TEM/TPS%20MRR%20Part%202

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TEM/TPS MRR Part 2
GLAST Large Area Telescope B. Estey,
Production SLAC esteyb_at_slac.stanford.edu (650)
926-8531
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Parts, Materials, and Processes

• EEE Parts
• All EEE parts have been approved for use by the
  Program Parts Board
• Status of TEM Parts Qualification (highlighted
  yellow itemspart approved, not in use)

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Parts, Materials, and Processes

• EEE Parts
• Status of TEM Parts Qualification , contd
  (highlighted yellow itemspart approved, not in
  use)

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Parts, Materials, and Processes

• EEE Parts, contd
• Status of TPS Parts Qualification (highlighted
  yellow itemspart approved, not in use)

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Parts, Materials, and Processes

• EEE Parts, contd
• Status of TPS Parts Qualification, contd
  (highlighted yellow itemspart approved, not in
  use)

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Parts, Materials, and Processes

• EEE Parts, contd
• Status of TPS Parts Qualification, contd
  (highlighted yellow itemspart approved, not in
  use)

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Parts, Materials, and Processes

• Materials
• All Materials have been approved by the Program
  MPRB in accordance with LAT-SS-00107, LAT
  Mechanical Parts Plan
• GLAST/LAT Material Usage Agreement 002 (MAR DID
  No. 313 LAT Document LAT-TD-04756-01)-
  Approved 9/13/04
• Processes
• All processes have been reviewed and approved by
  the Program MPRB in accordance with LAT-SS-00107,
  LAT Mechanical Parts Plan

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Procurement Status

• Assembly Subcontractor
• GTC Corp. was awarded the contract to provide the
  assembly service and some environmental testing
  for all levels of the TEM/TPS (Reference
  LAT-PS-03078, SOW LAT TPS and LAT-PS-02615, SOW
  LAT TEM)
• GTC Corp. is located in Albuquerque, New Mexico
• EEE Parts
• All EEE parts are SLAC furnished and have been
  procured for the TEM and TPS
• Outstanding receipt of Novacap Capacitors
  expected 9/16/04
• Part no. 1210B563K251YHTM
• Outstanding receipt of balance of tantalum
  capacitors expected 9/20/04
• Part nos. CWR11FH475KDB and CWR11FH105KDB
• Metal Fab Parts and Fasteners
• All Metal Fab parts and Fasteners are SLAC
  furnished and have been procured for the TEM and
  TPS
• Outstanding receipt of TPS Box Bases,
  LAT-DS-00995 expected 9/16/04
• Outstanding receipt of TEM Connector Plates,
  LAT-DS-01026, expected 9/17/04
• Outstanding receipt of balance of Heat Sinks,
  TPS, LAT-DS-04101, expected 9/24/04
• Outstanding receipt of balance of Cable Harness
  Support, TPS, LAT-DS-03598, expected 9/24/04
• PWBs
• The PWBs for TEM and TPS are SLAC furnished and
  have been contracted to DDI
• Fabrication complete on Qual 2, balance of PWBs
  to be fabricated pending successful data review
  of TEM and TPS Module performance

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Procurement Status

• FPGA Programming
• Programming of the FPGAs has been contracted to
  ACTEL
• Programming complete on Qual 2, balance of
  FPGAs to be programmed pending successful data
  review of TEM and TPS Module performance
• Materials
• Assembly materials are furnished by GTC Corp. in
  accordance with drawing requirements (adhesives,
  conformal coating, wire, primer, etc.)

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Manufacturing Facilites

• Assembly contract has been awarded to General
  Technology Corporation, located in Albuquerque,
  New Mexico
• Capabilities Overview
• DS/Multilayer PC Boards assembled to Mil-Spec
• Thru-hole and Surface Mount Technology (SMT)
• Electro/mechanical Assembly
• Cables and Harnessing
• Conformal Coating
• Testing (Including ESS)
• Facilities Overview
• 72,000 ft2 Custom Built Manufacturing Facility
• TEM/TPS assembly and test to be performed in an
  environmentally controlled area with monitoring
  capabilities for temperature and relative
  humidity
• Facility complies with the ESD control
  requirements specified in ANSI/ESD 20.20-1999
• Manufacturing
• Engineering
• Test
• Stockroom
• Administration
• Certifications
• GTC performs to the intent of the following
  certifications assuring quality assembly

