Automated Accelerated Reliability Test Set

1
AARTS Training
Automated Accelerated Reliability Test
Set (AARTS) Training Seminar (20090915)
2
Agenda
1st Day Morning LifeTesting
Overview System Requirements Hardware
Overview Software Overview Afternoon User
Interface Description - RunTime Operation -
Configuring/Controlling Channels Live System
Operation
2nd Day Morning User Interface
Description - Calibration -
Summary Afternoon Live System Operation
3
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
4
Reliability Standards Resources
Life Test Standards and Reference Sources
Applied Reliability, Tobias and Trindade
- thorough treatment of reliability theory
JEDEC Pub JEP118 Guidelines for GaAs MMIC and
FET Life Testing - standards document
that most people follow for testing paradigm
JPL Pub 96-25 GaAs MMIC Reliability Assurance
Guidelines for Space Applications -
thorough description of failure mechanisms in
microwave devices, particularly for space apps
MIL-HDBK-217F Reliability Prediction of
Electronic Equipment - standard followed
to predict failure rates of systems/subsystems/MIC
assemblies - concepts accepted, but
failure-rate data questionable for microwave
devices
5
Reliability Testing
Why Accelerated Life Testing? - To prove
device reliability based on empirical
measurements - Cannot wait years for results
Acceleration Techniques - Stress (Bias) -
Stress (Channel Temperature) - Step Stress
Analysis Techniques - Maximum Likelihood
Estimate (MLE) - Linear Regression Techniques
- Graphical
Failure Models - Lognormal (well established
and easy to use) - Weibull (very flexible but
harder to use) - Exponential
6
Bathtub Curve for Failure Rates
7
JEP118 FET Testing Summary
3-Temperature Life Testing purpose to determine
activation energy for specific failure mechanism
- technique - at least 3 temps to avoid
2-point errors being extrapolated - highest
temp median lifetime gt 100 hrs - separate
temperatures by at least 15 ºC to minimize
statistical variation errors - if
lowest temp gt 200ºC, make one run of devices at
150ºC (or 50ºC above max rating) for
2000 hours to verify model validity -
low-noise and passive devices (DC only
acceptable) - general purpose and power (DC
RF required) - at least 50 total parts
taken to 70 failures - more parts at lower
temp, less at high preferable
Step Stress Testing purpose to determine
appropriate temperature start targets - needed
unless data from already known similar device
types known - technique - at least
6 parts - start at 150 ºC - 24-hours
per step - increment in 25 ºC steps -
stop when 50 failures occur - back off
20ºC for highest life test condition
Failure Criteria - constant drain and gate
voltage, monitor currents - must be same
failure mechanism in all parts - monitor
changes from initial values - Idss 20
- gate bias (as specified by manufacturer)
- transconductance 20 - RF small
signal gain 1 dB - PAE 20
(amplifiers only) - output P1dB -1 dB
(power devices only) - noise figure
0.5dB (low-noise devices only) - isolation
3 dB and less than 20 dB final isolation
(switches only) - switching time 100
(switches only) - insertion loss 1 dB
(switches only) - phase error 11º
(phase shifters only)
Hardware Requirements - DC, RF, and thermal
stimulus - continuous monitoring - maintain
constant channel temperature - fast shutdown
to prevent thermal runaway destruction
8
MIL-HDBK-217F Reliability Definitions
MTTF The mean time to failure (MTTF) is
defined as the measured operating time of a
single piece of equipment divided by the total
number of failures of the equipment. It is also
used to describe the mean life of a group of
devices failing without replacement. MTTF
varies as a function of time, which is difficult
to handle in probability prediction models.
Therefore, when determined from life test data
it is common to determine an average MTTF
proportional to the median life time (i.e. time
at which 50 failures occur). MTTFave T50
exp(s2 / 2). FIT The failure rate unit. FIT
stands for one failure in 109 hours. l
Failure Rate. It is usually given in KFIT
KiloFits, with 1 KFIT standing for one failure
at 106 hours. Like MTTF, l varies as a
function of time. When using life test data, a
common approximation for lave is 1/MTTFave. p
factor Failure Rate modifier. These are used
in the MIL-HDBK-217F models to account for a
variety of variables that affect failure rates,
such as the operating environment. The base
failure rate is usually multiplied by the p
factor to yield a more accurate prediction.
