Title: Analytical Static Noise Margin characterization for SOI Ultra-Low-Voltage memory cell
1Analytical Static Noise Margin characterization
for SOI Ultra-Low-Voltage memory cell
FTFC2003
- Olivier THOMAS
- Amara AMARA
- Andrei VLADIMIRESCU
2Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
3Motivations
- The emergence of portable or mobile computing and
communication devices is the most important
factor driving the need for low power design. - The commercial success of such a product depends
on the battery life. - Some niche applications do not necessarily need
high performance. - ? Operation in Ultra-Low-Voltage is very
attractive for achieving significant energy
saving.
4Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
5Static noise disturbance presents in logic gates
- Cell stability is influenced by offsets and
mismatches due to processing and variations in
operating conditions - Width and length mismatches
- Threshold mismatches (non-uniformity of ion
implantation or gate oxide thickness) - Also there are 4 other basic types of noise
sources - Series-voltage noise in interconnection lines
between gates - induced by inductive coupling to a current
gradient di/dt - Charge coupling to inputs or outputs gates
- introduced by capacitive coupling to a voltage
gradient dV/dt - Ground and power-supply lines voltage noise
- caused by ringing, spikes, voltage drops due to
series resistances, etc. -
Considered as quasi-static if the interval time
in which the gradient is present is long compared
with the switching speed of the inverting gates
6SOI Transistors disturbance
Good isolation between devices
Less junction capacitance
DTMOS (Dynamic Threshold MOS)
Body Tied to Source
7SOI DC characterization in Ultra-Low-Voltage
- In U-L-V (VDD? VTH)
- Iii ltlt due to a weak E _at_ drain
8SOI TRAN characterization in Ultra-Low-Voltage
- VDD close to VT ? The threshold voltage strongly
depends on the coupling capacitance CG-B and
CD/S-B. - Voltage transfer characteristic of an Invertor
-
- I.C.
- --- VIN 1?0
- --- VIN 0?1
- Charge coupling to body
9Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
10Static Noise Margin (SNM) characterization
- The SNM of a SRAM memory cell is defined as the
minimum DC noise voltage (Vn) present at each of
the cell storage nodes (A and B) necessary to
flip the state of the cell to a wrong state. - The memory cell is more vulnerable during a read
access.
11SNM characterization criteria overview
- Maximum Square between normal and mirrored
voltage transfer characteristic. - Small-Signal Closed-Loop Gain is Unity.
- Jacobian of the Kirchhoff equations is Zero.
- Coincidence of Roots of the flip-flop equation.
- All of these criteria are equivalent
- The SRAM cell stability studies usually is based
on the Maximum Square method - J. LOHSTROH, E. SEEVINCK
12Maximum square method
- The SNM is obtained by drawing and mirroring the
inverter characteristics and finding the maximum
possible square between them. - The SNM value results as the smallest edge value
of the two squares.
13Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
14Subthreshold analytical model used
15VBS for floating-body transistor
- The equation was derived by curve fitting
- m1 and m2 are stored in a lookup table for
different transistor W. - m is a fitting constant
- The dependence of VBS on VGS in DC is not
significant - The resulting error is around 3.5 when m1 and m2
are extrapolated at VGS equal VDD/2
16Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
17Analytic estimation method of the stability
- The SNM estimator has been developed with MATLAB
- Methodology
- In retention mode, the floating body potential of
each transistor of the memory cell is computed
analytically. - In read mode, the VTC for each half cell is
derived taking into account the body potential
previously computed. In addition body voltage
variation induced by gate-body coupling is added. - Finally the SNM is extracted graphically by
considering the maximum possible square between
the normal and mirrored transfer characteristic.
18Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
19Simulation environment
- Technology SOI 0.25µm
- VT0N,P close to 0.6v
- 0.5 ? Wp/Wn ? 0.7 _at_ VDSVDD ?(VBS)
- Simulation condition VDD 0.4v
204T Self-Refresh SRAM cell
- Designed for Ultra-Low-Voltage
- 4T S-R architecture
- 2 FB NMOS access transistors
- 2 pDTMOS load transistors
- Low leakage current
- High drive current
21Stability in retention mode
- BLT BLC grounded to VSS
- WL maintained at 0V
- TL1 is ON
- TA1, TA2 TL2 are OFF
- Easy to maintain 1
- IonL1 gtgt IoffA1
- Level 0 depends on IA2 IL2
- IoffA2(VBS,VDS) IoffL2(VDS)
- If V(0) ? ? VBS(TA2), VDS(TA2) ? and VDS(TL2)
? - IoffA2 goes exponentialy up and IoffA2 becomes
higher than IoffL2 - Self refresh behavior
22Stability versus qWA/WL
- Stability depends on the ratio
- The error between the estimated and the simulated
curves is less than 3 for a ratio q larger than
1.5 - The higher the ratio q, the better the stability
23Stability in read mode
- VTC without considering the gate-body coupling
- Good fit between simulated and analytical results
- VTC with and without considering the gate-body
coupling - VTCs are degraded
- The SNM is affected deeply by the gate-body
coupling - For 250mV variation the SNM is divided by 2
- The higher the ratio q, worse the stability
This study shows that the ratio q must be
well-balanced versus retention and read mode
results
246T Full CMOS SRAM cell
- In retention mode
- BLT BLC grounded to VSS
- WL maintained at 0V
- VTCT and VTCC are not symmetrical
- In retention
- VSTA2 0v ? VBTA2 lt 0v ( -74mV)
- VSTA1 VDD ? VBTA1 gt 0v ( 315mV)
- In read mode VBS of TA2 becomes more and more
negative as V(B) increases, which preventing the
voltage to reach VDD.
25Stability in read mode
- VTC with and without considering the gate-body
coupling - VTCs are degraded
26Outline
- Motivations
- Static noise disturbance
- Static noise margin (SNM) characterization
- Electrical analytic model
- Analytic estimation method of the stability
- Stability analysis on a 4T Self-Refresh and a 6T
full CMOS SRAM cell - Conclusions
27Conclusions
- We have developed a simple analytical method to
evaluated the SNM of SRAM SOI memory cell working
in subthreshold. - This analytical method is based on a simple
analytical subthreshold estimation model. - This study shows the importance of the floating
body potential when analyzing the stability of
CMOS SOI memory cells. - Gate-to-body coupling for the access transistors
adds a new important constraint on the stability
when the word-line is activated. - For stability reasons the 6T floating-body memory
cell working in subthreshold requires small
ratios qWA/WL and rWA/WD. - For the 4T S-R cell a good stability is reached
for a high ratio qWA/WL.