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DPU PRESENTATION

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FACT: IFSI has got no funds from ASI after 2001, that has prevented attendance ... NO RE-FLOW SOLDERING IS FORESEEN: ALL HAND MADE SOLDERS (INCLUDING SMD) BY ESA ... – PowerPoint PPT presentation

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Title: DPU PRESENTATION


1
DPU PRESENTATION
  • R.Orfei S. Pezzuto
  • CNR- IFSI

2
FUNDING AND DELIVERY CRITICALITY
  • FACT IFSI has got no funds from ASI after 2001,
    that has prevented attendance at meetings,
    reviews, support during integrations
  • FACT the ASI-Carlo Gavazzi Space contract has
    been extended up to 31/01/2004
  • PREDICTION from now up to 31/01/2004 a new
    contract/addendum will be issued taking into
    account the PD4 items (e.g. the SW reset of the
    IEEE-1355 chip) the new contract/addendum will
    expire at the end of 2004
  • FACT the lack of funds, the stop of CGS
    activities (waiting for the PD4 ASI approval)
    and the present HW problems have driven a very
    critical DPU/ICU Herschel schedule

3
Design status (1/2)
  • During the AVM tests a random loss of the 1355
    links has been detected and investigations are in
    progress to identify the source of the problem
  • At present the IFSI unit is at CGS to carry out
    the investigation
  • The analysis (thanks also to CSL, IAC and MPE for
    their help!) has shown that consecutive
    addressing of the STD-1553 Dual Port RAM and of
    the IEEE-1355 Dual Port RAM causes the loss of
    the 1355 links. The HW is now suspect.
  • The design of the HW boards (contracted to Carlo
    Gavazzi Space) will be corrected in EQM and FM to
    include the necessary modifications resulting
    from the fixing of the above problem

4
DESIGN STATUS (2/2)
  • AVM SW nearly completed missing items
  • new OBCP and autonomy function (to be implemented
    when available)
  • patching
  • uploading of OBCP implemented but not tested
  • other types of patching not addressed
  • Burst mode implemented but not thoroughly tested
  • upgrading of the VIRTUOSO O.S. waiting for an
    offer from WIND RIVER
  • New OBS image uploadable with the BOOT SW

5
SW DOCUMENTATION
  • SSD is in progress, issue 1 should be available
    by the end of November (SW requirements inserted,
    logical model and architecture design revised)
  • DDD a new issue will be ready after the SW is
    stabilized
  • SVVP a new issue was circulated according to S.
    Thureys comments. Some comments require a new
    document layout and a new release will be issued
    asap in line with IFSI manpower

6
BUDGETS FOR FM (1/2)(ACTUAL MASS INFERRED FROM
AVM BOARDS)
  • Box weight (mechanics) 3037 g
  • CPU Boards (2 of) 960 g
  • I/F Boards (2 of) 640 g
  • DC/DC Boards (2 of) (E) 1000 g
  • Motherboard 520 g
  • Screws etc. 100 g
  • Cabling (E) 300 g
  • Conformal coating (E) 420 g
  • TOTAL (E) 6977 g (-200 g)

7
BOX INTERFACE CONTROL DRAWING
8
BUDGETS FOR FM (2/2)
TOTAL ESTIMATED POWER (DC/DC CONVERTER EFFICIENCY
70) 14.6 W
9
JTAG
DSP 21020
RAM
IEEE-1355
MEZZANINE
FPGA
EPROM
20 MHz
CPU BOARD
10
NOT FOR PACS
FIFOS
FIFOS
S/S I/Fs
A/D Conv.
16 MHz
1553B (S/C I/F)
Long Stub Trafos A and B
FPGA
I/F BOARD
11
DPU
12
AIV FLOW
13
EQM SCHEDULE (TENTATIVE)
14
FM SCHEDULE (TENTATIVE)
15
PA/QA ACTIVITIES
  • ALL COMPONENTS ARE BOUGHT THROUGH THE
    CO-ORDINATED PARTS PROCUREMENT AGENCY
  • FOR INDUCTORS AND TRANSFORMERS RELEVANT RFAs AND
    PADs ISSUED
  • NO RE-FLOW SOLDERING IS FORESEEN ALL HAND MADE
    SOLDERS (INCLUDING SMD) BY ESA QUALIFIED
    PERSONNEL
  • ENVIRONMENTAL QUALIFICATION TESTS ARE SCHEDULED
    FOR QM UNITS (A REDUCTION SET OF TESTS, ON THE
    GROUNDS OF SIMILARITY, IS UNDER EVALUATION)
  • ENVIRONMENTAL ACCEPTANCE TESTS ARE SCHEDULED FOR
    FM UNITS (A REDUCTION SET OF TESTS, ON THE
    GROUNDS OF SIMILARITY, IS UNDER EVALUATION)
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