Instantaneous Failure Rate
where l(t) instantaneous failure rate f(t)
probability density function of the distribution
evaluated at time t R(t) reliability function,
the probability that no failures have occurred
before time t F(t) cumulative distribution
function of the lognormal distribution
9
Weibull Failure Rate Model
Probability Density Function
Cumulative PDF
Reliability
Failure Rate
Characteristic Life c
Shape Factor m
Determines shape of Weibull
Median Lifetime
Mode
Mean
Variance
10
Lognormal Failure Rate Model
Probability Density Function
Cumulative PDF
Reliability
Failure Rate
T50
median lifetime of 50 failure point
Shape parameter. Large s (?2) means high early
failure rate decreasing with time. Low s (?0.5)
means increasing (wearout) type failure rate and
a PDF with a normal shape. For s close to 1,
the failure rate is fairly flat.
s
If t f is lognormal with parameters (T50, s),
then X ln(t f) is normal withmean m ln(T50)
and a standard deviation s
Relation to normal
Mean
Variance
11
Lognormal Failure Rate Model
Extract T50 and Shape Factor from Failure Rate
Data at each Temperature
Standard Normal Variate
plot Failure Rate data and use linear regression
to get slope of Log(time) vs. normal scale
shape factor slope
T50 intercept
12
Arrhenius Acceleration Model
Extract Ea from Multiple Temperature T1, T50
Data
Activation Energy (Ea) slope k
13
Failure Rate Prediction
Calculate Failure Rate at Operating
Temperature from measured values
Temperature Relationships
new temp
new time
measured
14
Confidence Limits
15
Example of 20 Idss Failure Criteria
Change of Idss Degradation
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Example of Lognormal Distribution
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Example of T1 vs. 1/Temperature
Channel Temps
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Determine Lifetime for 1 Failure Rate at 125ºC
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Failure Rate vs. Operating Life
20
Practical Extraction Procedure
1. Determine 2 or 3 temperatures for test
conditions - needs to yield reasonable test
times - step stress if needed 2. Decide on
number of samples per temperature - at least 10
devices/temp (more at lower temps) - additional
devices better 3. Run until at least 70
failures occur - statistical variations yield
highest confidence around 50 failures - common
failure mechanism and parameter
required 4. Calculate T50 and Shape Factors at
Each Temperature - linear regression straight
line fit to log(time) vs. normal scale - shape
factor slope T50 intercept 5. Use T50s to
determine Activation Energy (Ea _at_ Tx) -
translate T50 data to Tx (desired failure
rate) - linear regression straight line fit to
log(time) vs. 1/T (all temp Txs) - apply
confidence limits to determine worst-case
T 6. Use equations to predict failure rates vs.
time - if more accuracy is required 7. Inject
measured values in MIL-HDBK-217 - higher number
of failures yields more accurate sigma
21
Effect of Temperature Error
10 degC error yields 4x error in Predicted Time
to Failure
22
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
23
Key Requirements
1. Continuous RF DC Monitoring 2. Auto-Storage
Rate Control - hard soft limits 3. Fast Bias
Shutdown on Failure 4. RF Stimulus - power -
bandwidth - dynamic range - automated RF level
control 5. Temperature Control - surface -
channel 6. Failsafe Testing - power outage -
redundant storage to mitigate computer crash -
minimize operator error
7. Operational Modes - manual - automated
startup - test sequencing 8. Special Testing -
Gain Compression - SPA tests -
calibration 9. Data Processing - export data -
graphical display - probability analysis
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Measured Parameters
1. DC Levels - voltage, current 2. RF Levels -
input, output, gain - frequency 3. Device
Temperatures - surface, channel,
stability 4. Value Changes - cumulative,