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Manufacturing Process Flow- GTC

• Materials notes
• Receiving inspection will be performed on all
  materials supplied by the customer using
  documents supplied
• All discrepancies shall be documented and relayed
  to the customer in 24 hours from their discovery
• All moisture sensitive materials used in the
  manufacturing of the TEM will be stored and
  handled in accordance with GTC-2025A -Moisture
  Sensitive Component Handling, Use of Dry Room
  Storage.
• Materials issued in the production of TEM/TPS for
  assembly will be traced in a manner that would
  enable traceability from the assy S/N to the
  individual part /piece and production lot/date
  code.
• Every TEM and TPS assembly will have its own
  traveler issued to facilitate traceability of IC
  serial numbers installed on that particular CCA.

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Manufacturing Process Flow-GTC

• Materials

Inspect
Receive KIT
Not OK
Contact SLAC/ Resolve issue
OK
Clean and bake PCB
Issue Kit To prod.
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Manufacturing Process Flow-GTC

• SMT area notes
• Operators will record all IC serial numbers and
  location at which they are installed on a
  particular CAA for traceability purposes. All
  ICs used in the production of TEM assemblies are
  serialized.
• Operators will inspect and measure the solder
  paste height on every print at 3 predetermined
  locations. The results will be recorded in the
  SMT printer log along w the printing parameters

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Manufacturing Process Flow-GTC
Inspect/ Measure

• SMT Production Area

Set Up PP and SP
Screen print Solder side
Inspect Kit
OK
Not OK
Clean
1st art. Inspection
PP all SMT components
Inspect
OK
Reflow
Contact SLAC Correct root cause
Not Ok
ok
Clean
Not OK
Touch up
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Manufacturing Process Flow-GTC

• Second Operations

Inspect
Install connectors
Solder connectors
OK
Not OK
Touch up
Clean
Contact SLAC MRB
Move to test
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Manufacturing Process Flow-GTC

• CCA Test

Pass
Pass
Stake HW components Touch-up
Functional test
Fail
ICT Top/Bt
Fail
Touch up
Contact SLAC MRB
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Manufacturing Process Flow-GTC

• Module assy/conformal coating/thermal cycling

CCA level Thermal cycling
No
Touch up Conformal coat
Contact SLAC MRB
Functional test
OK
Apply Kapton to Back side of CCA
Inspect
Conformal coat.
Apply thermal Adhesive And mount CCA in Chassis
base
Move to next op.
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Manufacturing Process Flow-GTC

• Module Level Test

Vacuum de-gas Adhesive cure
Install chassis Top cover
Inspect
ok
Stake HW
Functional test
Module Assy level Thermal Cycling
no
Contact SLAC MRB
Functional test
Move to next op.
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Manufacturing Process Flow-GTC

• Top assembly/final test/final inspection

Assemble TEM/TPS
Stake HW
Functional Test
Top Assy level Thermal Cycling
Source inspection EIDP review
Vibration test
Functional test
Final functional test
Pack ship to SLAC
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Configuration Management

• Required changes to documentation during the
  manufacturing phase at GTC will be immediately
  documented on an NCMR and forwarded to SLAC for
  disposition
• All outstanding changes to documents will be
  incorporated and a new revision released into LAT
  DOCs prior to final inspection at each
  manufacturing level (CCA, Module, Top Assembly)

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Configuration Management

• All change notices will include full disposition
  of hardware

Disposition of Hardware
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GTC Test Requirements
Figure 1. Vibration Levels, Duration, and Spectra
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GTC Qualification and Acceptance Test Matrix
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Production Schedule
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Production Schedule
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Production Schedule
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Issues/Concerns

• Actel FPGAs pose a reliability concern
• Maxim 724 is rated at 2.6-32.0V, we are biasing
  to operating at 1.5V. Parts were not screened for
  this application, PCB reviewing screening
  requirements.