Photolithography

• Mask Generation
• Electromask MM250
• 3" - 7" Cr masks
• Bright or dark field
• CAD and design tools
• Aligners
• Suss MA1006
• EV420
• Processing Support
• Developing Wet etch DI water Spinners
• A variety of photoresist chemistries

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Toolset Thin Film Deposition

• Sputter Deposition
• 4 Systems
• 10-3" 3-8" and 2 large sources
• Evaporation
• 2 Systems
• 1 Thermal and 1 e-beam
• CVD
• 6 systems
• Plasma Enhanced Low Pressure Atm. Pressure
• Electrodeposition
• Ni, Cu, and Au chemistries

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Toolset Etch and Modification

• Dry Etching
• 5 Systems
• RIE DRIE Asher Ion Mill
• Wet Etch
• Many chemistries
• Surface and Bulk machining
• Laser Machining
• 2 Systems
• Polishing
• 1 Advanced System
• 2 Basic Systems
• Furnaces
• 13 tube furnaces

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Toolset Test and Packaging

• Optical Microscopy
• 4 Scopes w/ digital acquisition
• Electrical
• 3 probe stations
• 3 parameter analyzers
• I-V C-V
• Four-point probe
• Packaging
• 2 Wirebonders
• 3 Dicing saws

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Kratos AXIS UltraDLD

• Techniques available
• X-ray photoelectron spectroscopy (XPS/ESCA)
• Monochromatic Al and Ag
• Achromatic Al and Mg
• Auger electron spectroscopy (AES)
• Field-emission electron source
• SEM imaging available
• Ion scattering spectroscopy (ISS / LEIS)
• He ion beam source
• Bipolar hemispherical analyzer
• Probes 1 monolayer
• Depth profiling
• Ar ion beam source

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DI Dimension 3000

• Sample Requirements
• Maximum height 5 µm
• Maximum scan area 100 ? 100 µm2
• Height resolution 1 Å
• Lateral resolution Nearly atomic
• Sample size up to a 6" wafer
• Sample height up to 1 cm

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Zygo Newview 5032

• Information Acquired
• Quantitative surface morphology/topography
• Quantitative surface roughness
• Image surface with white light (optical
  microscopy)
• Optical interferometry for height quantification
• 1?, 2?, 5?, 10?, 20?, 50?, 100?
• Currently have 5 and 20? objective

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Woollam V-Vase

• Variable angle spectroscopic ellipsometer
• Information acquired
• Film thickness
• Index of refraction and extinction coefficient
• Band gap
• Multilayer analysis with roughness
• Automated translation stage with 6" of motion
• Beam focusing for improved results on transparent
  substrates
• Combinatorial analysis

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Affiliated Labs

• Affiliated Labs
• Goal make isolated instruments belonging to
  particular faculty more general accessible
• Witec alpha 300
• Scanning Nearfield Optical Microscopy
• Confocal Raman Microscopy
• Atomic Force Microscopy (Contact Mode)
• Laser Institute c/o Jordan Gerton and Randy
  Poolsen
• Microtomography lab
• X-ray CT focused on microscale features
• 5 - 20 µm resolution

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Vision for the future

• Improve the tools and services offered
• Capped rates for Utah academic institutions
• Continue preliminary data seed fund grant to
  foster successful grant-writing
• Provide high quality tools and educational
  experiences
• Work with the local high-technology community to
  foster RD activities
• Work with the user community to target critical
  tools for cutting-edge research
• Continue to acquire and support needed tools
• Example
• Comprehensive Electron Microscopy Facility
• TEM FE-SEMs FIB - through State, Fed, and Univ
  partnerships