delta 5. Miscellaneous - room temp, gas pressure
25
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
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Automated Reliability Test Set
16-Channel RF System
96-Channel DC System
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Reliability Test Set Oven Assembly
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RF Test Set Fixture
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DC Test Set Fixtures
Device to Test
Single-Device RF-Ready DC Fixture
Dual-Device DC Fixture
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Functional Interconnects (non-Pulsed)
31
Functional Interconnects (Pulsed)
HCU Function in HCU Card
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Functional Interconnects (Pulsed)
HCU Function in Pulser
33
PCU Functional Block Diagram
Bias1 Drain/Collector 100V _at_ 3A (max 60W)
Bias2 Gate/Base 18.5V _at_ 150mA
Voltage or Current Source Modes
120V Supply
15/-15V Supply
28/-28V Supply
5V Supply
GPIB Interface
timing control
timing control
Switch Controls
Series Switch
Bias1 Switching Regulator
Current Sensor
Watchdog Timer
DUT Bias1 Force
Shunt Switch
FPGA
DACs
from FPGA
DUT Bias1 Sense
trip detectors
Bias1_I
Bias1_Vpre
Bias1_Vpost
Trip Level Comparators
to DMM
To FPGA
1 of 16 MUX
Bias2_Vpost
Trip Level Comparators
To FPGA
Bias2_Vpre
Bias2_I
DUT Bias2 Sense
Series Switch
Bias2 Linear Regulator
Current Sensor
DUT Bias2 Force
Shunt Switch
4 channels / card set 4 card sets / PCU
from FPGA
PCU
28/-28V
5V
15/-15V
34
Voltage Measurements
35
CVR Current Measurements
36
Fixture Pulser
Key Features 1. Supports RF/DC/Thermal
stimulus - Bias1 DC 0.5 - 100V _at_ 3A (60W
max) - Bias2 DC /-12V _at_ 0.15A -
Thermal 50C to 250C (subject to thermal
plate performance) 2. DC synchronized
pulsing (with control signal for future RF
pulsing) - Resolution 125ns - Pulse
Width 10ms to 10ms - Period 30ms to 10ms
- Duty Factor 0 to 100 - Rise/Fall Time
lt1ms (lt100pF load) 3. Semiconductor Parameter
Analyzer (SPA) support - on-board relays
switch Bias1 and Bias2 between two bias
input ports (e.g. PCU or SPA) - triax stops
at input to 37-pin D-Sub 4. USB 2.0
Controllable - utilizes Peripheral Interface
Controller (PIC) - on-board reconfigurable
programmable logic device generates
extremely accurate and repeatable control
signals 5. On-board heater controller supports
stand-alone temperature control 6. Four
differential ADC inputs for remote monitoring
- requires voltage scaling by user to /-2.5V
levels 7. On-board MUX allows routing internal
signals to external DVM for remote
monitoring 8. Four 3.3V CPLD control outputs can
be used for expanded control functionality
- default B1, B2, RF, and AC control signals
- any modification would require CPLD
customization note some of these additional
features are not yet fully tested or
integrated into the LifeTest software and will
not necessarily be fully functional in delivered
units
Lid Lock Switch
Bias/Sense Posts
USB port
Pulser Board
SMA RF Input
9-Pin D-Sub for routing signals externally
Gas Port
SMA RF Output
Optional Package Clamping Mechanism
Heated Block
? contains on-board PIC controller and FPGA
for flexible functionality expansion
37
Fixture Pulser Block Diagram
38
Bias1/Bias2 Pulsed-Bias Schematic
Bias1 (Drain)
Bias2 (Gate)
FETs must be High-Voltage Low Capacitance
10mF
150mF
Charge Storage based on load requirements
Charge Storage based on load requirements
1mF
1mF
High-Side Switch
High-Side Switch
DUT
5W Protection against capacitive loads
5W Protection against capacitive loads
Polyswitch - Protection against shorted Bias1 to
Bias2
Low-Side Switch
Low-Side Switch
FET control signals must dynamically float at
random supply voltage
Control Electronics
39
Pulse Period Limitations
Driving Capacitive Loads
Example 2510pf/21002 12.55e-6 coulombs
6.0e-6100kHz 1.255W
Energy C/2V2 Power Dissipated Energy
Rep_Rate
10mF
1mF
510pF
High-Side Switch
