Technical Competitive Analysis: Comparing HP and Canons market leading processes

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Technical Competitive Analysis Comparing HP and
Canons market leading processes

• Presented by
• St.J. Dixon-Warren,
• Technical Intelligence
• Chipworks Inc., Ottawa, Canada

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Who we are

• Chipworks is an reverse engineering (RE) services
  company, based in Ottawa, Canada, with offices
  around the world.
• Our Technical Intelligence business unit provides
  technical competitive analysis of leading edge
  semiconductor devices, allowing clients to
  benchmark their own processes and gain insight
  into their competitors technology.
• Our Patent Intelligence business unit provided
  technical intellectual property services.
• Visit http//www.chipworks.com/ for details.

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What is Technical Competitive Analysis?

• Technical information on your competitors
  offerings, allowing you to
• Benchmark your own technology in relation to a
  specific market space.
• Gain valuable insight into your competitors'
  technology, products and business practices.
• Discover competitor weaknesses which you can
  exploit as new revenue opportunities for
  yourself.
• Minimize risk by avoiding the mistakes that
  others have already made.
• Improve in-house training.

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Chipworks MEMS Process Reports (MPRs)

• Chipworks has completed 28 detailed MPRs on MEMS
  devices from a number of the major MEMS
  manufacturers, including 11 printhead reports
• Hewlett-Packard
• Canon
• Lexmark
• Kodak
• Also 17 reports on inertial sensors and
  microphones
• Analog Devices, Bosch, Invensense, Kionix,
  Freescale ST Microelectronics (accelerometers and
  gyroscopes)
• Texas instruments (digital micro-mirror device)
• Knowles Acoustic, Sonion, Akustica (microphones)

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MPR Contents

• Our MPRs are typically written as a narrative
  following the RE process from the outside to the
  inside of the device.
• The MEMS process review reports typically include
  the following information
• Package photographs and X-rays
• Photographs of the MEMS and ASIC dice.
• Detailed optical photographs of MEMS and ASIC
  dice features.
• Cross-sectional process analysis for the MEMS and
  ASIC, revealing details of the devices structure.
• Plan-view and tilt-view SEM images revealing
  details of the MEMS architecture.
• Optional information, included with some reports.
• Analysis of gases in MEMS cavity.
• TEM analysis of MEMS structures.

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Contents

• Printhead Market Overview
• Lithographic Process Overview
• HP-Canon Process Comparison
• Basic Structure and Die
• Ink Vias
• Power Transistors
• Heaters

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For the full Presentation

• Visit us at the Yole Developments MEMS Market
  Briefing held during Transducers in Lyon
  http//www.yole.fr/pagesAn/products/marketbriefing
  .asp
• Or
• Contact us at insidetechnology_at_chipworks.com