Semiconductor/%20Polymer%20Integrated%20Fabrication%20Facility - PowerPoint PPT Presentation

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Semiconductor/%20Polymer%20Integrated%20Fabrication%20Facility

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Semiconductor Polymer Integrated Fabrication Facility – PowerPoint PPT presentation

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Title: Semiconductor/%20Polymer%20Integrated%20Fabrication%20Facility


1
Semiconductor/PolymerIntegratedFabricationFaci
lity
CLEANROOM
2
WHAT TO EXPECT(OUTLINE)
  • Why a cleanroom?
  • What is it?
  • Facilities
  • Procedures

3
WHY?
  • ITS A DIRTY WORLD!
  • UNCOUNTABLE PARTICLES IN AIR
  • ALL SIZES, SHAPES, PROPERTIES
  • NANOTECH
  • SMALLLLLLL
  • FRAGILE

4
WHATis a cleanroom?
  • A room, enclosure, and or environment in which
    you move the air by way of supply and return
    locations to control the airborne particle levels
    and in some cases temperature and humidity.
    Courtesy of http//www.mcr-1.com/definitions.html
  • A place where harmful junk is kept away from
    sensitive items or materials.

5
CLEANROOM CLASSIFICATION
Class limits maximum allowable particles per
cubic foot (SI/209) or meter (ISO)
ISO SI Fed Std 209 0.1 micron 0.2 micron 0.3 micron 0.5 micron 5 micron
3 M 1 1 100 35     35 1  
  M 1.5 1 35 7 3 1 0
  M 2 10 99.1     2.83  
4 M 2.5 10 10,000 345 75 30 352 10 0
  M 3 100 991     28.1  
5 M 3.5 100 100,000 3,450 750 300 3520 100 0
6 M 4.5 1,000 1,000,000 34,500 N/A N/A 35,200 1,000 7
7 M 5.5 10,000 345,000 N/A N/A 352,000 10,000 70
8 M 6.5 100,000 3,450,000 N/A N/A 3,520,000 100,000 700
Courtesy of http//www.mcr-1.com/class.html
6
CLEANROOM FACILITIES
Class 10,000 by airflow design Upgradable to
Class 1,000 Tested (empty) as Class 1,000 (780
actual counts)
2003 July 15
7
ENTRY INTO THE CLEAN WORLD
gtgtgt STOP ltltlt NO FOOD OR BEVERAGES BEYOND THIS
POINT
8
STAY ON THE MATS
PAST THIS POINT
9
SHOES OR BOOTIES
Booties
Shoes
Shoes
10
NOW YOU CROSS THE LINE
11
CHEMICAL PREPARATION
Acids
Solvents
12
THE CLEANROOM
13
THE GOWNING ROOM
  • Follow the sequence of bouffant (hairnet), shoe
    covers, gloves, and frock.
  • If you are only stepping out for a short time
    reuse the same items.
  • If you are carrying something into the cleanroom
    wipe it down with the presoaked wipes.
  • The reason for gowning is to expose a minimum of
    flaking skin, hair, etc. that could harm your
    work.

14
CLEANROOM ENTRANCE
15
GOWNING STEPS
REVERSE THE STEPS WHEN REMOVING THE APPAREL
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COMMON GOWNING ERRORS
  • Hair protruding from bouffant.
  • Ears not covered.
  • Open collar on frock.
  • Gloves rolled up and/or frock sleeves pulled back
    from gloves. The gloves should be fully extended
    up the forearms.
  • Once again, the reason for gowning is to expose a
    minimum of flaking skin, hair, etc. that could
    harm your work.

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25
WHITE ROOM
  • 4 Fume Hood
  • In process of obtaining additional equipment.
  • Reactive Ion Etcher
  • Deposition System(s)
  • Will be adding Emergency Eye Wash / Shower.

26
WHITE ROOM
Acid
27
YELLOW ROOM
  • Exhausted Laminar Flow Hood
  • Photolithography
  • Sink, Spinner, Hot Plate, Oven
  • ISO 5 (Class 100) environment
  • Vertical Laminar Flow Hood
  • MJB 3 Mask Aligner
  • Microscope
  • ISO 5 (Class 100) environment
  • If the room is occupied use the telephones
    intercomm from the White Room to verify its safe
    to open the door and enter.

28
YELLOW ROOM
29
PHOTOLITHOGRAPHY
Sink I
Contaminate Waste I
Spinner I
Oven
Hot Plate
30
HORIZONTAL LAMINAR HOOD
Microscope (No DIC) I
MJB 3 Mask Aligner I
OLD Mask Aligner I
31
MASK ALIGNER
MUST be trained before use
32
MICROSCOPE
MUST be trained before use
33
CHARACTERIZATION HALL
  • X-rays
  • Scintag XtrA XRD powder/low angle
  • Philips XRD High Resolution
  • Wiring Stations
  • Ball Bonder
  • Indium Soldering Station
  • Horizontal Laminar Flow Hood
  • pH
  • Anodization Station
  • Optical Tables (a work in progress)
  • Mid-IR Photoluminescence
  • C-V Analysis
  • Coming Soon
  • FIB
  • Hall Effect

34
X-RAYS
Scintag XtrA XRD
Philips XRD
35
WIRING STATIONS
Home Built Indium Soldering Station
MEI 1204B Ball Bonder
36
pH and ANODIZATION
Anodization I
pH I
37
SOME GENERAL INFO
  • You must be trained before using it unassisted.
  • Clean up and put away.
  • Leaving your work area in better condition than
    you found it is a good habit to develop.
  • If you have any doubts or questions, ASK.
  • Harm to you and / or equipment can result from
    improper procedures.
  • Using / operating available facilities /
    equipment is a privilege not a right.
  • Your privilege can be restricted or revoked if
    you refuse to follow accepted practices or rules.

38
Some Useful References
  • UCLA Nanoelectronics Research Facility
  • http//nanolab.ucla.edu/new_users.htm
  • http//nanolab.ucla.edu/pdf/Orient.ppt
  • University of California at Berkeley
  • http//microlab.berkeley.edu/
  • Georgia Tech
  • http//www.mirc.gatech.edu/facilities/
  • University of Alabama in Huntsville
  • http//www.licos.uah.edu/nmf.html
  • Cornell Nanofabrication Facility
  • http//www.cnf.cornell.edu/cnf/
  • http//www.cnf.cornell.edu/cnf/CNFSafetyManual8.ht
    ml
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