2W rated
Cload
2000pF
5W
Parasitic Circuit Capacitance
Low-Side Switch
40
Pulser (B2 Driver)
Pulsing to V-Pinchoff
41
Bias2 Connecting an External Supply (V-Pinchoff)
isolation resistor
(use MISC1 MISC2 through chamber sidewall)
ID Card
15-Pin D-Sub Socket
37-Pin D-Sub Plug
DUT 1
9-Pin D-Sub Plug
PS/SPA/MUX
Pin 7
100W
Pin 10
Pin 13
P3_VP
PCU_P2_GND
Pin 2
10mF
V-Pinchoff (e.g. -6V)
Pin 28
Pin 6
P3_GND
Pin 8
charge storage capacitor
Pin 3
9-Pin D-Sub Socket
RFU
PCU/HCU
Pin 7
Pin 19
25-Pin D-Sub Plug
isolation resistor
ID Card
15-Pin D-Sub Socket
37-Pin D-Sub Plug
DUT 2
9-Pin D-Sub Plug
PS/SPA/MUX
Pin 7
100W
Pin 10
Pin 13
P3_VP
PCU_P2_GND
Pin 2
10mF
Pin 28
Pin 6
P3_GND
Pin 8
charge storage capacitor
Pin 3
9-Pin D-Sub Socket
RFU
PCU/HCU
Pin 7
Pin 19
25-Pin D-Sub Plug
42
Pulse Timing Illustration
Gate/Drain/RF Pulsed
Period
RF
Bias2 Gate
0V
-1V
8V
Bias1 Drain
0V
All timing signals settability 125 ns DC rise
and fall times 100V/ms RF pulse rise and fall
times 1ms 10ms to 1s pulse period
t1
t2
t3
t4
t5
t6
B1OOFF
B2OOFF
RFOFF
RFON
B2ON
B1ON
43
Pulse Timing Illustration (V-Pinchoff)
Gate/RF Pulsed Drain Fixed
Period
RF
-1V
Bias2 Gate
-8V
V-Pinchoff
Bias1 Drain
8V
t1
t2
t3
t4
t5
Possibly required for high power devices that
require large bypass capacitance to stabilize
device
44
Pulse Timing Illustration (MEMS)
Bias1 (Actuator) Pulsed w/ Blanking Bias2/RF
Pulsed for Stress
Period
RF
500ns
500ns
100V
Bias1 Actuator
0V
8V
Bias2 Stress
0V
Mitigates MEMS Switch Bounce
t1
t5
t6
t7
t8
t3
t9
t11
t2
t4
t10
B1A_OFF
B1B_OFF
B2OOFF
B1A_ON
B1B_ON
B1OOFF
B1ON
RFOFF
B2ON
RFON
45
Halt-Pulse Timing Illustration
Gate/Drain/RF Pulsed Halted
Period
RF
Bias2 Gate
0V
-1V
8V
Bias1 Drain
0V
Halt Signal
tHalt
t1
t2
t3
t4
t5
t6
tHalt
Halt Occurs on Next Full Cycle following Halt
Signal Active
HALT_TIME
46
Example Pulse Configuration
Minimum Pulse Width (Per10usec)
On Time
Off Time
Define On Time Off Time Period
Load Capacitance
B1F
B2F
RF Control
Period
47
HCUCard Functional Block Diagram
Temperature Control Loop 50C to 250C
Channel or Surface Temp Control
48
HCU Pulser Functional Block Diagram
Temperature Control Loop 45C to 250C
Dual-Loop (cooling heater) Channel or
Surface Temp Control
49
RFU Functional Block Diagram
Frequency Bands - 600MHz to 3GHz - 900MHz to
10GHz - 2GHz to 18GHz
Power Levels - up to 5W at DUT - 20dB DR
50
Split-VCO RFU Functional Block Diagram
Power Levels - up to 5W at DUT - 20dB DR
Frequency Bands - custom
51
Key Hardware Limitations
1. RF Bandwidth 2. RF Drive Levels -
Pout/Pin - Dynamic Range PM head levels
optimum between -20dBm and 15dBm.
Power at PM heads should be 3 dBm
nominally to maximize DR. 3. DUT Current,
Voltage, and Power
52
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
53
Sequence of Events
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
54
AutoStart Paradigm
Start Mode Set AutoStart Temp Pre-RF DC
Levels Set RF Frequency Set RF Power (DUT
Input or Output) Set Post-RF DC Levels
Measure Channel Set Temp Cycle Mode
Set Post-RF DC Levels Set RF Frequency
Set RF Power (DUT Input or Output) Set Temp
order selectable
55
AutoStart Paradigm Timeline
temp stabilized
Temp
time check window (default 5 min)
temp stabilization error window (default /-1
deg C)
within 3degC of target
Time
t1
t2
Set Final Temp
Set AutoStart Temp
Reset Temp
Reset Temp
Reset Temp
Reset Temp
Reset Temp
Include Pre-RF Levels true Include RF Levels
true Include Post-RF DC Levels
true Temperature Tracking auto RF Startup
Paradigm initial Bias Startup Paradigm
initial Temp Control Point channel
Set Pre-RF DC Levels
Set RF Levels
Set Post-RF DC Levels
56
Set Levels Iteration Paradigm
Applies to RF Frequency, RF Power Level
Bias1 Bias2 Voltage and Current Active Bias
Control Parameters Timeout Absolute Error
Amount (voltage or current)
Note must meet Absolute Error Amount
57
Hard Soft Limits
1. Hard Limits - limits that cause test to be
terminated such as min. or max.
