SNAP NIR Detector Packaging Development: Towards a Universal SiC Detector Package

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SNAP NIR Detector Packaging DevelopmentTowards
a Universal SiC Detector Package

• Bruce C. Bigelow
• Department of Physics, University of Michigan
• 28 July 2005

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SiC NIR Package Design Issues

• Neither NIR device vendor is producing a package
  we want to use for SNAP
• SiC is currently favored for SNAP focal plane
  components
• It would be useful to have a common NIR package
  design for both RSC and RVS detectors
• These designs shown here have the center of the
  sensor areas located at the center of the
  package, per the new detector ICD
• The Hypertronics connector is offset per the new
  ICD
• With the current connector IC, the Rockwell
  device exceeds the boundaries of the ICD volume
• Open questions
• Connector to PCB electrical interface (solder
  joint?, bottom or side of connector?)
• Connector to package mechanical interface (screw
  to package, not PCB)
• Add bolt holes to connector?

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Raytheon and Rockwell Univ. packages
Rockwell
Raytheon
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Raytheon and Rockwell Univ. packages
Aperture mask
Rockwell PCB sticks out
Raytheon
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SiC prototype pedestal
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SiC package design for quotations
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SiC coupon drawing for quotations