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Diamond Pixel Detector Developments in Bonn

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Fully bumped pixel single chips (2880 pixels) with radiation hard chip ... Module practice piece to develop bumping of a large CVD module in processing at ... – PowerPoint PPT presentation

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Title: Diamond Pixel Detector Developments in Bonn


1
Diamond Pixel Detector Developments in Bonn
  • Markus Mathes
  • University Bonn

N.Wermes, F. Hügging, J. Große-Knetter, J. Fink,
M. Keil, T. Lari
2
Diamond Pixels / Bonn
  • 2001/2002 UTS5 and CD91 single chip modules
  • First diamond pixel assemblies
  • Characterized in testbeam
  • Poor bumping yield
  • Not rad hard FrontEnd electronics chips
  • 2004 CD109, new bumped UTS5
  • Bumping improved
  • Fully bumped pixel single chips (2880 pixels)
    with radiation hard chip
  • Working in the lab
  • Ready for testbeam this spring/summer
  • Module practice piece to develop bumping of a
    large CVD module ? in processing at Fraunhofer
    IZM now
  • Full ATLAS type module with 16 FE chips, 46000
    pixels planned for summer 2004. Testbeam planned
    for 8/2004 (schedule tight)
  • Are ready for assembly of a single crystal
    diamond with an ATLAS-FE chip
  • Charge collection measurements (TCT setup) with
    single channel Si, CdTe (and diamonds) presently
    carried out.
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