current, voltage, RF level, etc. -
voltage current expressed magnitude - RF
levels expressed in dB(m)
2. Soft Limits - limits that cause data to be
stored more rapidly such as delta
changes in current, voltage, RF level,
etc. - voltage current expressed in
change - dB values expressed in dB change
58
AutoSequence Paradigm
Sequencing SPA, Gain Compression, and Stress tests
59
AS with Multiple Devices per Heater
Sequencing Limitations - all common channels
must be at same AS point to change move on
AS Step
Wait for Buddy Channels to Complete
Wait for Temp Stabilization
GC Test
CH1
All Channels Synchronized Next AS Step
Step 4
CH2
CH3
Stress Test
Step 3
SPA Test
Step 2
Time
CH3 Finished
CH2 Finished
CH1 Finished
CH3 Finished
CH2 Finished
CH1 Finished
60
Data Acquisition Process
Manual Setup Control
Run Time Control
Manual Control - DC, RF, temp - activate
channel
Bias Stimulus - power issues, V/I range -
bias sequencing - fast shutdown protection -
source modes - SPA sweeps
Temp Stimulus - surface vs. channel - dynamic
range - thermal time constants
AutoStart Control - DC, RF, temp - activate
channel
Pre-RF DC
Post-RF DC
RF
Temp
Temp Stab
Time
AutoSequence - SPA sweeps, GC sweeps, Stress
- step Stress, multiple stimulus
Temp
RF Stimulus - frequency - DUT power level -
dynamic range for GC sweeps
Stress
225
GC
150
SPA
100
Time
61
Step Stress Testing
Reasons for Step Stress
1. Determine appropriate Stress temps - JEP118
2. Accelerate Accelerated Life Tests - dynamic
modeling
AutoStart Control - unique DC, RF, temp -
active bias -gt independent
62
LifeTest Monitor Control Paradigms
63
Multiple Run-Time Paradigms
email notification
SPA SS files
Process
SPA Sweep
SPA TX files
SPA TX files
Gain Compression
AutoSequence
GC files
Auto Bias
Activate Channel
Stress Data
Auto RF
AutoStart
Analyze Results
Set Temp
Manual Control
Activation Energy
64
AutoSequence Definition
65
AutoSequence Log File
66
Plot of AutoSequence Log File
67
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
68
Main Menu Form
69
Main Menu Options
70
Help Screens
F1 Context Sensistive Help
71
Control Test Stimulus
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
72
Channel Control Edit Levels
Configurator View
73
Channel Control Edit Levels (cont)
Configurator View
74
DC Stimulus Edit Levels (cont)
DC Levels View
75
Fixture Pulser Control
76
Channel Control Edit Levels (cont)
77
Iteration Control
78
Configuring Channels
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
79
Configuring Channels Edit Limits
set Hard/Soft limits for all channels
80
Add Multiple Channels
Note Folder Names will be generated
automatically by appending Format String to
default name
81
Configuring Channels Edit Limits
only parameters visible in Edit Limits are
checked for Hard/Soft limits
(Note Use Edit Order to define visible columns)
82
Edit Header
83
Header Variables
The following describes the entries that are
always editable   1) DUT Model Number
2) DUT Serial Number 3) Data Save Interval
4) Channel Number 5) Channel
Status     The following describes the entries
that are only initially editable   6)
Storage File 7) TJC Model Type 8)
Constant Coefficient 9) Temp Control Point
84
Test Sequences
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
85
Test Sequence Creation
86
Test Sequence Definition
Available Controls
While Not Failed While the channel is not
failed, the system continues to run the test if
it fails the test will stop the channel will be
shut down. No variable can be entered. Stress
Test This is the temperature stress LifeTest
for the channel. The "Condition Variable"
represents the time duration of the LifeTest
in standard time format DDD HHMMSS. must
Enter Test Duration For i 1 to LoopCount
This condition causes the system to loop a number
of times through the enclosed user-defined test
sequences, starting at 1 and incrementing by
one. Each time through the loop, the body of the
condition will be executed. must Enter Loop
Count AutoSequenceNotification send
emails at specified points SPA Test Definitions
