Title: Impact of Leakage and Variations on Sense Amplifiers for OnChip SRAMs
1Impact of Leakage and Variations on Sense
Amplifiers for On-Chip SRAMs
- M.S. Thesis Proposal by
- Aiyappan Natarajan
- Chair Prof. Wayne Burleson
- Interconnect Circuit Design Group
- University Of Massachusetts Amherst
- This project was funded by Intel Corp.
2Outline
- Introduction
- Motivation Issues in Sub-100nm CMOS
- Sense Amplifier Circuits
- Bitline Leakage Compensation
- Experimental Setup and Methodology
- Results
- Proposed Work - Timeline
- Conclusions
3Introduction
- Sub-100nm issues
- Leakage current and intra-die variations increase
- On-chip memory size getting bigger
- Increase in bitline capacitance
- Memory performance is important (Sense
Amplifiers) - Problem Statement
- This thesis evaluates 4 differential sense
amplifiers in terms of delay and energy using a
70nm CMOS technology under the interaction of
increasing - Bitline capacitance
- Bitline leakage
- Intra-die variations
4Motivation
- Issues in sub-100nm CMOS technologies
- Increasing variations in intra-die device and
environment - Reduced Device Dimensions
- Fabrication Process
- Operating conditions
- Increasing leakage current
- Supply voltage (VDD) and threshold Voltage (Vt)
reduction due to scaling
5Variations
- Device Variation
- Geometry Variations
- Effective channel length (Leff - 40 variation )
- Electrical Parameter Variation
- Threshold voltage (Vt - 10 variation)
- Environmental Variation
- Temperature (30)
- Power Supply (10)
(180nm)
(100nm)
(70nm)
(130nm)
Year
Device and interconnect (intra-die) variation
trends for different technology generations
D.Boning, Models of process variations in
device and interconnect, in Design of
High-Performance Microprocessor Circuits, A.
Chandrakasan, W. Bowhill and F. Fox, IEEE Press
2001
6Leakage Current with Technology
V.De, Intel 2001
7 times
- Subthreshold leakage current is dominant
- Exponentially dependent on temperature and Vt
- Increasing leakage current with die area
Above simulations matched with the projected off
currents given by Intel in Design of
High-Performance Microprocessor Circuits, A.
Chandrakasan et al., IEEE Press 2001
7Memory System Design
- Microprocessors need for faster and larger
memories is increasing with technology - On-chip memories constitute an increasing portion
of transistor count - (60 for Alpha 21264 Gieseke et al. )
- Performance, power and yield of microprocessor is
highly dependent on memory design - This need for bigger and faster on-chip memories
increases - Bit-line Capacitance
- Leakage Currents
- Impact of Variations
8 Memory System
- Critical path of memory system for read operation
- Address Register
- Row Decoder
- SRAM column
- Sense Amplifier
- Comparator
- Output Buffer
SRAM Array
ROW DECODER
ADDRESS REGISTER
Address
Column Mux
COLUMN DECODER
COLUMN DECODER
Sense Amplifiers
Input/Output Register
Comparator
Information Bits
CMOS Memory Circuits by Tegze P. Haraszti,
Kluwer 2001
9Effect of Bitline Capacitance
- Dependent on number of cells per column
- S (Ci)acc
- Interconnect Capacitance
- Small cell size weak driver
- Bitline switching is slow
- Solution
- Differential sense amplifiers
- Precharge
n
i 0
10Leakage in Memories
- Cell Leakage
- Currents through MN3 and MP2
- Static Power Dissipation when cell not accessed
- Bitline Leakage
- Currents through access devices (MN5 and MN6)
- Drops signal amplitude in bitlines
- Affects the memory performance
V(Q) Vdd V(Q) 0 V
11Bitline Leakage
WL_0
- Number of Cells per column
- Data stored in the cells
- Worst case leakage
- All cells but one store same data
- Topmost one accessed
- Modeled as a noise
- Delays bitline differential development
- Solution
- Compensate the bitline leakage
- Bitline leakage compensation Agawa et al.