created in SPA Control Form must Enter Test
Temperature Gain Compression Test Definitions
created in Gain Compression Form must
Enter Test Temperature Process Definitions
extract data and email
87
LifeTest Monitoring
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
88
LifeTest Monitor Control Paradigms
89
LifeTest Monitor Grid Display
Startup Mode
90
Monitor Grid Menu Options
91
LifeTest Monitor Grid Display
Running Mode
92
LifeTest Monitor Color Codes
93
Pulling Control (Edit Levels Monitor)
only one can have control of a channel at any
one time
Edit Levels
Monitor
94
Single Channel Display
95
Edit Order
96
Edit Order Load/Save Configuration
97
Break Point
Good place to go to the Lab and See Overview of
System
98
Plot Data Utility
place labels by Double-Clicking near point of
interest
99
Plot Sequence, SPA, GC Files
100
User Accounts (email notification)
101
Email Log Viewer
102
View System Log File
103
System Setup Low Level Controls
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
104
Edit System Form
105
PCU Control Form
106
HCU Control Form
107
RFU Control Form
108
SMU Control Form
109
SPA Control Form (Standard Supply)
110
SPA Control Form (Staircase Sweep)
111
SPA Control Form (Transistor Sweep)
112
SPA Transistor Sweep Plot
113
SPA Token Passing Option
.TOKEN output file created by program
Test Definition Filename N/A Channel 1 Main
Storage Location C\LIFE\DATA\HBT\GRP1\200C\_200
80202_CH01 Backup Storage Location
C\LIFE\BACK\HBT\GRP1\200C\_20080202_CH01 Date
2/2/2008 25225 PM ElapsedTime 000 230000
Temperature 0 Delimiter Output
Filename C\LIFE\DATA\HBT\GRP1\200C\_20080202_CH
01\.dumSPAData.xls BiasSequence 0 ActiveBias
No ControllingSource Bias1 MeasurementType
StaircaseSweep Bias1SourceModule
SMU Bias1SourceMode Voltage Bias1Target
3.000000E00 Bias1Compliance 1.000000E-01 Bias1P
owerCompliance 2.000000E-01 Bias1StartTarget
0.000000E00 Bias1StopTarget 3.500000E00 Bias1B
aseTarget 0.000000E00 Bias1HoldTime
0.000000E00 Bias1DelayTime 0.000000E00 Bias1Pu
lseWidth 1.000000E-03 Bias1PulsePeriod
1.000000E-02 Bias1NumSteps 36 Bias1MeasurementMo
de 1 Bias1Range Auto Bias1SweepMode
Single Bias1IncrementMode Linear Bias1Step
1.000000E-01
Bias2SourceModule SMU Bias2SourceMode
Constant V Bias2Target -2.000000E00 Bias2Compli
ance 1.000000E-01 Bias2PowerCompliance
1.000000E-01 Bias2StartTarget
0.000000E00 Bias2StopTarget 3.000000E00 Bias2B
aseTarget 0.000000E00 Bias2HoldTime
0.000000E00 Bias2DelayTime 0.000000E00 Bias2Pu
lseWidth 1.000000E-03 Bias2PulsePeriod
1.000000E-02 Bias2NumSteps 1 Bias2MeasurementMod
e 1 Bias2Range Auto Bias2SweepMode
Single Bias2IncrementMode Linear Bias2Step
5.000000E-05 Title Transistor
Sweep controllingVar IBias2 xVar VBias1 yVar
IBias1 VBias1Label VDD VBias2Label
VB IBias1Label IDSS IBias2Label
IB IntegrationType MED IntegrationValue
1.000000E00
.TOKEN input file modified by external app
Output Filename C\LIFE\DATA\HBT\GRP1\200C\_2008
0202_CH01\.dumSPAData.xls
114
System Calibration
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
115
RF Calibration
116
RF Cal1
117
RF Cal2
118
VCO Calibration
119
Typical VCO Calibration Curves
120
VGA Calibration
121
Typical VGA Calibration Curve
122
Current / Voltage Calibration
123
PCU Calibration
Voltage and Current Cal Factors
- Voltage, Current
124
PCU Calibration
Voltage and Current DAC Cal Factors
- Voltage, Current - OverVoltage, UnderVoltage,
OverCurrent, UnderCurrent
125
Typical Bias DAC Transfer Curve
(Bias2 Voltage)
126
Typical Bias DAC Transfer Curve
(Bias2 Current Offsets)
127
Thermocouple Calibration
128
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
129
Analyze Results
Setup System Parameters
Calibrate (RF, DC, Temp)
Configure Channels Edit Limits
LifeTest Monitor
Edit Levels
AutoStart
Setup Test Sequence
Analyze Results
AutoSequence
130
Analyzing Results
Typical Run with Stress, SPA, and GC Sweeps (15
devices _at_ 220ºC)
131
Analyzing Data
GOG Group Results Filename
Probability Analysis
GOG (Group of Groups)
GOG Results Folder Location
Arrhenius Lognormal Weibull Exponential
Library (LIBRARY\GROUP)
G1
G2
Gn
Arrhenius Calculator
Group Results Filename
Source Folders
Group
Group/Analysis Results Folder Location
Failure Rates Confident Limits
Library (LIBRARY\GROUP)
An
Pn
A1
P1
Analysis Results Filename
Plot Utility
Analysis
Plot
Library (LIBRARY\ANALYSIS)
Library (LIBRARY\PLOT)
132
Analyze Folder Results
133
Analysis Definition
134
Analysis SPA Extraction Controls
135
Analysis GC Stress Extraction Controls
136
Analysis Failure Criteria
Click on Fail Command Button
Example
137
Equation Parameters
Operators
ARF Labels
138
Example of 20 Idss Failure Criteria
Change of Idss Degradation
139
Plot Definition
140
Lognormal Plot Definition
141
Lognormal Plot Example
142
Arrhenius Plot Definition
143
Arrhenius Plot Example
144
Group Definition
145
Source Folder Selector
146
Results Control
147
Probability Control
148
SPA Sweep Data Extraction
149
Running Analyses
150
3-Temperature Test Results
151
Arrhenius Plots
152
Arrhenius Calculator
153
Data Editor
154
Data Extractor
note that is multiple files are selected this
becomes the directory where the output files will
be placed - if a fully qualified pathname is
present, all files will be output to a common
location
155
Data Extractor Output File Example
156
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
157
File Structures - Test Set Status Codes
Status Codes
UPS Status (0)Problem
(1)OK   GasStatus (0)Problem
(1)OK   RunStatus (0) Nothing
Running (1) All
Running (2) Partial
Running (3) Power
Failure Shutdown (4)
Pause  
158
File Structures - Data File
First Record of Data File
Type ChannelHeader DUTModel As String 15
DUTSN As String 15 LastRecordNum As Long
SaveIntv As String 25 TempCtrl As String
4 TJCModel As Integer TJCCoef1 As Single
TJCCoef2 As Single TJCCoef3 As Single
TJCCoef4 As Single TJCCoef5 As Single End Type
159
File Structures - Data File
Remaining Records of Data File
160
File Structures - Data File Status Codes
Status Codes
(0) Initialized (1) Running - OK (2)
Stopped - Power Failure Shutdown (3) Stopped -
Manual Shutdown (4) Running - Glitch
Detected (5) Stopped - Hard Failure (6)
Running - Accelerated Storage (7) Paused (8)
Restart (9) Thermal Runaway (10) Edit Limit
Changes (11) Ignored Termination Reset (12)
DC Level Set Shutdown (13) RF Level Set
Shutdown  
161
File Structures - SPA SS Sweeps
SPA Staircase Sweep Data File Version
1 Created 12/14/2005 10700 AM Definition
Filename C\LIFE\CONFIG\LIBRARY\SPA\demo SS
Sweep.SPA Temperature 100.0 degC Elapsed Time
001 124130 36.6916666666667 Hrs Channel
2 Controlling source Bias2 Bias1 Source Mode
Constant V Bias2 Source Mode Current Title
Transistor Sweep ControllingVar IBias2 xVar
IBias2 yVar IBias1 VBias1Label
VC VBias2Label VB IBias1Label
IC IBias2Label IB Delimiter HTab
SPA Data Starts Here VBias1 VBias2 IBias1 I
Bias2 5.0000002E-04 1.1641810E-02 1.5648166E-04 5.
3948618E-04 5.0000002E-04 2.5283042E-02 5.0081429
E-04 7.9503225E-04 5.0000002E-04 4.4148576E-02 1.
1556006E-03 1.0505783E-03 5.0000002E-04 6.8238412
E-02 2.2206294E-03 1.3061244E-03 5.0000002E-04 9.
7552550E-02 3.7956893E-03 1.5616704E-03 5.0000002
E-04 1.3209099E-01 5.9805690E-03 1.8172165E-03 5.
0000002E-04 1.7185375E-01 8.8750587E-03 2.0727627E
-03
162
File Structures - SPA TX Sweeps
SPA Transistor Sweep Data File Version
1 Created 12/14/2005 44203 AM Definition
Filename C\LIFE\CONFIG\LIBRARY\SPA\demo TX
Sweep.SPA Temperature 100.0 degC Elapsed Time
007 070440 175.077777777778 Hrs Channel
2 Controlling Source Bias2 Bias1 Source Mode
Voltage Bias2 Source Mode Voltage Title
Transistor Sweep ControllingVar VBias2 xVar
VBias1 yVar IBias1 VBias1Label
VC VBias2Label VB IBias1Label
IC IBias2Label IB Delimiter HTab
SPA Data Starts Here VC IC_1 IC_2 IC_3 VB_1
VB_2 VB_3 1.0000E-01 6.3709E-02 1.2742E-01 1.
9113E-01 5.0000E-04 1.6250E-03 2.7500E-03 2.63
33E-01 1.5499E-01 3.0999E-01 4.6498E-01 5.0000
E-04 1.6250E-03 2.7500E-03 4.2667E-01 2.3252E-
01 4.6504E-01 6.9757E-01 5.0000E-04 1.6250E-03
2.7500E-03 5.9000E-01 2.9837E-01 5.9673E-01
8.9510E-01 5.0000E-04 1.6250E-03 2.7500E-03 7.