- Reduce the number of cells per column
1
0
Icell0
Icell1
Ileak1
Ileak2
12Sense Amplifier Circuits
- Amplify small signal difference in bitlines to
CMOS voltage levels - Improve memory performance
- Energy efficient as highly capacitive bitlines
dont swing full-rail - Voltage-mode
- Cross-Coupled Inverter Latch (C2IL)
- Alpha Latch
- Current-mode
- Clamped Bitline Sense Amplifier (CBLSA)
- Modified Differential Current Sense Amplifier
(MDCSA) - Izumikawa Current Sense Amplifer (ICSA)
- Charge-Transfer Sense Amplifier (CTSA)
13Voltage-mode Sense AmplifierCross-Coupled
Inverter Latch (C2IL)
- Bitlines coupled to output node
- Bitlines terminated at the gates of the two
inverters - Cross-coupled inverter pair provides high-gain
- Voltage difference in the input nodes amplified
to CMOS levels by the latch
T. Uetake et al., A 1.0ns access 770Mhz 36kb
SRAM macro, In ISSC Dig. Tech. Papers ,
pp.176-177, Feb 1997
14Functionality of C2IL Read Cycle
t1
t2
Total Delay t1 t2
15Voltage-mode Sense AmplifierAlpha Latch
- Two additional NMOS devices
- Isolates input and output nodes
- High input-impedance
- High probability of device mismatch
B. Gieseke et al., A 600 Mhz superscalar RISC
Microprocessor with out of order execution, IEEE
JSSC, 542-548, 1991
16Functionality of Alpha LatchRead Phase
17Current mode Sense Amplifiers
- Performance of voltage-mode depends on
differential discharging of the bitlines - Increase in bitline capacitance increases the
sensing delay - Current-mode sense amplifiers provide low-input
impedance - Reduced effect of bitline capacitance
- Amplify the current difference in the bitlines
and hence are faster than voltage-mode
18Current-mode Sense AmplifierClamped Bitline
Sense Amplifier (CBLSA)
- Low-input impedance provided by MN3 and MN3B
- Amplifies current difference (MN3 and MN3B)
- Cross-coupled inverters
- Bitlines are pulled-down
T. N. Blalock, and R. C. Jaeger, "A High- Speed
Clamped Bit-Line Current-Mode Sense Amplifier,"
IEEE JSSC, pp. 542-548, Apr. 1991.
19Functionality of CBLSARead Phase
20Modified Differential Current Sense Amplifier
(MDCSA)
- Simple Four Transistor (SFT)
- Provides virtual short-circuit to bitlines
- Maintains almost the same potential
- Modified CBLSA circuit as second stage
- Input and output nodes are isolated
- Low-swing in the bitlines
M.Sinha, Low-Voltage Sensing Techniques for
High-Speed On-Chip Global Interconnects and
Caches, MS Thesis, ICDG, UMass Amherst
21Functionality of MDCSARead Phase
22Bitline Leakage Compensation (BLC)
- Bitlines precharged to Vdd-Vtp
- Detects and measures the bitline leakage current
- Stored in a capacitor (CAP7)
- Injects the same leakage current into the
bitlines during read phase
K. Agawa et. al , A Bitline Leakage Compensation
Scheme for Low-Voltage SRAMs, IEEE JSSC, Vol.
36, No. 5, May 2001
23BLC Timing Precharge phase TA
K. Agawa et. al , A Bitline Leakage Compensation
Scheme for Low-Voltage SRAMs, IEEE JSSC, Vol.
36, No. 5, May 2001
24BLC Timing Precharge phase TB
K. Agawa et. al , A Bitline Leakage Compensation
Scheme for Low-Voltage SRAMs, IEEE JSSC, Vol.
36, No. 5, May 2001
25BLC Timing Precharge phase TC
K. Agawa et. al , A Bitline Leakage Compensation
Scheme for Low-Voltage SRAMs, IEEE JSSC, Vol.
36, No. 5, May 2001
26BLC Timing Read cycle TD
K. Agawa et. al , A Bitline Leakage Compensation
Scheme for Low-Voltage SRAMs, IEEE JSSC, Vol.