5333E-01 3.5429E-01 7.0858E-01 1.0629E00 5.00
00E-04 1.6250E-03 2.7500E-03 9.1667E-01 4.0179
E-01 8.0357E-01 1.2054E00 5.0000E-04 1.6250E-
03 2.7500E-03 1.0800E00 4.4213E-01 8.8425E-01
1.3264E00 5.0000E-04 1.6250E-03 2.7500E-03
163
File Structures - GC Sweeps
Gain Compression Data File Version
1 Created 12/14/2005 10636 AM Definition
Filename C\LIFE\CONFIG\LIBRARY\GC\demo GC
Sweep.GC Temperature 100.0 degC Elapsed Time
001 124130 36.6916666666667 Hrs Channel
2 Frequency 1.500E03 MHz RF Control Point
input Start Power -5.000 dBm Stop Power
15.000 dBm Number of Steps 21 Minimum PM
Power -40.000 dBm delimiter HTab Gain
Compression Data Starts Here Input
Power Output Power Gain VBias1 IBias1 VBias2 IBias
2 PAE (dBm) (dBm) (dB) (V) (A) (V) (A) () -5.0000
00E00 4.985225E00 9.985225E00 5.000000E-01 1.00
0000E-01 2.000000E-01 1.000000E-02 5.473173E00 -4
.000000E00 5.985225E00 9.985225E00 5.000000E-01
1.000000E-01 2.000000E-01 1.000000E-02 6.890316E
00 -3.000000E00 6.985225E00 9.985226E00 5.00000
0E-01 1.000000E-01 2.000000E-01 1.000000E-02 8.674
395E00 -2.000000E00 7.985225E00 9.985225E00 5.
000000E-01 1.000000E-01 2.000000E-01 1.000000E-02
1.092042E01 -1.000000E00 8.985225E00 9.985225E
00 5.000000E-01 1.000000E-01 2.000000E-01 1.000000
E-02 1.374799E01 0.000000E00 9.985224E00 9.9852
24E00 5.000000E-01 1.000000E-01 2.000000E-01 1.00
0000E-02 1.730769E01 1.000000E00 1.098522E01 9.
985222E00 5.000000E-01 1.000000E-01 2.000000E-01
1.000000E-02 2.178908E01 2.000000E00 1.198522E0
1 9.985216E00 5.000000E-01 1.000000E-01 2.000000E
-01 1.000000E-02 2.743078E01 3.000000E00 1.29852
0E01 9.985200E00 5.000000E-01 1.000000E-01 2.000
000E-01 1.000000E-02 3.453317E01
164
File Locations
165
DEMO.TXT File Structure
Demo Flag File 1 Demo (simulate hardware) 0
No Demo (use hardware) File Demonstration
0 Frequency Counter Demo 0 Power Meter Demo
0 Digital Multimeter Demo 0 Temperature Demo
0 Gas Pressure Demo 0 Voltage Demo 0 Current
Demo 0 Power Control Unit (PCU) Demo 0 Heater
Control Unit (HCU) Demo 0 RF Distribution Unit
(RFU) Demo 0 Switch Matrix Unit SMU) Demo
0 Load Box Demo 0 Load Box Voltage Meter Demo
0 Load Box Current Meter Demo 0 SPA Demo 0
GPIB Card 0 Demo 0 GPIB Card 1 Demo 1 GPIB
Card 2 Demo 1 GPIB Card 3 Demo 1 GPIB Card 4
Demo 1 GPIB Card 5 Demo 1 GPIB Card 6 Demo 1
166
Outline
1. LifeTesting Overview 2. System
Requirements 3. Hardware Overview 4. Software
Overview 5. User Interface Description 6.
Analysis Tools 7. File Structures 8. Summary
167
Acquisition Through Analysis
Data Acquisition
Data Analysis
168
Summary of Salient Features
1. RF Distribution Unit - automated RF level
control - automatic frequency control -
automated compression testing - SSPA to 1W _at_
DUT 2. Power Control Unit - Bias 1 0.5 to
100V _at_ 3A, max 60W - Bias 2 -18 to 18 _at_ 150
mA - automatic level control - voltage and
current source - fast hardware shutdown on
overcurrent/overvoltage 3. Heater Control
Unit - temperature resolution and performance -
surface- and channel-temp control 4. SPA
Integration - Agilent 4142, 4155, 5270
capability 5. Software - AutoStart /
AutoSequence - network email capability 6.
Aggregate Reliability Analysis - failure
extraction - model fitting - failure
prediction