36, No. 5, May 2001
27Read Phase of C2IL with BLC circuit(Worst Case
Leakage)
200ps
120ps
No BLC Circuit
With BLC circuit
- Both the bitlines are pulled down for worst case
leakage condition - With BLC circuit BL stays high while BL is
pulled down - Bitline differential develops more quickly
28Experimental Set-up
- Memory column with varying number of cells
32,64,128, 256 and 512 - Topmost cell stores a 1 and rest of the cells
store a 0 - Topmost cell accessed
- Worst case delay and leakage
- One Sense Amplifier shared by four memory columns
- Bitlines precharged to Vdd
29Assumptions
- All circuits were designed in a 70nm CMOS
technology from Berkeley Predictive Technology
Model (BPTM) and simulated using HSPICE - Nominal Case Vdd 1V, Vtn 0.2 V , Vtp
-0.22 V and Temp 25C. - Worst Case Leakage Vdd 1V, Vtn 0.15 V,
Vtp -0.1502 V and Temp 110C. - Bitline parasitics modeled as a 5-p network for a
group of 32 cells - Voltage-mode sense amplifiers fired after an
input offset of 50mV and current-mode sense
amplifiers fired after an input offset of 20 µA
R.K.Grube et al., Design limitations in deep
sub-0.1um CMOS sram, Great Lakes Symposium on
VLSI, 2002, pp.94-97
30Simulation Methodology
- Run simulations without enabling the sense
amplifier - Determine time to fire the sense amplifier
- When bit-line differential is developed
- Re-run simulations with the appropriate sense
enable (SAen) signal - Perform the above steps with
- Worst case leakage conditions
- BLC circuit under worst case leakage conditions
31Impact of Variations on C2IL
- Intra-die variations that lead to worst case
delay - Assume BL stays high and BL going low
- Reduced Leff and Vt for the highlighted devices
- Delayed offset voltage at the input nodes
32RESULTS Impact of Variations on C2IL
- 10 mismatch in Leff and Vt causes 20 increase
in the delay - Idsat kn (W/Leff)(Vgs-Vt)2/2
- Circuit malfunctions for more than 12 variation
33RESULTS Effect of Bit-line Capacitance
- Current sense amplifiers perform better
- MDCSA performs better than all others
- Alpha latch performs better than C2IL for longer
columns
Total Delay (WL to SAout) vs. No. of Cells Per
Column of Bit-line
34RESULTS Effect of Bitline Leakage
- Leakage affects performance significantly for
all sense amplifiers - MDCSAs performance degrades with bitline
leakage - CBLSA performs better than all other sense
amplifiers
35RESULTSEffect of BLC Scheme
- BLC is effective in reducing the impact of
bitline leakage - However, not fully compensating the bitline
leakage current
36RESULTS ENERGY COMPARISON
- Voltage-mode provides low-energy dissipation
- Current-mode dissipates more energy
- CBLSA pulls down the bitlines
- MDCSA has more direct path currents
- Leakage conditions affect energy consumption by 3
times
37Proposed Work
- Same experiments on two other sense amplifiers
- Izumikawa Current Sense Amplifer
- Charge-Transfer Sense Amplifier Manoj 02
- Effect of variations on the delay of all sense
amplifiers - Variations in Vdd and Temperature
- Effect of mismatch in each device on the
performance - Experiments on two different number of cells per
column namely 32 and 64 - Different components of energy dissipation
- Energy dissipated in bitlines, sense Amplifier
and due to leakage
38Time Line
39Conclusion
- Voltage-mode sense amplifiers performance
degrades with increasing bitline capacitance - Current-mode perform better than voltage-mode for
nominal case with increasing bitline capacitance - Leakage affects performance significantly for all
sense amplifiers - MDCSA is affected the most due to the performance
degradation of the current transporting unit (SFT
circuit) - Bitline leakage compensation is effective
- Does not fully compensate the leakage current
- Impact of variations on the delay of the C2IL
sense amplifier is significant
40References
- 1 A. Chandrakasan et. al., Design of
High-Performance Microprocessor Circuits, IEEE
Press 2001. - 2 E. Seevinck et. al. , Current Mode
Techniques for High-Speed VLSI Circuits with
Application to Current Mode Techniques for High
Speed VLSI Circuits with Application to Current
Sense Amplifier for CMOS SRAMs. , IEEE JSSC,
pp. 525-535, 1991. - 3 K.Agawa et. al. , A Bitline Leakage
Compensation Scheme for Low- Voltage SRAMs.,
IEEE JSSC, pp. 726-734, 2001. - 4 M. Sinha, Low-Voltage Sensing Techniques for
High-Speed On-chip Global Interconnects and
Caches. , MS Thesis, ICDG, University Of
Massachusetts Amherst. - 5 Y.Ye et. al. , A 6 Ghz 16 Kbytes L1 cache in
a 100nm dual Vt technology using a bitline
leakage reduction (BLR) technique, Symposium on
VLSI Circuits digest of technical papers, pp.
50-51, 2002. - 6 T. N. Blalock, and Richard C. Jaeger, "A
High- Speed Clamped Bit-Line Curent-Mode Sense
Amplifier," IEEE JSSC, pp. 542-548, 1991. - 7 Jan M. Rabaey, Digital Integrated Circuits
A design Perspective , Prentice Hall 1996.